Patents by Inventor Ya-Ru Huang
Ya-Ru Huang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11943935Abstract: A layout pattern of a magnetoresistive random access memory (MRAM) includes a substrate having a first cell region, a second cell region, a third cell region, and a fourth cell region and a diffusion region on the substrate extending through the first cell region, the second cell region, the third cell region, and the fourth cell region. Preferably, the diffusion region includes a H-shape according to a top view.Type: GrantFiled: September 26, 2022Date of Patent: March 26, 2024Assignee: UNITED MICROELECTRONICS CORP.Inventors: Chun-Yen Tseng, Shu-Ru Wang, Yu-Tse Kuo, Chang-Hung Chen, Yi-Ting Wu, Shu-Wei Yeh, Ya-Lan Chiou, Chun-Hsien Huang
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Patent number: 11930663Abstract: A display panel includes a first substrate, pixel structures, a first common pad, a second substrate, a second common electrode, a display medium and a conductive particle. The pixel structures are disposed on an active area of the first substrate. The first common pad is disposed on a peripheral area of the first substrate, and is electrically connected to first common electrodes of the pixel structures. The second common electrode is disposed on the second substrate. The conductive particle is disposed on the first common pad, and is electrically connected to the first common pad and the second common electrode. The conductive particle includes a core and a conductive film disposed on a surface of the core, where the conductive film has a main portion and raised portions, and a film thickness of each of the raised portions is greater than a film thickness of the main portion.Type: GrantFiled: April 9, 2021Date of Patent: March 12, 2024Assignee: Au Optronics CorporationInventors: Bo-Chen Chen, Yun-Ru Cheng, Ya-Ling Hsu, Chia-Hsuan Pai, Cheng-Wei Huang, Wei-Shan Chao
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Publication number: 20140091822Abstract: A blade type micro probe and a method of manufacturing the same are disclosed. The method includes forming a plating seed layer on a substrate, a first blade structure on the plating seed layer and a second blade structure on the first blade structure, wherein the first blade structure includes a first second patterned photo resist layer and a metal layer filling up the voids in the first second patterned photo resist layer and the second blade structure includes a second patterned photo resist layer and an another metal layer filling up the voids in the second patterned photo resist layer, then removing the first and second patterned photo resist layers, and finally removing the plating seed layer and the substrate, thereby forming the blade type micro probe. The first patterned photo resist layer is different from the second patterned photo resist layer in shape.Type: ApplicationFiled: September 28, 2012Publication date: April 3, 2014Inventors: Horng-Jee Wang, Ya-Ru Huang
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Patent number: 7671612Abstract: An integrated compound nano probe card is disclosed to include a substrate layer having a front side and a back side, and compound probe pins arranged in the substrate layer. Each compound probe pin has a bundle of aligned parallel nanotubes/nanorods and a bonding material bonded to the bundle of aligned parallel nanotubes/nanorods and filled in gaps in the nanotubes/nanorods. Each compound probe pin has a base end exposed on the back side of the substrate layer and a distal end spaced above the front side of the substrate layer.Type: GrantFiled: February 20, 2008Date of Patent: March 2, 2010Assignee: Industrial Technology Research InstituteInventors: Horng-Jee Wang, Ya-Ru Huang, Min-Chieh Chou
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Patent number: 7652492Abstract: An integrated compound nano probe card is disclosed to include a substrate layer having a front side and a back side, and compound probe pins arranged in the substrate layer. Each compound probe pin has a bundle of aligned parallel nanotubes/nanorods and a bonding material bonded to the bundle of aligned parallel nanotubes/nanorods and filled in gaps in the nanotubes/nanorods. Each compound probe pin has a base end exposed on the back side of the substrate layer and a distal end spaced above the front side of the substrate layer.Type: GrantFiled: February 20, 2008Date of Patent: January 26, 2010Assignee: Industrial Technology Research InstituteInventors: Horng-Jee Wang, Ya-Ru Huang, Min-Chieh Chou
