Patents by Inventor Ya-Tung I
Ya-Tung I has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10477710Abstract: An electronic module includes first and second shells respectively having first and second edge surfaces with respective first and second joint units jointed together by ultrasonic welding. The first joint unit has first and second projection portions on the first edge surface, a first indentation portion between the first and second projection portions, and a bump on the second projection portion. The second joint unit complementarily engages the first joint unit. First and second bonding layers are respectively formed between the first indentation portion and the second joint unit and between the second projection portion and the second joint unit. Waterproof cable assemblies are mounted to the shells.Type: GrantFiled: August 7, 2018Date of Patent: November 12, 2019Assignees: Lite-On Electronics (Guangzhou) Limited, Lite-On Technology Corp.Inventors: Ya-Tung I, Chien-Hua Chu
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Patent number: 10375846Abstract: A housing includes a first surrounding wall connected around a base wall. The first surrounding wall has a first joint portion opposite to the base wall, a first outer surface and a first inner surface. The first outer and inner surfaces extend from the first joint portion toward the base wall. The first joint portion is stepped and has a first projecting portion adjoining the first outer surface, and a first shoulder portion indented from the first projecting portion and proximal to the first inner surface. The first shoulder portion has a plurality of parallel spaced-apart ribs protruding therefrom in a same direction as the first projecting portion. Each of the ribs has a tip that does not extend beyond a top end of the first projecting portion.Type: GrantFiled: October 3, 2017Date of Patent: August 6, 2019Assignees: Lite-On Electronics (Guangzhou) Limited, Lite-On Technology Corp.Inventors: Ya-Tung I, Chien-Hua Chu
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Publication number: 20180343757Abstract: An electronic module includes first and second shells respectively having first and second edge surfaces with respective first and second joint units jointed together by ultrasonic welding. The first joint unit has first and second projection portions on the first edge surface, a first indentation portion between the first and second projection portions, and a bump on the second projection portion. The second joint unit complementarily engages the first joint unit. First and second bonding layers are respectively formed between the first indentation portion and the second joint unit and between the second projection portion and the second joint unit. Waterproof cable assemblies are mounted to the shells.Type: ApplicationFiled: August 7, 2018Publication date: November 29, 2018Inventors: YA-TUNG I, CHIEN-HUA CHU
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Publication number: 20180206349Abstract: A housing includes a first surrounding wall connected around a base wall. The first surrounding wall has a first joint portion opposite to the base wall, a first outer surface and a first inner surface. The first outer and inner surfaces extend from the first joint portion toward the base wall. The first joint portion is stepped and has a first projecting portion adjoining the first outer surface, and a first shoulder portion indented from the first projecting portion and proximal to the first inner surface. The first shoulder portion has a plurality of parallel spaced-apart ribs protruding therefrom in a same direction as the first projecting portion. Each of the ribs has a tip that does not extend beyond a top end of the first projecting portion.Type: ApplicationFiled: October 3, 2017Publication date: July 19, 2018Inventors: YA-TUNG I, CHIEN-HUA CHU
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Patent number: 9137928Abstract: The instant disclosure relates to a planar heat dissipation structure, which comprises a first electrically insulating and thermally conductive layer having a thermal conductivity coefficient greater than 0.5 W/mK and a metal layer chemically bonded to and in thermal contact with the first electrically insulating and thermally conductive layer. The planar heat dissipation structure forms a one-piece structure that is configurable from a substantially planar collapsed state to a folded three-dimensional state, and defines a base portion and at least one flap portion configured to be foldable with respect to the base portion thereon, such that the first electrically insulating and thermally conductive layer constitutes an inner surface of the planar heat dissipation structure to define a covering space. The instant disclosure also discloses an electronic device that utilizes said foldable planar heat dissipation structure.Type: GrantFiled: June 26, 2013Date of Patent: September 15, 2015Assignees: LITE-ON ELECTRONICS (GUANGZHOU) LIMITED, LITE-ON TECHNOLOGY CORPORATIONInventors: Wen-Chi Chen, Yi-Jen Lu, Ya-Tung I
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Publication number: 20140009891Abstract: The instant disclosure relates to a planar heat dissipation structure, which comprises a first electrically insulating and thermally conductive layer having a thermal conductivity coefficient greater than 0.5 W/mK and a metal layer chemically bonded to and in thermal contact with the first electrically insulating and thermally conductive layer. The planar heat dissipation structure forms a one-piece structure that is configurable from a substantially planar collapsed state to a folded three-dimensional state, and defines a base portion and at least one flap portion configured to be foldable with respect to the base portion thereon, such that the first electrically insulating and thermally conductive layer constitutes an inner surface of the planar heat dissipation structure to define a covering space. The instant disclosure also discloses an electronic device that utilizes said foldable planar heat dissipation structure.Type: ApplicationFiled: June 26, 2013Publication date: January 9, 2014Inventors: WEN-CHI CHEN, YI-JEN LU, YA-TUNG I
