Patents by Inventor YA CHI LEE

YA CHI LEE has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11961770
    Abstract: Some embodiments of the present disclosure relate to a processing tool. The tool includes a housing enclosing a processing chamber, and an input/output port configured to pass a wafer through the housing into and out of the processing chamber. A back-side macro-inspection system is arranged within the processing chamber and is configured to image a back side of the wafer. A front-side macro-inspection system is arranged within the processing chamber and is configured to image a front side of the wafer according to a first image resolution. A front-side micro-inspection system is arranged within the processing chamber and is configured to image the front side of the wafer according to a second image resolution which is higher than the first image resolution.
    Type: Grant
    Filed: November 4, 2021
    Date of Patent: April 16, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chia-Han Lin, Chien-Fa Lee, Hsu-Shui Liu, Jiun-Rong Pai, Sheng-Hsiang Chuang, Surendra Kumar Soni, Shou-Wen Kuo, Wu-An Weng, Gary Tsai, Chien-Ko Liao, Ya Hsun Hsueh, Becky Liao, Ethan Yu, Ming-Chi Tsai, Kuo-Yi Liu
  • Patent number: 9594277
    Abstract: A multi-domain liquid crystal pixel array includes two substrate layers and liquid crystal disposed between the two substrate layers. The multi-domain liquid crystal pixel array also includes at least one alignment layer having four or more alignment zones across the multi-domain liquid crystal pixel array. Each alignment zone has a different pre-tilt liquid crystal orientation than the other alignment zones. The alignment zones are configured to generate divergent image light with respect to a center of the multi-domain liquid crystal pixel array.
    Type: Grant
    Filed: June 8, 2015
    Date of Patent: March 14, 2017
    Assignee: X Development LLC
    Inventors: Pey Lung Fu, Mary Lou Jepsen, Philip E. Watson, Behnam Bastani, Carlin J. Vieri, Andrei S. Kazmierski, Adam E. Norton, Ya-Chi Lee, Eddy Giing-Li Chen, Hung-Yu Chen, Shenyi Tai
  • Patent number: 8800871
    Abstract: A Radio Frequency Identification (RFID) assembly includes an RFID reader/writer having a first micro-USB (Universal-Serial-Bus) connector and a mobile phone having a second micro-USB connector configured to electrically connect to the first micro-USB connector. In one embodiment of the present disclosure, the RFID reader/writer includes a circuit board having a first processor and a first USB controller, and an antenna board stacked on the circuit board, wherein the first USB controller electrically connects the first processor and the first micro-USB connector, and the antenna board includes a reverse F-shaped antenna. In one embodiment of the present disclosure, the mobile phone includes a second processor, and a second USB controller electrically connecting the second processor and the second micro-USB connector.
    Type: Grant
    Filed: November 9, 2012
    Date of Patent: August 12, 2014
    Assignee: Microelectronics Technology, Inc.
    Inventors: Yao Cheng Yeh, Tung Yeh Chiang, Tsung Cheng Chen, Wei Hsuan Chen, Ming Tsang Chen, Chao Min Tsai, Chung Chieh Chao, Ya Chi Lee, Yen Ning Cheng, Ming Hsun Tu, Darryn Wayne Prince
  • Publication number: 20130256412
    Abstract: A Radio Frequency Identification (RFID) assembly includes an RFID reader/writer having a first micro-USB (Universal-Serial-Bus) connector and a mobile phone having a second micro-USB connector configured to electrically connect to the first micro-USB connector. In one embodiment of the present disclosure, the RFID reader/writer includes a circuit board having a first processor and a first USB controller, and an antenna board stacked on the circuit board, wherein the first USB controller electrically connects the first processor and the first micro-USB connector, and the antenna board includes a reverse F-shaped antenna. In one embodiment of the present disclosure, the mobile phone includes a second processor, and a second USB controller electrically connecting the second processor and the second micro-USB connector.
    Type: Application
    Filed: November 9, 2012
    Publication date: October 3, 2013
    Applicant: MICROELECTRONICS TECHNOLOGY, INC.
    Inventors: Yao Cheng Yeh, Tung Yeh Chiang, Tsung Cheng Chen, Wei Hsuan Chen, Ming Tsang Chen, Chao Min Tsai, Chung Chieh Chao, Ya Chi Lee, Yen Ning Cheng, Ming Hsun Tu
  • Publication number: 20110074651
    Abstract: An assembly comprises a clamping mechanism and an LNB (low noise block down converter). The clamping mechanism includes a first clamping part, a second clamping part, and a plurality of rectangular grooves. The LNB includes a shell, at least one flexible portion, and at least one rib portion. The first clamping part and the second clamping part clasp around the LNB, and are combined with each other by at least one fastening part. The at least one flexible portion is disposed on the shell of the LNB, and the rib portion is on the flexible portion. The plurality of rectangular grooves are closely arranged in parallel on the inner surface of the second clamping part, and the rib portion is contained in one of the rectangular grooves. By rotating the combination of the first clamping part and the second clamping part, the rib portion is forced to move between the rectangular grooves and then is positioned again. During the movement, the flexible portion is temporarily deformed.
    Type: Application
    Filed: September 10, 2010
    Publication date: March 31, 2011
    Applicant: MICROELECTRONICS TECHNOLOGY INC.
    Inventor: YA CHI LEE