Abstract: A process of overlay offset measurement includes providing a substrate; forming a first pattern layer with a predetermined first pattern on the substrate; forming a first photoresist layer on the substrate and the first pattern layer; forming a second photoresist layer on the first photoresist layer; forming a second pattern layer with a predetermined second pattern on the second photoresist layer; patterning the second photoresist layer to form a trench having a predetermined third pattern being substantially aligned with the predetermined first pattern of the first pattern layer; and performing overlay offset measurement according to the second pattern layer and the trench.

Abstract: A process of overlay offset measurement includes providing a substrate; forming a first pattern layer with a predetermined first pattern on the substrate; forming a first photoresist layer on the substrate and the first pattern layer; forming a second photoresist layer on the first photoresist layer; forming a second pattern layer with a predetermined second pattern on the second photoresist layer; patterning the second photoresist layer to form a trench having a predetermined third pattern being substantially aligned with the predetermined first pattern of the first pattern layer; and performing overlay offset measurement according to the second pattern layer and the trench.

Abstract: A sensor device provided in the disclosure includes a sensor substrate, a first transparent layer, a collimator layer, and a lens. The first transparent layer is disposed on the sensor substrate, wherein the first transparent layer defines an alignment structure. The collimator layer is disposed on the first transparent layer. The lens is disposed on the collimator layer.

Abstract: A liquid crystal display includes a first substrate, a pixel array, a first pad, a dielectric layer, a filling pattern, a first conductor, a second substrate and a liquid crystal layer. The first substrate has a display area and a pad area located outside the display area. The pixel array is disposed on the display area. The first pad is disposed on the pad area. The dielectric layer has a first opening overlapped with the first pad. The filling pattern is disposed within the first opening of the dielectric layer. The filling pattern has through holes, and the through holes of the filling pattern are overlapped with the first pads. The first conductor is disposed in the first opening of the dielectric layer, and is electrically connected to the first pad via the through holes of the filling pattern.

Abstract: A sensor device provided in the disclosure includes a sensor substrate, a first transparent layer, a collimator layer, and a lens. The first transparent layer is disposed on the sensor substrate, wherein the first transparent layer defines an alignment structure. The collimator layer is disposed on the first transparent layer. The lens is disposed on the collimator layer.

Abstract: A method of fabricating a sensor device including at least the following steps is provided. An optical film stack is formed on a sensor substrate, wherein the sensor substrate includes a sensor region and a pad region beside the sensor region, and the optical film stack covers the sensor region while exposes the pad region. A releasing pattern is formed on the pad region. A lens material layer is formed on the sensor substrate to cover the releasing pattern and the optical film stack. The releasing pattern is removed from the sensor substrate to expose the pad region by patterning the lens material layer to form a lens on the optical film stack.

Abstract: A patterned light guide structure includes a transparent substrate with a first side and with a second side, an anti-reflective layer directly attached to the first side, a first light-shielding layer directly disposed on the anti-reflective layer, a second light-shielding layer directly disposed on the second side, and a protecting layer directly disposed on the first light-shielding layer to keep the first light-shielding layer from any deteriorating damage.

Abstract: A sensor device provided in the disclosure includes a sensor substrate, a first transparent layer, a collimator layer, and a lens. The first transparent layer is disposed on the sensor substrate, wherein the first transparent layer defines an alignment structure. The collimator layer is disposed on the first transparent layer. The lens is disposed on the collimator layer.

Abstract: A process of overlay offset measurement includes providing a substrate; forming a first pattern layer with a predetermined first pattern on the substrate; forming a first photoresist layer on the substrate and the first pattern layer; forming a second photoresist layer on the first photoresist layer; forming a second pattern layer with a predetermined second pattern on the second photoresist layer; patterning the second photoresist layer to form a trench having a predetermined third pattern being substantially aligned with the predetermined first pattern of the first pattern layer; and performing overlay offset measurement according to the second pattern layer and the trench.

Abstract: A method of fabricating a sensor device including at least the following steps is provided. An optical film stack is formed on a sensor substrate, wherein the sensor substrate includes a sensor region and a pad region beside the sensor region, and the optical film stack covers the sensor region while exposes the pad region. A releasing pattern is formed on the pad region. A lens material layer is formed on the sensor substrate to cover the releasing pattern and the optical film stack. The releasing pattern is removed from the sensor substrate to expose the pad region by patterning the lens material layer to form a lens on the optical film stack.

Abstract: A patterned light guide structure includes a transparent substrate with a first side and with a second side, an anti-reflective layer directly attached to the first side, a first light-shielding layer directly disposed on the anti-reflective layer, a second light-shielding layer directly disposed on the second side, and a protecting layer directly disposed on the first light-shielding layer to keep the first light-shielding layer from any deteriorating damage.

Abstract: A liquid crystal display includes a first substrate, a pixel array, a first pad, a dielectric layer, a filling pattern, a first conductor, a second substrate and a liquid crystal layer. The first substrate has a display area and a pad area located outside the display area. The pixel array is disposed on the display area. The first pad is disposed on the pad area. The dielectric layer has a first opening overlapped with the first pad. The filling pattern is disposed within the first opening of the dielectric layer. The filling pattern has through holes, and the through holes of the filling pattern are overlapped with the first pads. The first conductor is disposed in the first opening of the dielectric layer, and is electrically connected to the first pad via the through holes of the filling pattern.

Abstract: A method of fabricating an image sensor includes the following steps. A substrate is provided. A first infrared filter is formed on a first region of the substrate. A second infrared filter is deposited on the substrate and the first infrared filter. The deposited second infrared filter covers the first infrared filter. The second infrared filter is lowered to expose the first infrared filter. The lowered second infrared filter is on a second region of the substrate and neighbors the first infrared filter.

Abstract: A method of fabricating an image sensor includes the following steps. A substrate is provided. A first infrared filter is formed on a first region of the substrate. A second infrared filter is deposited on the substrate and the first infrared filter. The deposited second infrared filter covers the first infrared filter. The second infrared filter is lowered to expose the first infrared filter. The lowered second infrared filter is on a second region of the substrate and neighbors the first infrared filter.

Abstract: A method of fabricating an image sensor includes the following steps. A substrate is provided. A first infrared filter is formed on a first region of the substrate. A second infrared filter is deposited on the substrate and the first infrared filter. The deposited second infrared filter covers the first infrared filter. The second infrared filter is lowered to expose the first infrared filter. The lowered second infrared filter is on a second region of the substrate and neighbors the first infrared filter.

Abstract: A method of fabricating an image sensor includes the following steps. A substrate is provided. A first infrared filter is formed on a first region of the substrate. A second infrared filter is deposited on the substrate and the first infrared filter. The deposited second infrared filter covers the first infrared filter. The second infrared filter is lowered to expose the first infrared filter. The lowered second infrared filter is on a second region of the substrate and neighbors the first infrared filter.