Abstract: The photosensitive resin composition includes an alkali-soluble resin (A), an ethylenically-unsaturated monomer (B), a photopolymerization initiator (C), a solvent (D), and a pigment (E). The alkali- soluble resin (A) includes an alkali-soluble resin (A-1), wherein the alkali-soluble resin (A-1) includes a structural unit represented by formula (I-1) and a structural unit represented by formula (I-2). The photopolymerization initiator (C) includes an acylphosphine oxide compound represented by formula (III-1).

Abstract: A photosensitive resin composition, a cured product and a manufacturing method thereof, a light conversion layer and a light emitting device are provided. The photosensitive resin composition includes a resin (A), an ethylenically unsaturated monomer (B), a photopolymerization initiator (C), a pigment (D) and a solvent (E). The resin (A) includes an alkali-soluble resin (A-1), other resin (A-2) or the combination thereof. The alkali-soluble resin (A-1) includes a structural unit represented by the following formula (A1). The photopolymerization initiator (C) includes a compound represented by the following formula (C1). In formula (A1) and formula (C1), the definition of each substituent is the same as that in the detailed description.

Abstract: A photosensitive resin composition, a cured film and a microlens array are provided. The photosensitive resin composition includes resin (A), an ethylenically unsaturated monomer (B) and a photopolymerization initiator (C). The resin (A) includes an alkali-soluble resin (A-1). The alkali-soluble resin (A-1) includes a structural unit represented by following Formula (A1), a structural unit represented by following Formula (A2) or a combination thereof. The ethylenically unsaturated monomer (B) includes a compound represented by following Formula (B1). In Formula (A1), Formula (A2) and Formula (B1), the definition of R1 to R6, X1, Y1, Y2, m, n and * are the same as defined in the detailed description.

Abstract: A resin composition and a cured film are provided. The resin composition includes a monomer mixture (A), a siloxane compound (B), a curing agent (C), and inorganic particles (D). The monomer mixture (A) includes a bisphenol fluorene compound (A-1) represented by Formula (I-1). The siloxane compound (B) has a group represented by Formula (II-a).

Abstract: A photosensitive resin composition for a development process, a spacer, a light conversion layer, and a light-emitting device are provided. The photosensitive resin composition includes an alkali-soluble resin (A), an ethylenically-unsaturated monomer (B), a photopolymerization initiator (C), a solvent (D), and a pigment (E). The alkali-soluble resin (A) includes an alkali-soluble resin (A-1), wherein the alkali-soluble resin (A-1) includes a structural unit represented by formula (I-1) and a structural unit represented by formula (I-2). The photopolymerization initiator (C) includes an acylphosphine oxide compound represented by formula (III-1).