Abstract: A layout pattern of a magnetoresistive random access memory (MRAM) includes a substrate having a first cell region, a second cell region, a third cell region, and a fourth cell region and a diffusion region on the substrate extending through the first cell region, the second cell region, the third cell region, and the fourth cell region. Preferably, the diffusion region includes a H-shape according to a top view.

Abstract: According to the present disclosure, a measuring method of liquid mixture purity includes steps as follows. A storage tank is provided, wherein the storage tank is configured for storing a liquid mixture including formic acid and water. A calculating unit is provided, wherein a plurality of formic acid purity values are saved in the calculating unit. A pressure-decreasing and heating step is performed by reducing a pressure of the storage tank and heating the storage tank. A measuring step is performed by measuring in the inner space of the storage tank to obtain a pressure value, and measuring the liquid mixture simultaneously to obtain a temperature value. A calculating step is performed by inputting the pressure value and the temperature value into the calculating unit, wherein the calculating unit outputs one of the formic acid purity values corresponding thereto.

Abstract: The application discloses examples of a device housing of an electronic device including a magnesium-alloy substrate. The device housing further including a treatment layer applied over the magnesium-alloy substrate and a metallic coating layer applied over the treatment layer to provide a metallic luster. Further, a paint coating layer is disposed over a first portion of the metallic coating layer. Further, a top coating layer is applied over the paint coating layer and a visible second portion of the metallic coating layer.

Abstract: An electrical device and an operation control method are provided. The electronic device includes a touch module and a processor. The touch module includes a touchable region. The touchable region is divided into at least a first touchable region and a second touchable region. The first touchable region is configured to implement a first function. The second touchable region is configured to implement the first function and a second function. The processor is electrically connected to the touch module. When at least one first touch point is detected in the first touchable region, at least one second touch point is detected in the second touchable region, and the processor determines that a distance between the first touch point and the second touch point is within a predetermined distance, the second touchable region is switched to implementing the first function.

Abstract: The present disclosure is drawn to covers for electronic devices. In one example, a cover for an electronic device can include an aluminum or aluminum alloy cover frame having an opening. A magnesium or magnesium alloy cover panel supported by the aluminum or aluminum alloy cover frame within or over the opening. A protective coating can be over a surface of the aluminum or aluminum alloy cover frame and a surface of the magnesium or magnesium alloy cover panel. A chamfered edge can include a chamfer at an edge of the aluminum or aluminum alloy cover frame. The chamfer can expose the aluminum or aluminum alloy cover frame beneath the protective coating, and the chamfer at the same time does not expose the magnesium or magnesium alloy cover panel.

Abstract: The present disclosure is drawn to covers for electronic, devices, methods of making the covers, and electronic devices, in one example, described herein Is a cover for an electronic device comprising: a substrate; a micro-arc oxidation layer applied on at least one surface of the substrate; and a dyeing layer on the micro-arc oxidation layer, wherein the dyeing layer comprises: from about 3 to about 10 wt% wafer based dyes based on the total weight of the dyeing layer; and from about 0.3 wt % to about 2 wt% surfactant based on the total weight of the dyeing layer.

Abstract: This application describes covers for electronic devices, electronic devices, and methods for making the covers. In one example, a cover comprises a substrate comprising a first metal; a second metal injection molded 10 on the surface of the substrate; a paint layer or an electrophoretic deposition layer on the second metal surface; a chamfered edge on the substrate, wherein the chamfered edge cuts through the paint layer or the electrophoretic deposition layer, the second metal, and partially through the first metal; and a hydrophobic coating.

Abstract: Examples of an anti-fingerprint enclosure for an electronic device have been described. In an example, the enclosure comprises an aluminum alloy substrate; a sealing layer deposited on a surface of the aluminum alloy substrate; and a magnesium fluoride sol-gel derived film deposited on the sealing layer, wherein the magnesium fluoride sol-gel derived film exhibits a refractive index of from about 1.36 to about 1.44.