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Publication number: 20120147565Abstract: A heat dissipation and temperature-homogenizing structure which includes a body made of a material with low thermal conductivity and a heat conducting member made of a material with high thermal conductivity is disclosed. The body has opposite inner surfaces and outer surfaces. The heat conducting member is embedded inside the body and is completely surrounded between the inner surfaces and the outer surfaces. When the electronic device generates heat, the heat is firstly transferred to the heat conducting member from the inner surfaces, and then rapidly and evenly spreads over the heat conducting member. Finally, the heat inside the heat conducting member is uniformly dissipated through the outer surfaces. Accordingly, the heat dissipation and temperature-homogenizing structure may effectively and evenly spread the heat over the outer surfaces for exchanging heat with the ambient.Type: ApplicationFiled: December 6, 2011Publication date: June 14, 2012Applicants: LITE-ON TECHNOLOGY CORPORATION, SILITEK ELECTRONIC (GZ) CO., LTD.Inventors: Ya-Tung I, Wen-Chi Chen, Chien-Chung Hsu, Yi-Jen Lu, Pao-Hsiu Fan
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Publication number: 20110253413Abstract: Instantly disclosed power supply utilizes a breathable water repelling structure to provide obstruction-less air passage while preventing undesirable intrusion of water/fluids, thus enabling more secure and efficient heat-dissipation. The power supply includes a housing unit having at least one ventilation port; an electronic module disposed in the housing unit; at least one breathable water-repelling membrane unit sealingly covering the ventilation port; and at least one membrane protection unit correspondingly arranged over the breathable water-repelling membrane unit. The power supply can further include a fire-resisting member to prevent the breathable water-repelling membrane unit from catching fire.Type: ApplicationFiled: April 14, 2011Publication date: October 20, 2011Applicant: LITE-ON TECHNOLOGY CORPORATIONInventors: Yi-Jen LU, Ya-Tung I, Wen-Chi Chen
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Publication number: 20090128496Abstract: A light-emitting keyboard includes a plurality of keys, a circuit switch module, and at least one light-emitting element. The circuit switch module is disposed below the keys and is depressible by the keys so as to transmit corresponding electrical signals. The circuit switch module includes at least one light-transmissive flexible circuit board. The flexible circuit board has a lower surface that is formed with at least one light reflecting point corresponding to a respective one of the keys. The light-emitting element is either disposed adjacent to a lateral edge of the flexible circuit board or embedded in the flexible circuit board to provide light into the flexible circuit board such that the light is propagated in the flexible circuit board and is scattered upward by the light-reflecting point.Type: ApplicationFiled: February 21, 2008Publication date: May 21, 2009Inventors: Chen-Hua Huang, Chang-Hung Pan, Ya-Tung I
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Patent number: 7486500Abstract: An assembly structure for assembling a first plastic shell and a second plastic shell, thereby coupling articles to be assembled such as keyboards and adapters, including a hollow strut and an opening. The first plastic shell has the hollow strut extended from the inner side. The second plastic shell has the opening defined therein and corresponding to the hollow strut and extends inwards to form an annular flange abutting the hollow strut. The hollow strut has a portion extended through the annular flange to be melted by the ultrasonic welding technique, the thermal welding technique, or the combination thereof until reaching the annular flange, to couple the first and second plastic shells for facilitating assembly. Grinding off the melted portion may disassemble the first and second plastic shells. The disassembled the first and second plastic shells may be coupled again by fastening a fastening element in the hollow strut with the head of the fastening element held by the annular flange.Type: GrantFiled: December 13, 2004Date of Patent: February 3, 2009Assignee: Lite-On Technology CorporationInventor: Ya-Tung I
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Publication number: 20060053623Abstract: An assembly structure for coupling articles to be assembled such as keyboards and adapters, including a first and a second plastic shell. The first plastic shell has a hollow strut extended from the inner side. The second plastic shell has an opening corresponding to the hollow strut and extends inwards to form an annular flange abutting the hollow strut. The hollow strut has a portion extended through the annular flange to be melted by the ultrasonic welding technique, the thermal welding technique, or the combination thereof until reaching the annular flange, to couple the first and second plastic shells for facilitating assembly. Grinding off the melted portion may disassemble the first and second plastic shells. The disassembled the first and second plastic shells may be coupled again by fastening a fastening element in the hollow strut with the head of the fastening element held by the annular flange.Type: ApplicationFiled: December 13, 2004Publication date: March 16, 2006Applicant: Lite-On Technology CorporationInventor: Ya-Tung I