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Patent number: 7585548Abstract: An integrated compound nano probe card is disclosed to include a substrate layer having a front side and a back side, and compound probe pins arranged in the substrate layer. Each compound probe pin has a bundle of aligned parallel nanotubes/nanorods and a bonding material bonded to the bundle of aligned parallel nanotubes/nanorods and filled in gaps in the nanotubes/nanorods. Each compound probe pin has a base end exposed on the back side of the substrate layer and a distal end spaced above the front side of the substrate layer.Type: GrantFiled: February 20, 2008Date of Patent: September 8, 2009Assignee: Industrial Technology Research InstituteInventors: Horng-Jee Wang, Ya-Ru Huang, Min-Chieh Chou
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Publication number: 20090121734Abstract: An integrated compound nano probe card is disclosed to include a substrate layer having a front side and a back side, and compound probe pins arranged in the substrate layer. Each compound probe pin has a bundle of aligned parallel nanotubes/nanorods and a bonding material bonded to the bundle of aligned parallel nanotubes/nanorods and filled in gaps in the nanotubes/nanorods. Each compound probe pin has a base end exposed on the back side of the substrate layer and a distal end spaced above the front side of the substrate layer.Type: ApplicationFiled: February 20, 2008Publication date: May 14, 2009Applicant: Industrial Technology Research InstituteInventors: Horng-Jee Wang, Ya-Ru Huang, Min-Chieh Chou
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Publication number: 20090002004Abstract: An integrated compound nano probe card is disclosed to include a substrate layer having a front side and a back side, and compound probe pins arranged in the substrate layer. Each compound probe pin has a bundle of aligned parallel nanotubes/nanorods and a bonding material bonded to the bundle of aligned parallel nanotubes/nanorods and filled in gaps in the nanotubes/nanorods. Each compound probe pin has a base end exposed on the back side of the substrate layer and a distal end spaced above the front side of the substrate layer.Type: ApplicationFiled: February 20, 2008Publication date: January 1, 2009Applicant: Industrial Technology Research InstituteInventors: Horng-Jee Wang, Ya-Ru Huang, Min-Chieh Chou
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Patent number: 7400159Abstract: An integrated complex nano probe card is disclosed to include a substrate layer having a front side and a back side, and complex probe pins arranged in the substrate layer. Each complex probe pin has a bundle of aligned parallel nanotubes/nanorods and a bonding material bonded to the bundle of aligned parallel nanotubes/nanorods and filled in gaps in the nanotubes/nanorods. Each complex probe pin has a base end exposed on the back side of the substrate layer and a distal end spaced above the front side of the substrate layer.Type: GrantFiled: March 21, 2003Date of Patent: July 15, 2008Assignee: Industrial Technology Research InstituteInventors: Horng-Jee Wang, Ya-Ru Huang, Min-Chieh Chou
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Publication number: 20080160195Abstract: An integrated compound nano probe card is disclosed to include a substrate layer having a front side and a back side, and compound probe pins arranged in the substrate layer. Each compound probe pin has a bundle of aligned parallel nanotubes/nanorods and a bonding material bonded to the bundle of aligned parallel nanotubes/nanorods and filled in gaps in the nanotubes/nanorods. Each compound probe pin has a base end exposed on the back side of the substrate layer and a distal end spaced above the front side of the substrate layer.Type: ApplicationFiled: February 20, 2008Publication date: July 3, 2008Applicant: Industrial Technology Research InstituteInventors: Horng-Jee Wang, Ya-Ru Huang, Min-Chieh Chou
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Publication number: 20040106218Abstract: An integrated compound nano probe card is disclosed to include a substrate layer having a front side and a back side, and compound probe pins arranged in the substrate layer. Each compound probe pin has a bundle of aligned parallel nanotubes/nanorods and a bonding material bonded to the bundle of aligned parallel nanotubes/nanorods and filled in gaps in the nanotubes/nanorods. Each compound probe pin has a base end exposed on the back side of the substrate layer and a distal end spaced above the front side of the substrate layer.Type: ApplicationFiled: March 21, 2003Publication date: June 3, 2004Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Horng-Jee Wang, Ya-Ru Huang, Min-Chieh Chou
