Patents by Inventor Ya-Chen SHIH

Ya-Chen SHIH has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Device assembly structure and method of manufacturing the same
    Patent number: 11189604
    Abstract: A device assembly structure includes a first device and at least one second device. The first device has a first active surface and a first backside surface opposite to the first active surface, and includes a plurality of first electrical contacts disposed adjacent to the first active surface. The second device has a second active surface and a second backside surface opposite to the second active surface, and includes a plurality of second electrical contacts disposed adjacent to the second active surface. The second active surface of the second device faces the first active surface of the first device, the second electrical contacts of the second device are electrically connected to the first electrical contacts of the first device, and a thickness of the second device is less than or equal to one fifth of a thickness of the first device.
    Type: Grant
    Filed: October 15, 2019
    Date of Patent: November 30, 2021
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Chao-Kai Hung, Chien-Wei Chang, Ya-Chen Shih, Hung-Jung Tu, Hung-Yi Lin, Cheng-Yuan Kung
  • DEVICE ASSEMBLY STRUCTURE AND METHOD OF MANUFACTURING THE SAME
    Publication number: 20210111165
    Abstract: A device assembly structure includes a first device and at least one second device. The first device has a first active surface and a first backside surface opposite to the first active surface, and includes a plurality of first electrical contacts disposed adjacent to the first active surface. The second device has a second active surface and a second backside surface opposite to the second active surface, and includes a plurality of second electrical contacts disposed adjacent to the second active surface. The second active surface of the second device faces the first active surface of the first device, the second electrical contacts of the second device are electrically connected to the first electrical contacts of the first device, and a thickness of the second device is less than or equal to one fifth of a thickness of the first device.
    Type: Application
    Filed: October 15, 2019
    Publication date: April 15, 2021
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Chao-Kai HUNG, Chien-Wei CHANG, Ya-Chen SHIH, Hung-Jung TU, Hung-Yi LIN, Cheng-Yuan KUNG