Abstract: A method for creating a customized object is implemented using an electronic device communicating with a server. The method includes: displaying an edit page that includes a type selection list that displays a number of object types each having a specific shape, a design element list that displays a number of available design elements, and an edit area; in response to a user selection of a selected object type, displaying an object image corresponding to the selected object type in the edit area, allowing a user to create a customized image by editing the object image; and in response to a command indicating that editing of the object image has been completed, transmitting data regarding the customized image to the server.

Abstract: A ball connect device for a linear guideway comprises: at least one ribbon-shaped connecting portion in which being formed a plurality of retaining holes for retaining a plurality of balls, and a plurality ring portions being protruded out a surface of the connecting portion and each of the ring portions being formed around the respective retaining holes to circle around the balls. The retaining holes each has two open ends that are located at both sides of the ribbon-shaped connecting portion, a diameter of one of the two open ends is near a diameter of the balls for easy installation of the balls into the ball connect device, and a diameter of another one of the two open ends is smaller than the diameter of the balls so as to prevent disengagement of the balls.

Abstract: A circulation unit with lubrication system for rolling element includes a lubricant inlet formed with the sliding element and the lubricant inlet communicates with lubricant path such that lubricant can be directly fed to the rollers. The circulation unit has a compact structure which saves space and manufacturing cost.

Abstract: A ball connect device for a linear guideway comprises: at least a ribbon-shaped connecting portion in which being formed a plurality of retaining holes for retaining a plurality of balls, and a plurality ring portions being protruded out a surface of the connecting portion and each of the ring portions being formed around the respective retaining holes to circle around the balls. The ring portions each has two apertures that are located at both sides of the ribbon-shaped connecting portion, a diameter of one of the two apertures is near a diameter of the balls for easy installation of the balls into the ball connect device, and a diameter of another one of the two apertures is smaller than the diameter of the balls so as to prevent disengagement of the balls.

Abstract: The present invention relates to a guiding module for rolling-element, which is comprised of the partition and the link-ring. The characteristic of the guiding module for rolling-element is that has the rotatable structure, which uses the cooperation of pillar and trough, therefore can enhance the function of the guiding module for rolling-element to turn freely.

Abstract: The present invention relates to a guiding module for rolling-element, which is comprised of the partition and the link-ring. The characteristic of the guiding module for rolling-element is that has the rotatable structure, which uses the cooperation of pillar and trough, therefore can enhance the function of the guiding module for rolling-element to turn freely.

Abstract: A circulation unit with lubrication system for rolling element includes a lubricant inlet formed with the sliding element and the lubricant inlet communicates with lubricant path such that lubricant can be directly fed to the rollers. The circulation unit has a compact structure which saves space and manufacturing cost.

Abstract: A semiconductor wafer including a substrate, a copper dual damascene structure positioned on the substrate, a dielectric layer covering the copper dual damascene structure, and a via hole positioned in the dielectric layer, the hole continuing to a surface of the copper layer. First, a tantalum nitride (TaN) layer is formed on a bottom surface within the via hole and on walls within the via hole. A titanium nitride (TiN) layer is then formed on the tantalum nitride layer. By performing a chemical vapor deposition (CVD) process, a tungsten layer is formed to cover a surface of the titanium nitride layer as well as to fill the via hole. Finally, a chemical mechanical polishing (CMP) process is performed to make a top of the tungsten layer in the via hole aligned with the surface of the dielectric layer so as to form a tungsten plug.