Patents by Inventor Ya-Tung I

Ya-Tung I has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10477710
    Abstract: An electronic module includes first and second shells respectively having first and second edge surfaces with respective first and second joint units jointed together by ultrasonic welding. The first joint unit has first and second projection portions on the first edge surface, a first indentation portion between the first and second projection portions, and a bump on the second projection portion. The second joint unit complementarily engages the first joint unit. First and second bonding layers are respectively formed between the first indentation portion and the second joint unit and between the second projection portion and the second joint unit. Waterproof cable assemblies are mounted to the shells.
    Type: Grant
    Filed: August 7, 2018
    Date of Patent: November 12, 2019
    Assignees: Lite-On Electronics (Guangzhou) Limited, Lite-On Technology Corp.
    Inventors: Ya-Tung I, Chien-Hua Chu
  • Patent number: 10375846
    Abstract: A housing includes a first surrounding wall connected around a base wall. The first surrounding wall has a first joint portion opposite to the base wall, a first outer surface and a first inner surface. The first outer and inner surfaces extend from the first joint portion toward the base wall. The first joint portion is stepped and has a first projecting portion adjoining the first outer surface, and a first shoulder portion indented from the first projecting portion and proximal to the first inner surface. The first shoulder portion has a plurality of parallel spaced-apart ribs protruding therefrom in a same direction as the first projecting portion. Each of the ribs has a tip that does not extend beyond a top end of the first projecting portion.
    Type: Grant
    Filed: October 3, 2017
    Date of Patent: August 6, 2019
    Assignees: Lite-On Electronics (Guangzhou) Limited, Lite-On Technology Corp.
    Inventors: Ya-Tung I, Chien-Hua Chu
  • Publication number: 20180343757
    Abstract: An electronic module includes first and second shells respectively having first and second edge surfaces with respective first and second joint units jointed together by ultrasonic welding. The first joint unit has first and second projection portions on the first edge surface, a first indentation portion between the first and second projection portions, and a bump on the second projection portion. The second joint unit complementarily engages the first joint unit. First and second bonding layers are respectively formed between the first indentation portion and the second joint unit and between the second projection portion and the second joint unit. Waterproof cable assemblies are mounted to the shells.
    Type: Application
    Filed: August 7, 2018
    Publication date: November 29, 2018
    Inventors: YA-TUNG I, CHIEN-HUA CHU
  • Publication number: 20180206349
    Abstract: A housing includes a first surrounding wall connected around a base wall. The first surrounding wall has a first joint portion opposite to the base wall, a first outer surface and a first inner surface. The first outer and inner surfaces extend from the first joint portion toward the base wall. The first joint portion is stepped and has a first projecting portion adjoining the first outer surface, and a first shoulder portion indented from the first projecting portion and proximal to the first inner surface. The first shoulder portion has a plurality of parallel spaced-apart ribs protruding therefrom in a same direction as the first projecting portion. Each of the ribs has a tip that does not extend beyond a top end of the first projecting portion.
    Type: Application
    Filed: October 3, 2017
    Publication date: July 19, 2018
    Inventors: YA-TUNG I, CHIEN-HUA CHU
  • Patent number: 9137928
    Abstract: The instant disclosure relates to a planar heat dissipation structure, which comprises a first electrically insulating and thermally conductive layer having a thermal conductivity coefficient greater than 0.5 W/mK and a metal layer chemically bonded to and in thermal contact with the first electrically insulating and thermally conductive layer. The planar heat dissipation structure forms a one-piece structure that is configurable from a substantially planar collapsed state to a folded three-dimensional state, and defines a base portion and at least one flap portion configured to be foldable with respect to the base portion thereon, such that the first electrically insulating and thermally conductive layer constitutes an inner surface of the planar heat dissipation structure to define a covering space. The instant disclosure also discloses an electronic device that utilizes said foldable planar heat dissipation structure.
    Type: Grant
    Filed: June 26, 2013
    Date of Patent: September 15, 2015
    Assignees: LITE-ON ELECTRONICS (GUANGZHOU) LIMITED, LITE-ON TECHNOLOGY CORPORATION
    Inventors: Wen-Chi Chen, Yi-Jen Lu, Ya-Tung I
  • Publication number: 20140009891
    Abstract: The instant disclosure relates to a planar heat dissipation structure, which comprises a first electrically insulating and thermally conductive layer having a thermal conductivity coefficient greater than 0.5 W/mK and a metal layer chemically bonded to and in thermal contact with the first electrically insulating and thermally conductive layer. The planar heat dissipation structure forms a one-piece structure that is configurable from a substantially planar collapsed state to a folded three-dimensional state, and defines a base portion and at least one flap portion configured to be foldable with respect to the base portion thereon, such that the first electrically insulating and thermally conductive layer constitutes an inner surface of the planar heat dissipation structure to define a covering space. The instant disclosure also discloses an electronic device that utilizes said foldable planar heat dissipation structure.
