Abstract: The heat dissipation structure of a horizontal optical-communication sub-assembly is provided, which includes a T-shaped header, a circuit board and a heat-dissipating support insert. The T-shaped header includes a base and a tongue. The tongue is disposed on one side of the base and is perpendicular to the base. The base includes a first through hole and a second through hole. The first through hole is above the tongue and the second through hole is below the tongue and opposite to the first through hole. One end of the circuit board penetrates through the first through hole and disposed on the tongue. The heat-dissipating support insert includes a supporting block and an extension portion. The extension portion is disposed on one side of the supporting block and penetrates through the second through hole to extend to the bottom of the tongue.

Abstract: The heat dissipation structure of a horizontal optical-communication sub-assembly is provided, which includes a T-shaped header, a circuit board and a heat-dissipating support insert. The T-shaped header includes a base and a tongue. The tongue is disposed on one side of the base and is perpendicular to the base. The base includes a first through hole and a second through hole. The first through hole is above the tongue and the second through hole is below the tongue and opposite to the first through hole. One end of the circuit board penetrates through the first through hole and disposed on the tongue. The heat-dissipating support insert includes a supporting block and an extension portion. The extension portion is disposed on one side of the supporting block and penetrates through the second through hole to extend to the bottom of the tongue.

Abstract: An assembly of semiconductor and highly thermally conductive heat-dissipating substrates includes a thermally conductive metal substrate, a supporting substrate, and a vertical heat-dissipating block. The thermally conductive metal substrate comprises a substrate body, a receiving groove in the substrate body, and a thin-layer portion at a bottom side of the receiving groove. The supporting substrate is provided in the receiving groove. The two vertically opposite sides of the supporting substrate respectively form a carrying surface for carrying a laser diode LD and a heat-dissipating surface in contact with the thin-layer portion at the bottom side of the receiving groove. The vertical heat-dissipating block is provided on a side of the thermally conductive metal substrate opposing to a side with the receiving groove.

Abstract: The invention provides a heat-dissipating semiconductor assembly, comprising: a heat-dissipating substrate, a metal solder layer, and an edge emitting laser diode. The heat-dissipating substrate has one side formed with a flat surface for mounting the edge emitting laser diode. The edge emitting laser diode is mounted on the metal solder layer, and by lowering the active area of the edge emitting laser diode, the active area of the edge emitting laser diode is drawn close to one side of the heat-dissipating substrate. The edge emitting laser diode has an optical output direction parallel to the flat surface of the heat-dissipating substrate, and the heat-dissipating substrate and/or the metal solder layer have a groove. The ridge of the edge emitting laser diode is aligned with an opening formed in the groove of the heat-dissipating substrate, thereby preventing the heat-dissipating substrate and metal solder layer from contacting the ridge of the edge emitting laser diode.

Abstract: The present invention provides a composite heat-dissipating substrate structure, comprising: a heat-dissipating substrate and a heat-conducting metal layer. The heat-dissipating substrate includes a substrate body and a socket formed on the substrate body; and the heat-conducting metal layer widely covers the socket of the substrate body and have one side formed as a loaded side on which a laser semiconductor is to be mounted and a opposite side formed as a heat-dissipating side, so that after the loaded side absorbs heat from the laser semiconductor, the heat-dissipating side reverse to the heat-conducting metal layer diffuses the heat to the heat-dissipating substrate.