Abstract: An atomizer having an air pressure surge bin and an application thereof. The atomizer includes a supporting housing; an hollow atomization chamber with walls, and an air pressure surge bin communicated with a bottom of the atomization chamber is arranged below the atomization chamber; a smoke channel, with an inlet end communicated with the atomization chamber and an outlet end configured for smoking; an air inlet channel located below the atomization chamber, with an air inlet configured for introducing external air and an air outlet communicated with the atomization chamber; an e-liquid bin enclosed by an outer wall of the smoke channel, an outer wall of the atomization chamber, and an inner wall of the supporting housing; an e-liquid guiding member arranged inside the atomization chamber and communicated with the e-liquid bin, which is connected to a heating component for heating and atomizing e-liquid in the e-liquid guiding member.

Abstract: A semiconductor package structure includes a substrate having a patterned surface, the patterned surface including a first region and a second region, wherein a first line width in the first region is smaller than a second line width in the second region. The semiconductor package structure further includes a first die hybrid-bonded to the first region through conductive features adapted for the first line width, and a second die bonded to the second region through conductive features adapted for the second line width. The manufacturing operations of the semiconductor package structure are also disclosed.

Abstract: A semiconductor package structure includes a substrate having a patterned surface, the patterned surface including a first region and a second region, wherein a first line width in the first region is smaller than a second line width in the second region. The semiconductor package structure further includes a first die hybrid-bonded to the first region through conductive features adapted for the first line width, and a second die bonded to the second region through conductive features adapted for the second line width. The manufacturing operations of the semiconductor package structure are also disclosed.