Patents by Inventor Ya-chu Lee

Ya-chu Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • SENSING SYSTEM ON CHIP AND THE MANUFACTURING METHOD THEREOF
    Publication number: 20240162098
    Abstract: A sensing system on chip (SOC) is disclosed. The sensing system on chip (SOC) includes a substrate, a humidity sensing unit, an air pressure sensing unit and a gas sensing unit. The substrate has a plane. The humidity sensing unit is formed on the substrate. The air pressure sensing unit is formed on the substrate. The gas sensing unit is formed on the substrate, wherein the humidity sensing unit, the air pressure sensing unit and the gas sensing unit are all arranged on the plane.
    Type: Application
    Filed: April 6, 2023
    Publication date: May 16, 2024
    Applicant: National Tsing Hua University
    Inventors: Tung-Lin Chien, Ya-chu Lee, Wei-Leun Fang