Patents by Inventor Ya-Hsin CHENG

Ya-Hsin CHENG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11916107
    Abstract: A semiconductor device including a FET includes an isolation insulating layer disposed in a trench of the substrate, a gate dielectric layer disposed over a channel region of the substrate, a gate electrode disposed over the gate dielectric layer, a source and a drain disposed adjacent to the channel region, and an embedded insulating layer disposed below the source, the drain and the gate electrode and both ends of the embedded insulating layer are connected to the isolation insulating layer.
    Type: Grant
    Filed: January 13, 2023
    Date of Patent: February 27, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Chun Hsiung Tsai, Chih-Hsin Ko, Clement Hsing Jen Wann, Ya-Yun Cheng
  • Publication number: 20200021547
    Abstract: A method of setting a designee for a user (designator) in instant messaging is proposed. In the instant messaging, the designator operates a designator-side device to select a contact to be a messaging object corresponding to an object-side device, and select another contact to be a messaging designee corresponding to a designee-side device, causing an instant messaging server to activate a deputy mode. In the deputy mode, when the designee-side device is operated to send a message to the object-side device through the instant messaging server, the instant messaging server transmits the message to the object-side device in the name of the designator-side device, and also transmits the message to the designator-side device.
    Type: Application
    Filed: November 20, 2018
    Publication date: January 16, 2020
    Inventors: Chan-Guan KOH, Chin-Yuan CHEN, Ya-Hsin CHENG