Abstract: A key structure comprises a substrate, a membrane circuit disposed on the substrate, a waterproof structure disposed on the membrane circuit, a keycap, a conduction switch and a scissors structure. The waterproof structure includes a waterproof plate and a waterproof wall with a through hole. The waterproof wall surrounds the through hole and extends opposite to the membrane circuit. An end of the conduction switch passes through the through hole to be disposed on the membrane circuit, and the other end of the conduction switch protrudes from the waterproof wall to be connected to the keycap. The scissors structure includes a first end portion and a second end portion. The first end portion is pivotally connected to the keycap, and the second end portion is pivotally connected to the waterproof wall for the keycap to move up and down relatively to the membrane circuit.

Abstract: A key structure comprises a substrate, a membrane circuit disposed on the substrate, a waterproof structure disposed on the membrane circuit, a keycap, a conduction switch and a scissors structure. The waterproof structure includes a waterproof plate and a waterproof wall with a through hole. The waterproof wall surrounds the through hole and extends opposite to the membrane circuit. An end of the conduction switch passes through the through hole to be disposed on the membrane circuit, and the other end of the conduction switch protrudes from the waterproof wall to be connected to the keycap. The scissors structure includes a first end portion and a second end portion. The first end portion is pivotally connected to the keycap, and the second end portion is pivotally connected to the waterproof wall for the keycap to move up and down relatively to the membrane circuit.

Abstract: A key structure including a bottom portion, a keycap, an elastic element and a positioning unit is provided. The keycap includes a plurality of fixing portions. The elastic element is configured between the bottom portion and the keycap. The positioning unit is fixed on the bottom portion and is assembled with the fixing portions. The keycap moves relative to the bottom portion via the positioning unit.

Abstract: A lighting module is adapted to an electronic device. The electronic device includes a light transmitting portion. The lighting module comprises a light source and a microstructure. The light source is disposed in the electronic device, and the light source includes a light emitting surface facing the light transmitting portion. The microstructure is disposed between the light emitting surface of the light source and the light transmitting portion.

Abstract: A key structure comprises a bottom portion, a keycap and an elastic element. The bottom portion includes a pressing portion. The keycap includes a conducting portion and a fixing portion. The elastic element is a hollow structure formed by linear winding, and it is disposed between the bottom portion and the keycap. The conducting portion passes through the hollow structure and corresponds to the pressing portion, and the fixing portion is used to fix the elastic element. The keycap is movably fixed to the bottom portion, and the conducting portion is connected to the pressing portion when the keycap moves towards the bottom portion.

Abstract: A film support includes a pillar and a supporting unit. The pillar has an outer wall which encloses an accommodation space. The supporting unit has a supporting end and an assembly portion connected to each other, wherein the assembly portion is disposed in the accommodation space whereas the supporting end protrudes outside the pillar. The assembly portion of the supporting unit has a degree of freedom of rotation within the accommodation space and when the assembly portion rotates with respect to the pillar, the supporting end is driven to rotate with respect to the pillar.

Abstract: A light-emitting diode (LED) module and an LED packaging method. As the LED module is packaged under the consideration of candela distribution, each of the lead frames of the LED chips packaged in the LED module is bended for tilting the LED chips by different angles to exhibit various lighting effects. Meanwhile, in the LED packaging method, a plurality of LED chips can be loaded on board rapidly and aligned by one operation to result in less deviation in the candela distribution curve.

Abstract: A light-emitting diode (LED) module and an LED packaging method. As the LED module is packaged under the consideration of candela distribution, each of the lead frames of the LED chips packaged in the LED module is bended for tilting the LED chips by different angles to exhibit various lighting effects. Meanwhile, in the LED packaging method, a plurality of LED chips can be loaded on board rapidly and aligned by one operation to result in less deviation in the candela distribution curve.

Abstract: A film support includes a pillar and a supporting unit. The pillar has an outer wall which encloses an accommodation space. The supporting unit has a supporting end and an assembly portion connected to each other, wherein the assembly portion is disposed in the accommodation space whereas the supporting end protrudes outside the pillar. The assembly portion of the supporting unit has a degree of freedom of rotation within the accommodation space and when the assembly portion rotates with respect to the pillar, the supporting end is driven to rotate with respect to the pillar.

Abstract: A light-emitting diode (LED) module and an LED packaging method. As the LED module is packaged under the consideration of candela distribution, each of the lead frames of the LED chips packaged in the LED module is bended for tilting the LED chips by different angles to exhibit various lighting effects. Meanwhile, in the LED packaging method, a plurality of LED chips can be loaded on board rapidly and aligned by one operation to result in less deviation in the candela distribution curve.