Patents by Inventor Ya-Wen Hsiao
Ya-Wen Hsiao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240371653Abstract: A method for manufacturing a semiconductor device includes depositing a hard mask layer on an upper surface of an insulating layer. The hard mask layer is etched to form an opening in the hard mask layer. A via recess is formed in the insulating layer through the opening. A first photoresist layer is formed on the hard mask layer and in the via recess. The first photoresist layer is etched to form a photoresist plug in the via recess. Two opposite sides of the opening are etched to remove portions of the hard mask layer and thereby a portion of the upper surface of the insulating layer is exposed. The photoresist plug is removed. Metal is deposited in the via recess and on the exposed surface of the insulating layer. The metal is patterned.Type: ApplicationFiled: July 19, 2024Publication date: November 7, 2024Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Chih-Min HSIAO, Chih-Ming LAI, Chien-Wen LAI, Ya Hui CHANG, Ru-Gun LIU
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Patent number: 12125712Abstract: A method for manufacturing a semiconductor device includes depositing a hard mask layer on an upper surface of an insulating layer. The hard mask layer is etched to form an opening in the hard mask layer. A via recess is formed in the insulating layer through the opening. A first photoresist layer is formed on the hard mask layer and in the via recess. The first photoresist layer is etched to form a photoresist plug in the via recess. Two opposite sides of the opening are etched to remove portions of the hard mask layer and thereby a portion of the upper surface of the insulating layer is exposed. The photoresist plug is removed. Metal is deposited in the via recess and on the exposed surface of the insulating layer. The metal is patterned.Type: GrantFiled: July 28, 2023Date of Patent: October 22, 2024Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Chih-Min Hsiao, Chih-Ming Lai, Chien-Wen Lai, Ya Hui Chang, Ru-Gun Liu
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Patent number: 11394118Abstract: A loop-like dual-antenna system is provided. The loop-like dual-antenna system includes a dielectric substrate having a first surface and a second surface opposite to each other. The loop radiating element includes a first radiating part with two ends and a second radiating part opposite to the first radiating part. A first signal source is disposed on the first surface of the dielectric substrate and electrically connected to two ends of the first radiating part. A grounding part is disposed on the second surface of the dielectric substrate and disposed on one side of the dielectric substrate away from the first signal source. A coupling matching element is disposed on the second surface of the dielectric substrate and adjacent to the grounding part, for coupling to and exciting the second radiating part. A second signal source, disposed on the second surface of the dielectric substrate, and electrically connected to the coupling matching element and the grounding part.Type: GrantFiled: October 19, 2020Date of Patent: July 19, 2022Assignee: ASUSTEK COMPUTER INC.Inventors: Ya-Wen Hsiao, Saou-Wen Su, Wei-Hsuan Chang
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Publication number: 20210126368Abstract: A loop-like dual-antenna system is provided. The loop-like dual-antenna system includes a dielectric substrate having a first surface and a second surface opposite to each other. The loop radiating element includes a first radiating part with two ends and a second radiating part opposite to the first radiating part. A first signal source is disposed on the first surface of the dielectric substrate and electrically connected to two ends of the first radiating part. A grounding part is disposed on the second surface of the dielectric substrate and disposed on one side of the dielectric substrate away from the first signal source. A coupling matching element is disposed on the second surface of the dielectric substrate and adjacent to the grounding part, for coupling to and exciting the second radiating part. A second signal source, disposed on the second surface of the dielectric substrate, and electrically connected to the coupling matching element and the grounding part.Type: ApplicationFiled: October 19, 2020Publication date: April 29, 2021Inventors: Ya-Wen Hsiao, Saou-Wen Su, Wei-Hsuan Chang
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Patent number: 10811774Abstract: This disclosure provides a loop antenna, including a substrate, and a grounding portion, a matching portion, a first radiating portion, a second radiating portion, and a feed portion that are located on the substrate. The first radiating portion includes a first radiating segment and a second radiating segment. The grounding portion includes a first grounding segment and a second grounding segment. The second grounding segment is perpendicularly connected to a first end of the first grounding segment. The matching portion is connected to a second end of the first grounding segment and the first radiating segment. The first radiating segment extends from the matching portion away from the first grounding segment. The second radiating segment extends from the first radiating segment toward the second grounding segment. There is a coupling gap between the second radiating portion and the second radiating segment, and the second radiating portion extends toward the second grounding segment.Type: GrantFiled: December 20, 2018Date of Patent: October 20, 2020Assignee: ASUSTEK COMPUTER INC.Inventors: Ya-Wen Hsiao, Saou-Wen Su, Cheng-Tse Lee
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Publication number: 20190214730Abstract: This disclosure provides a loop antenna, including a substrate, and a grounding portion, a matching portion, a first radiating portion, a second radiating portion, and a feed portion that are located on the substrate. The first radiating portion includes a first radiating segment and a second radiating segment. The grounding portion includes a first grounding segment and a second grounding segment. The second grounding segment is perpendicularly connected to a first end of the first grounding segment. The matching portion is connected to a second end of the first grounding segment and the first radiating segment. The first radiating segment extends from the matching portion away from the first grounding segment. The second radiating segment extends from the first radiating segment toward the second grounding segment. There is a coupling gap between the second radiating portion and the second radiating segment, and the second radiating portion extends toward the second grounding segment.Type: ApplicationFiled: December 20, 2018Publication date: July 11, 2019Inventors: Ya-Wen Hsiao, Saou-Wen Su, Cheng-Tse Lee
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Patent number: 7323450Abstract: Disclosed is a complex immuno-gene medical composition for activating NK cells to enhance a host immune system. The composition includes a plurality of cytokines, including Th1 and Th2 cytokines. Th2 cytokines antagonize TGF-? inhibiting NK cells to disable the inhibition of the immune system. Th1 cytokines activate NK cells in a host to enhance the host's ability to fight against tumor cells. By use of the complex immuno-gene medical composition, removal of tumor cells is expected.Type: GrantFiled: March 11, 2004Date of Patent: January 29, 2008Assignee: National Taiwan UniversityInventors: Rea-Min Chu, Ching-Yi Lin, Ya-Wen Hsiao, Kuang-Wen Liao
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Publication number: 20050203037Abstract: Disclosed is a complex immuno-gene medical composition activating NK cells to enhance host immune system. The composition is usage of a combination of a plurality of cytokines, combined usage of the kinds of Th1 and Th2 cytokines. Th2 cytokine antagonizes TGF-? inhibiting NK cells to disable the inhibition of immune system, and Th1 cytokine activates NK cells in host to enhance the ability fighting against tumor cells. By means of the complex immuno-gene medical composition, removal of tumor cells is expectable.Type: ApplicationFiled: March 11, 2004Publication date: September 15, 2005Inventors: Rea-Min Chu, Ching-Yi Lin, Ya-Wen Hsiao, Kuang-Wen Liao