Patents by Inventor Ya Cheng Chuang

Ya Cheng Chuang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Coated Metal Alloy Substrate and Process for Production Thereof
    Publication number: 20220349082
    Abstract: A coated metal alloy substrate, a process for producing a coated metal alloy substrate, and an electronic device having a housing comprising a coated metal alloy substrate are described. The coated metal alloy substrate comprises an electrolytic sealing layer on the metal alloy substrate, and an electrophoretic deposition layer deposited on the electrolytic sealing layer.
    Type: Application
    Filed: August 12, 2019
    Publication date: November 3, 2022
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: Qingyong Guo, Ya Cheng Chuang, Yong-Jun Li, Kuan-Ting Wu
  • ELECTRONIC DEVICE HOUSINGS WITH ELECTROLESS PLATING LAYERS
    Publication number: 20220341052
    Abstract: In one example, an electronic device housing may include a substrate, a micro-arc oxidation layer formed on a surface of the substrate, and an electroless plating layer formed on the micro-arc oxidation layer. Example electroless plating layer may be one of an electroless tin plating layer and an electroless silver plating layer. Further, the electronic device housing may include an electrophoretic deposition layer formed on the electroless plating layer.
    Type: Application
    Filed: October 31, 2019
    Publication date: October 27, 2022
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: Qingyong Guo, Kuan-Ting Wu, Ya Cheng Chuang, Feng Gu