Abstract: In one example, a device housing is described, which may include a base substrate and ion-exchanged glass beads disposed on an outer surface of the base substrate.

Abstract: Examples of an alloy injection molded liquid metal substrate are described. In an example, an alloy injection molded liquid metal substrate includes a liquid metal substrate and an alloy injection molded on a first surface of the liquid metal substrate.

Abstract: The present disclosure is drawn to covers for electronic devices. In one example, a cover for an electronic device can include an aluminum or aluminum alloy cover frame having an opening. A magnesium or magnesium alloy cover panel supported by the aluminum or aluminum alloy cover frame within or over the opening. A protective coating can be over a surface of the aluminum or aluminum alloy cover frame and a surface of the magnesium or magnesium alloy cover panel. A chamfered edge can include a chamfer at an edge of the aluminum or aluminum alloy cover frame. The chamfer can expose the aluminum or aluminum alloy cover frame beneath the protective coating, and the chamfer at the same time does not expose the magnesium or magnesium alloy cover panel.

Abstract: The present disclosure is drawn to covers for electronic devices. In one example, a cover for an electronic device can include an enclosure with a light metal substrate joined with an insert molding plastic part, and a protective treatment layer on the light metal substrate and the insert molding plastic part. A transparent primer coating on the protective treatment layer, and a paint coating on the transparent primer coating. A milled edge along the insert molding plastic part, wherein the milled edge cuts through the paint coating to expose the transparent primer coating.

Abstract: The application discloses examples of a device housing of an electronic device comprising a magnesium-alloy substrate. The device housing further comprising a treatment layer applied over the magnesium-alloy substrate and a metallic coating layer applied over the treatment layer to provide a metallic luster. Further, a paint coating layer is disposed over a first portion of the metallic coating layer. Further, a top coating layer is applied over the paint coating layer and a visible second portion of the metallic coating layer.

Abstract: The present subject matter relates to Nickel-free (Ni-free) sealing of anodized metal substrates. In an example mentation of the present subject matter, an anodized metal substrate is disposed with a first layer of a Ni-free sealing material over a surface of the anodized metal substrate. Further, a second layer of a second sealing material is disposed atop the first layer to sandwich the first layer of Ni-free sealing material between the surface of the anodized metal substrate and the second layer, to form a sealed metal substrate.

Abstract: Examples of shutter assembly are described herein. In an example, the shutter assembly includes an opening having a magnetic rubber-based shutter disposed in the opening. The magnetic rubber-based shutter is slidable along a length of the opening to selectively cover and expose the camera.

Abstract: Examples of shutter assembly are described herein. In an example, the shutter assembly includes an opening having a magnetic rubber-based shutter disposed in the opening. The magnetic rubber-based shutter is slidable along a length of the opening to selectively cover and expose the camera.

Abstract: In one example, a hinge assembly may include a first hinge member and a second hinge member. The first hinge member may include a first hinge base and a first hinge bracket pivotally connected to the first hinge base. The second hinge member may include a second hinge base and a second hinge bracket pivotally connected to the second hinge base. Further, the hinge assembly may include a hydraulic unit connected between the first hinge member and the second hinge member to provide synchronous movements between the first hinge bracket and the second hinge bracket.

Abstract: In one example, a device housing is described, which may include a base substrate and ion-exchanged glass beads disposed on an outer surface of the base substrate.

Abstract: In one example, an electronic device housing is described, which may include a substrate having a surface and at least one waterborne metallic paint coating formed on the surface of the substrate. The at least one waterborne metallic paint coating may include an insulating material encapsulated metal powder in combination with at least one of a surface modified synthetic mica and a surface modified glass platelet.

Abstract: In one example, a kickstand for a portable electronic device is disclosed which includes a body portion rotatably connected to the portable electronic device. The body portion defines at least one recess. Further, the kickstand includes at least one rubber magnet disposed within the at least one recess. The at least one rubber magnet, when located in close proximity to the portable electronic device, interacts magnetically with at least one magnetic material included within the portable electronic device.