    Type: Application
    Filed: June 26, 2013
    Publication date: January 9, 2014
    Inventors: WEN-CHI CHEN, YI-JEN LU, YA-TUNG I
  • Publication number: 20120147565
    Abstract: A heat dissipation and temperature-homogenizing structure which includes a body made of a material with low thermal conductivity and a heat conducting member made of a material with high thermal conductivity is disclosed. The body has opposite inner surfaces and outer surfaces. The heat conducting member is embedded inside the body and is completely surrounded between the inner surfaces and the outer surfaces. When the electronic device generates heat, the heat is firstly transferred to the heat conducting member from the inner surfaces, and then rapidly and evenly spreads over the heat conducting member. Finally, the heat inside the heat conducting member is uniformly dissipated through the outer surfaces. Accordingly, the heat dissipation and temperature-homogenizing structure may effectively and evenly spread the heat over the outer surfaces for exchanging heat with the ambient.
    Type: Application
    Filed: December 6, 2011
    Publication date: June 14, 2012
    Applicants: LITE-ON TECHNOLOGY CORPORATION, SILITEK ELECTRONIC (GZ) CO., LTD.
    Inventors: Ya-Tung I, Wen-Chi Chen, Chien-Chung Hsu, Yi-Jen Lu, Pao-Hsiu Fan
  • Publication number: 20110253413
    Abstract: Instantly disclosed power supply utilizes a breathable water repelling structure to provide obstruction-less air passage while preventing undesirable intrusion of water/fluids, thus enabling more secure and efficient heat-dissipation. The power supply includes a housing unit having at least one ventilation port; an electronic module disposed in the housing unit; at least one breathable water-repelling membrane unit sealingly covering the ventilation port; and at least one membrane protection unit correspondingly arranged over the breathable water-repelling membrane unit. The power supply can further include a fire-resisting member to prevent the breathable water-repelling membrane unit from catching fire.
    Type: Application
    Filed: April 14, 2011
    Publication date: October 20, 2011
    Applicant: LITE-ON TECHNOLOGY CORPORATION
    Inventors: Yi-Jen LU, Ya-Tung I, Wen-Chi Chen
  • Publication number: 20090128496
    Abstract: A light-emitting keyboard includes a plurality of keys, a circuit switch module, and at least one light-emitting element. The circuit switch module is disposed below the keys and is depressible by the keys so as to transmit corresponding electrical signals. The circuit switch module includes at least one light-transmissive flexible circuit board. The flexible circuit board has a lower surface that is formed with at least one light reflecting point corresponding to a respective one of the keys. The light-emitting element is either disposed adjacent to a lateral edge of the flexible circuit board or embedded in the flexible circuit board to provide light into the flexible circuit board such that the light is propagated in the flexible circuit board and is scattered upward by the light-reflecting point.
    Type: Application
    Filed: February 21, 2008
    Publication date: May 21, 2009
    Inventors: Chen-Hua Huang, Chang-Hung Pan, Ya-Tung I
  • Patent number: 7486500
    Abstract: An assembly structure for assembling a first plastic shell and a second plastic shell, thereby coupling articles to be assembled such as keyboards and adapters, including a hollow strut and an opening. The first plastic shell has the hollow strut extended from the inner side. The second plastic shell has the opening defined therein and corresponding to the hollow strut and extends inwards to form an annular flange abutting the hollow strut. The hollow strut has a portion extended through the annular flange to be melted by the ultrasonic welding technique, the thermal welding technique, or the combination thereof until reaching the annular flange, to couple the first and second plastic shells for facilitating assembly. Grinding off the melted portion may disassemble the first and second plastic shells. The disassembled the first and second plastic shells may be coupled again by fastening a fastening element in the hollow strut with the head of the fastening element held by the annular flange.
    Type: Grant
    Filed: December 13, 2004
    Date of Patent: February 3, 2009
    Assignee: Lite-On Technology Corporation
    Inventor: Ya-Tung I
  • Publication number: 20060053623
    Abstract: An assembly structure for coupling articles to be assembled such as keyboards and adapters, including a first and a second plastic shell. The first plastic shell has a hollow strut extended from the inner side. The second plastic shell has an opening corresponding to the hollow strut and extends inwards to form an annular flange abutting the hollow strut. The hollow strut has a portion extended through the annular flange to be melted by the ultrasonic welding technique, the thermal welding technique, or the combination thereof until reaching the annular flange, to couple the first and second plastic shells for facilitating assembly. Grinding off the melted portion may disassemble the first and second plastic shells. The disassembled the first and second plastic shells may be coupled again by fastening a fastening element in the hollow strut with the head of the fastening element held by the annular flange.
    Type: Application
    Filed: December 13, 2004
    Publication date: March 16, 2006
    Applicant: Lite-On Technology Corporation
    Inventor: Ya-Tung I