Abstract: Disclosed are LEDs and LED packages, and methods of making them, having improved resistance to infiltration by chemical entities comprising providing a coating on at least a portion of the LED chip or an LED chip package formed by co-polymerization of: (a) one or more hydrofluoroolefin monomer(s) selected from the group consisting of tetrafluoroethylene, hydrofluoroethylenes, hydrofluoropropenes, hydrofluorobutenes, hydrofluoropentenes and combinations of these; (b) optionally one or more chlorofluoroethylene monomers; (c) optionally one or more vinyl ester monomer(s); and (d) optionally one or more vinyl ether monomer(s), wherein at least a portion of said vinyl ether monomer is preferably a hydroxyl group-containing vinyl ether monomer and preferably at least one of (b) and (d) is present.