Abstract: An inductor and a power module are respectively provided. The inductor includes an insulating body and a conductive body. The insulating body has a top surface and a bottom surface. The conductive body includes two pin parts and a heat dissipation part. A portion of each of the pin parts is exposed outside the bottom surface. The portions of the two pin parts exposed outside the insulating body are configured to fix to a circuit board. The heat dissipation part is connected to the two pin parts, the heat dissipation part is exposed outside the top surface, and the heat dissipation part is configured to connect to an external heat dissipation member. When the inductor is fixed to the circuit board through the two pin parts exposed outside the bottom surface, the two pin parts and the bottom surface jointly define an accommodating space for accommodating a chip.

Abstract: A multi-phase inductor structure is provided. The multi-phase inductor structure includes a first magnetic core, two second magnetic cores, and two first electrical conductors. The two second magnetic cores are respectively arranged on opposite sides of the first magnetic core, and each have a first engagement surface. A first annular convex wall and a first upright convex wall are formed on the first engagement surface, and a first recess is formed therebetween. The two first electrical conductors are respectively arranged in two of the first recesses of the first engagement surface, and each have has a first body and two first pins that are respectively connected to two ends of the first body. The two first pins extend in opposite directions. A magnetic permeability of the first magnetic core is different from a magnetic permeability of each of the two second magnetic cores.

Abstract: An inductor and a power module are respectively provided. The inductor includes an insulating body and a conductive body. The insulating body has a top surface and a bottom surface. The conductive body includes two pin parts and a heat dissipation part. A portion of each of the pin parts is exposed outside the bottom surface. The portions of the two pin parts exposed outside the insulating body are configured to fix to a circuit board. The heat dissipation part is connected to the two pin parts, the heat dissipation part is exposed outside the top surface, and the heat dissipation part is configured to connect to an external heat dissipation member. When the inductor is fixed to the circuit board through the two pin parts exposed outside the bottom surface, the two pin parts and the bottom surface jointly define an accommodating space for accommodating a chip.

Abstract: A six-coordinated ruthenium complex is represented by the following formula (I): RuL1L2L3??(I) wherein L1 represents a 2,2?-bipyridine-based bidentate ligand having at least two functional groups selected from COOH, a carboxylate group and the combination thereof; and L2 and L3 independently represent a 1-(haloalkylpyrazole)-isoquinoline-based bidentate ligand of formula (II) or formula (III).