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Patent number: 6699379Abstract: An improved plating method in combination with a low-temperature thermal treatment is disclosed. The method for reducing the stress in the nickel-based alloy plating comprises the steps of: (a) adding ceramic particles into a plating bath containing soluble nickel salts; and (b) placing a substrate in the plating bath and thereafter carrying out a pulse-current electroplating in the plating bath. The method of this invention can prevent substrate softening or deformation problems. The use of a post low-temperature thermal treatment can slightly increase the hardness of the coating products. The use of the low-temperature thermal treatment can reduce the stress of the coatings since the hydrogen embrittlement resulting from exist of hydrogen in the coatings is eliminated.Type: GrantFiled: November 25, 2002Date of Patent: March 2, 2004Assignee: Industrial Technology Research InstituteInventors: Shih-Tsung Ke, Jen-Chih Li, Ming-Der Ger, Le-Min Wang, Yeh Sung, Jauh-Jung Yang, Ya-Ru Huang
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Patent number: 6584250Abstract: An optical fiber alignment element using integrated micro ball lens includes a substrate and a plurality of V-shaped grooves or waveguides formed on the substrate by lithography and etching. The substrate surface is coated with a first polymer layer and a high transparency second polymer layer, then is processed through a lithography process and heating process to form at least a base pad and a spherical micro ball lens between the V-shaped grooves or waveguides. Then dispose optical fibers in the V-shaped grooves. And encase an upper cap over the micro ball lens, grooves, and optical fibers or waveguides. Through suitable configuration and positioning of the micro ball lens, grooves or waveguides, the micro ball lens may be aligned precisely between two sides of the optical fibers or waveguides. The process is simpler, more accurate, and may produce the optical fiber alignment element in an integrated and batch fashion.Type: GrantFiled: February 20, 2001Date of Patent: June 24, 2003Assignee: Industrial Technology Research InstituteInventors: Yuh-Sheng Lin, Cheng-Chun Huang, Ming-Yueh Liu, Jauh-Jung Yang, Chuan-Kang Mu, Ya-Ru Huang
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Publication number: 20020114578Abstract: An optical fiber alignment element using integrated micro ball lens includes a substrate and a plurality of V-shaped grooves or waveguides formed on the substrate by lithography and etching. The substrate surface is coated with a first polymer layer and a high transparency second polymer layer, then is processed through a lithography process and heating process to form at least a base pad and a spherical micro ball lens between the V-shaped grooves or waveguides. Then dispose optical fibers in the V-shaped grooves. And encase an upper cap over the micro ball lens, grooves, and optical fibers or waveguides. Through suitable configuration and positioning of the micro ball lens, grooves or waveguides, the micro ball lens may be aligned precisely between two sides of the optical fibers or waveguides. The process is simpler, more accurate, and may produce the optical fiber alignment element in an integrated and batch fashion.Type: ApplicationFiled: February 20, 2001Publication date: August 22, 2002Inventors: Yuh-Sheng Lin, Cheng-Chun Huang, Ming-Yueh Liu, Jauh-Jung Yang, Chuan-Kang Mu, Ya-Ru Huang
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Patent number: 6287896Abstract: The present invention is related to a method for manufacturing lead frames and a lead frame material including an intermediate layer and a top layer. The intermediate layer is composed of a layer of nickel-cobalt alloy having 5 to 30 wt. % of cobalt and a thickness of 3 to 20 microinches and a layer of nickel or nickel alloy having a thickness of 10 to 80 microinches. The intermediate layer can inhibit the diffusion of the base metal to the surface of the leads. The top layer consisting of gold or gold alloy, which is composed of gold and at least one metal selected from the group consisting of palladium, silver, tin and copper and has at least 60 weight percent gold, has a thickness of 0.1 to 5 microinches.Type: GrantFiled: September 13, 1999Date of Patent: September 11, 2001Assignee: Industrial Technology Research InstituteInventors: Shinn-Horng Yeh, Shu-Chin Chou, Ya-Ru Huang, Yu-Yu Lin