Patents by Inventor Ya Ping Hung

Ya Ping Hung has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Ball grid array package
    Patent number: 6291898
    Abstract: A BGA package includes a chip with an array pad design disposed on the upper surface of a substrate. The chip has a plurality of bonding pads located about the periphery thereof, and the bonding pads of the chip are positioned in three rows, an inner row, a middle row, and an outer row along the sides of the chip. Only power supply pads and ground pads are designed to be located in the outer row of bonding pads, and all of the I/O pads are designed to be located in the middle row of the bonding pads and the inner row of the bonding pads.
    Type: Grant
    Filed: March 27, 2000
    Date of Patent: September 18, 2001
    Assignee: Advanced Semiconductor Engineering, Inc.
    Inventors: Yung I Yeh, Te Tsung Chao, Ya Ping Hung, Hui Chin Fang