Abstract: A body of a sensor includes a wafer having a cavity and a membrane deflectable into the cavity under an applied force. The membrane has a first section and a second section. The first section of the membrane is more deflectable than the second section in a first range of the applied force and the second section is more deflectable than the first section in a second range of the applied force that is different than the first range.

Abstract: The present disclosure relates to the field of touch technology, and provides a touch module, which includes a substrate, a first bridging layer, a first touch sensing layer, a second bridging layer, and a second touch sensing layer. The first bridging layer extends on the substrate along a first direction. The first touch sensing layer is disposed on the substrate and includes a plurality of first touch sensing electrodes, wherein the first bridging layer connects adjacent first touch sensing electrodes of the first touch sensing electrodes. The second bridging layer is disposed on the first bridging layer, located between the adjacent first touch sensing electrodes, and connected in parallel with the first bridging layer. The second touch sensing layer is disposed on the substrate, crosses the second bridging layer along a second direction, and is disposed between the adjacent first touch sensing electrodes.

Abstract: The present disclosure relates to the field of touch technology, and provides a touch module, which includes a substrate, a first bridging layer, a first touch sensing layer, a second bridging layer, and a second touch sensing layer. The first bridging layer extends on the substrate along a first direction. The first touch sensing layer is disposed on the substrate and includes a plurality of first touch sensing electrodes, wherein the first bridging layer connects adjacent first touch sensing electrodes of the first touch sensing electrodes. The second bridging layer is disposed on the first bridging layer, located between the adjacent first touch sensing electrodes, and connected in parallel with the first bridging layer. The second touch sensing layer is disposed on the substrate, crosses the second bridging layer along a second direction, and is disposed between the adjacent first touch sensing electrodes.

Abstract: The present disclosure relates to the field of touch technology, and provides a touch module, which includes a substrate, a first touch sensing layer, a metal wiring layer, and a transparent conductive layer. The substrate has a visible area and a peripheral area located around the visible area. The first touch sensing layer extends from the visible area to the peripheral area of the substrate. The metal wiring layer is located in the peripheral area of the substrate and is laterally separated from the first touch sensing layer. The transparent conductive layer is located in the peripheral area of the substrate and has a first portion and a second portion. The first portion is in contact with the first touch sensing layer and the second portion is in contact with the metal wiring layer.

Abstract: A sensor assembly includes a sensor and an overload stop disposed on a surface of the sensor. The sensor has a resilient central region and an outer region surrounding the central region. The overload stop includes a center stop disposed on the central region and a peripheral stop disposed on the outer region.

Abstract: The sensor assembly comprises a sensor die comprising first and second members. The first member accommodates an actuation element on a second surface of the first member and in contact with a diaphragm that is integral with the first member. The second member is bonded to a first surface of the first member opposite the second surface, and sensing elements are positioned adjacent the diaphragm along the first surface and interposed between the first and second members. The second member also includes a recessed section that forms a cavity adjacent the diaphragm to accommodate and/or limit diaphragm deflection. An internal electrical connection is made between first and second member electrical contacts disposed along the interface between the first and second members to avoid external wires. The second member further includes external electrical terminals to facilitate an electrical surface connection with the sensor assembly without the need for external wires.

Abstract: A sensor assembly includes a sensor and an overload stop disposed on a surface of the sensor. The sensor has a resilient central region and an outer region surrounding the central region. The overload stop includes a center stop disposed on the central region and a peripheral stop disposed on the outer region.

Abstract: Sensor devices comprise a sensor die having a first membrane between a first outside surface and a buried cavity, and a second membrane between the buried cavity and a recessed section of the sensor die forming a backside cavity, wherein the first and second membranes oriented vertically adjacent one another. The sensor die comprises first and second members that are attached together, the buried cavity is formed between the members, and the first member comprises the first diaphragm and the second member comprises the second diaphragm. The membranes are configured to enable sensing over different ranges. Electrical sensing elements are in the sensor die for measuring movement of each of the first and second sensing membranes over the different ranges. Electrical contacts connected with sensing elements are exposed along a sensor die surface for providing an output signal for monitoring by an external device.

Abstract: Sensor assemblies comprise a sensor die including a first member and a second member. The first member comprises a diaphragm extending between opposed surfaces of the first member. A number of electrical sensing elements are disposed within the first member and positioned adjacent the diaphragm along a first member surface. The second member is attached with the first member along surface comprising the electrical sensing elements. The second member has a recessed section forming cavity with the first member to accommodate deflection of the diaphragm. The first member includes an actuation element that extends outwardly from a surface and that is positioned directly on the diaphragm. The sensor assembly includes metallic connectors and contacts for facilitating connection between the electrical sensing elements and an outer surface of the sensor die to provide a surface mount electrical connection of the sensor assembly.

Abstract: Sensor devices comprise a sensor die having a first membrane between a first outside surface and a buried cavity, and a second membrane between the buried cavity and a recessed section of the sensor die forming a backside cavity, wherein the first and second membranes oriented vertically adjacent one another. The sensor die comprises first and second members that are attached together, the buried cavity is formed between the members, and the first member comprises the first diaphragm and the second member comprises the second diaphragm. The membranes are configured to enable sensing over different ranges. Electrical sensing elements are in the sensor die for measuring movement of each of the first and second sensing membranes over the different ranges. Electrical contacts connected with sensing elements are exposed along a sensor die surface for providing an output signal for monitoring by an external device.

Abstract: Piezoelectric actuators are provided. In some instances, the piezoelectric actuators are high-precision piezoelectric actuators. The piezoelectric beams may have a bi-chevron configuration. Also provided are methods of making the piezoelectric actuators, e.g., using Micro-Electro-Mechanical System (MEMS) fabrication techniques, and methods of using the piezoelectric actuators, e.g., as valves in fluid dispensing systems.

Abstract: Piezoelectric actuators are provided. In some instances, the piezoelectric actuators are high-precision piezoelectric actuators. The piezoelectric beams may have a bi-chevron configuration. Also provided are methods of making the piezoelectric actuators, e.g., using Micro-Electro-Mechanical System (MEMS) fabrication techniques, and methods of using the piezoelectric actuators, e.g., as valves in fluid dispensing systems.