Patents by Inventor Ya LV

Ya LV has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11934070
    Abstract: Disclosed is a display panel including: first spacer on the array substrate, an orthographic projection of the first spacer on the array substrate being a first pattern extending along a first direction; a second spacer on the counter substrate, an orthographic projection of the second spacer on the array substrate being a second pattern extending along a second direction; at least two third spacers, orthographic projections of which on the array substrate being respectively on two sides of the first pattern along the first direction; at least two fourth spacers, orthographic projections of which on the array substrate being respectively on two sides of the second pattern along the second direction; one of the third spacer and the fourth spacer is on the array substrate, and the other is on the counter substrate.
    Type: Grant
    Filed: October 23, 2020
    Date of Patent: March 19, 2024
    Assignees: Hefei Xinsheng Optoelectronics Technology Co., Ltd., BOE TECHNOLOGY GROUP CO., LTD.
    Inventors: Quan Gan, Ya Yu, Feng Qu, Yongcan Wang, Fengzhen Lv, Xianjie Shao, Rui Ma
  • Publication number: 20230396123
    Abstract: A rotor structure for reducing a working temperature in a shaft is disclosed. The rotor structure comprises a hollow shaft body and an inner shaft sleeve, the inner shaft sleeve is assembled in the hollow shaft body, and a first thermal insulating cavity is formed between the inner shaft sleeve and the hollow shaft body. The rotor structure according to the present disclosure can be applied to the motor, and can effectively reduce the working temperature of the inner surface of the hollow shaft of the motor and ensure the reliable operation of the motor.
    Type: Application
    Filed: May 31, 2021
    Publication date: December 7, 2023
    Inventors: Haitao JIN, Ya LV, Chuankang LIU, Dongsheng ZHOU, Huiyan FAN
  • Patent number: 9929451
    Abstract: A battery assembly that includes a plurality of batteries. The battery assembly includes a printed circuit board integrated with plural fuses and resistors. The sizes of the resistors vary based on a distance between the batteries and a connection point to compensate for resistance differences from each battery to the connection point.
    Type: Grant
    Filed: September 20, 2016
    Date of Patent: March 27, 2018
    Assignee: Ampd Energy Limited
    Inventors: Brandon Boon Soon Ng, Luciano Gurgel Valente, Clayton Ip, Kevin Chan, Ya Lv
  • Patent number: 9713284
    Abstract: The present invention discloses a fluid cooling assembly which facilitates turbulent flow inside the assembly so as to achieve better heat dissipating effect. The cooling assembly comprises an enclosed chamber with an inlet and an outlet for fluid to pass through; together with a heat spreader; a plurality of micropillars and a plurality of heat dissipating fins installed inside the assembly. When fluid flows through the chamber, these elements in combination are adapted to create an enhanced turbulent flow upon the fluid so as to effectively dissipate heat from said heat spreader through the fluid.
    Type: Grant
    Filed: July 15, 2015
    Date of Patent: July 18, 2017
    Assignee: Hong Kong Applied Science and Technology Research Institute Co. Ltd.
    Inventors: Ziyang Gao, Ya Lv, Yat Kit Tsui
  • Patent number: 9704819
    Abstract: A power electronic package includes a first substrate, a second substrate oppositely disposed from the first substrate, one or more chips disposed between the substrates, and at least three spacers. The spacers control a height variation of the power electronic package and protect the chips and other electronics from experiencing excessive stress. The height of the spacers is determined based on a height of the chips, on a height of solder blocks that connect the chips to the top substrate, and on a height of solder blocks that connect the chips to the bottom substrate.
    Type: Grant
    Filed: March 29, 2016
    Date of Patent: July 11, 2017
    Assignee: Hong Kong Applied Science and Technology Research Institute Co. Ltd.
    Inventors: Ziyang Gao, Ya Lv
  • Publication number: 20170020027
    Abstract: The present invention discloses a fluid cooling assembly which facilitates turbulent flow inside the assembly so as to achieve better heat dissipating effect. The cooling assembly comprises an enclosed chamber with an inlet and an outlet for fluid to pass through; together with a heat spreader; a plurality of micropillars and a plurality of heat dissipating fins installed inside the assembly. When fluid flows through the chamber, these elements in combination are adapted to create an enhanced turbulent flow upon the fluid so as to effectively dissipate heat from said heat spreader through the fluid.
    Type: Application
    Filed: July 15, 2015
    Publication date: January 19, 2017
    Inventors: Ziyang GAO, Ya LV, Yat Kit TSUI
  • Publication number: 20170012331
    Abstract: A battery assembly that includes a plurality of batteries. The battery assembly includes a printed circuit board integrated with plural fuses and resistors. The sizes of the resistors vary based on a distance between the batteries and a connection point to compensate for resistance differences from each battery to the connection point.
    Type: Application
    Filed: September 20, 2016
    Publication date: January 12, 2017
    Inventors: Brandon Boon Soon NG, Luciano Gurgel VALENTE, Clayton IP, Kevin CHAN, Ya LV