Abstract: The present disclosure is drawn to covers for electronic devices. In one example, a substrate can include a metal alloy. An acid anodizing layer can be formed on the substrate. A dye application can be applied on the acid anodizing layer. A first nickel-free sealing layer can be formed on the dye application. An alkaline anodizing layer can be formed on the first sealing layer. A second nickel-free sealing layer can be formed on the alkaline anodizing layer.

Abstract: Camera modules and associated electronic devices and systems are described. A camera module may include a set of housing elements that at least partially defines an interior cavity, a set of lens elements, an image sensor positioned within the interior cavity to receive light through the set of lens elements, and a substrate assembly. The substrate assembly may include a set of rigid substrates, a first set of electrical contacts positioned on a first surface of the set of rigid substrates, and a second set of electrical contacts positioned on a second surface of the set of rigid substrates. The substrate assembly may be positioned such that a first portion of the substrate assembly is positioned inside the interior cavity and a second portion of the substrate assembly extends outside of the interior cavity.

Abstract: A light emitting module includes a carrier, a light emitting element, a reflection layer, and a fluorescent layer. The light emitting element is disposed on the carrier. The reflection layer is disposed on the carrier and surrounds the light emitting element. The fluorescent layer covers at least part of the light emitting element. The disadvantages of over broad light emitting angle and low illuminance may be solved. Comparing with the related art, the present disclosure achieves an object of increasing the illuminance by at least 10%.

Abstract: The application discloses examples of a device housing of an electronic device including a magnesium-alloy substrate. The device housing further including a treatment layer applied over the magnesium-alloy substrate and a metallic coating layer applied over the treatment layer to provide a metallic luster. Further, a paint coating layer is disposed over a first portion of the metallic coating layer. Further, a top coating layer is applied over the paint coating layer and a visible second portion of the metallic coating layer.

Abstract: Provided is an anti-fuse memory including a anti-fuse memory cell including an isolation structure, a select gate, first and second gate insulating layers, an anti-fuse gate, and first, second and third doped regions. The isolation structure is disposed in a substrate. The select gate is disposed on the substrate. The first gate insulating layer is disposed between the select gate and the substrate. The anti-fuse gate is disposed on the substrate and partially overlapped with the isolation structure. The second gate insulating layer is disposed between the anti-fuse gate and the substrate. The first doped region and the second doped region are disposed in the substrate at opposite sides of the select gate, respectively, wherein the first doped region is located between the select gate and the anti-fuse gate. The third doped region is disposed in the substrate and located between the first doped region and the isolation structure.

Abstract: The present invention provides an antimicrobial peptide ID13 (with a sequence set forth in SEQ ID NO. 1), a preparation method and use thereof. The antimicrobial peptide ID3 is successfully expressed in Pichia pastoris using genetic engineering technology. The antimicrobial peptide ID13 of the present invention has an excellent bactericidal activity against Gram-positive bacteria such as Staphylococcus aureus, Streptococcus pneumoniae, and Streptococcus suis, and has a low hemolytic activity against mouse red blood cells and a low murine macrophage cytotoxicity.

Abstract: The present invention provides an antimicrobial peptide ID13 (with a sequence set forth in SEQ ID No. 1), a preparation method and use thereof. The antimicrobial peptide ID3 is successfully expressed in Pichia pastoris using genetic engineering technology. The antimicrobial peptide ID13 of the present invention has an excellent bactericidal activity against Gram-positive bacteria such as Staphylococcus aureus, Streptococcus pneumoniae, and Streptococcus suis, and has a low hemolytic activity against mouse red blood cells and a low murine macrophage cytotoxicity.