Abstract: A circuit board is disclosed, including a core board, wherein at least one surface thereof has a core circuit layer with a plurality of conductive lands; a first dielectric layer disposed on the core board and disposed with a plurality of openings for exposing the conductive lands; a first coupling layer disposed on the first dielectric layer, the first coupling layer having a plurality of openings disposed corresponding to the openings of the first dielectric layer; and a first circuit layer disposed on the first coupling layer and a plurality of first conductive vias disposed in the openings of the first coupling layer for electrically connecting to the conductive lands of the core circuit layer. By the formation of the first coupling layer that connects the first circuit layer and the first dielectric layer, the bond strength between the first circuit layer and the first dielectric layer is enhanced, thereby preventing detachment and delamination as encountered in the prior art.

Abstract: A substrate with surface finished structure and a method for manufacturing the same are disclosed. The method comprises: forming a circuit layer and a solder mask on the surface of the substrate in sequence, wherein a plurality of openings are formed in the solder mask to expose the portion of the circuit layer to be electrical contact pads which having at least a wire bonding pad and a plurality of solder pads; and forming a Ni/Au layer on the surface of the wire bonding pad and a chemical gold layer on the surface of the solder pads. Therefore, the disclosed structure can prevent the electrical contact pads from oxidation for a long time.

Abstract: A circuit board structure and a method for fabricating the same are proposed. A substrate with a first circuit layer formed on at least one surface thereof is provided. A dielectric layer is formed on the surface of the substrate, and a plurality of first and second openings are formed in the dielectric layer, wherein the second openings expose electrical connection pads of the first circuit layer. A metal layer is formed on the surface of the dielectric layer and in the first and second openings. By removing the metal layer on the surface of the dielectric layer, a second circuit layer is formed in the second openings, and a conductive structure is formed in the second openings for electrical connection with the first circuit layer. The present invention improves the bonding strength between the circuit layer and the dielectric layer, and the ability of fabricating fine circuits.