Patents by Inventor Ya-Wen LIAO
Ya-Wen LIAO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240170829Abstract: The present disclosure provides an electronic package. The electronic package includes an antenna structure having a first antenna and a second antenna at least partially covered by the first antenna. The electronic package also includes a directing element covering the antenna structure. The directing element has a first portion configured to direct a first electromagnetic wave having a first frequency to transmit via the first antenna and a second portion configured to direct a second electromagnetic wave having a second frequency different from the first frequency to transmit via the second antenna. A method of manufacturing an electronic package is also provided.Type: ApplicationFiled: January 30, 2024Publication date: May 23, 2024Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Jenchun CHEN, Ya-Wen LIAO
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Publication number: 20240120640Abstract: An electronic device and a method for manufacturing the same are provided. The electronic device includes a carrier, an antenna element and a cladding element. The carrier defines a first area and a second area adjacent to the first area. The antenna element is in the first area. The cladding element covers the antenna element and is configured for enhancing antenna gain of the antenna element. The second area is exposed from the cladding element and is distant from the antenna element.Type: ApplicationFiled: December 18, 2023Publication date: April 11, 2024Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Jenchun CHEN, Ya-Wen LIAO
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Patent number: 11888210Abstract: The present disclosure provides an electronic package. The electronic package includes an antenna structure having a first antenna and a second antenna at least partially covered by the first antenna. The electronic package also includes a directing element covering the antenna structure. The directing element has a first portion configured to direct a first electromagnetic wave having a first frequency to transmit via the first antenna and a second portion configured to direct a second electromagnetic wave having a second frequency different from the first frequency to transmit via the second antenna. A method of manufacturing an electronic package is also provided.Type: GrantFiled: August 6, 2021Date of Patent: January 30, 2024Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.Inventors: Jenchun Chen, Ya-Wen Liao
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Patent number: 11862855Abstract: The present disclosure provides an antenna module including a substrate, a first antenna disposed on the substrate and a second antenna disposed on the substrate and spaced apart from the first antenna. The first antenna is configured to have a first operating frequency and the second antenna is configured to have a second operating frequency different from the first operating frequency. The antenna module further includes an element configured to focus an electromagnetic wave transmitted or received by the first antenna and the second antenna. A semiconductor device package is also disclosed.Type: GrantFiled: November 29, 2022Date of Patent: January 2, 2024Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.Inventors: Jenchun Chen, Ya-Wen Liao
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Patent number: 11848480Abstract: An electronic device and a method for manufacturing the same are provided. The electronic device includes a carrier, an antenna element and a cladding element. The carrier defines a first area and a second area adjacent to the first area. The antenna element is in the first area. The cladding element covers the antenna element and is configured for enhancing antenna gain of the antenna element. The second area is exposed from the cladding element and is distant from the antenna element.Type: GrantFiled: August 27, 2021Date of Patent: December 19, 2023Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.Inventors: Jenchun Chen, Ya-Wen Liao
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Publication number: 20230086019Abstract: The present disclosure provides an antenna module including a substrate, a first antenna disposed on the substrate and a second antenna disposed on the substrate and spaced apart from the first antenna. The first antenna is configured to have a first operating frequency and the second antenna is configured to have a second operating frequency different from the first operating frequency. The antenna module further includes an element configured to focus an electromagnetic wave transmitted or received by the first antenna and the second antenna. A semiconductor device package is also disclosed.Type: ApplicationFiled: November 29, 2022Publication date: March 23, 2023Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Jenchun CHEN, Ya-Wen LIAO
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Publication number: 20230060538Abstract: An electronic device and a method for manufacturing the same are provided. The electronic device includes a carrier, an antenna element and a cladding element. The carrier defines a first area and a second area adjacent to the first area. The antenna element is in the first area. The cladding element covers the antenna element and is configured for enhancing antenna gain of the antenna element. The second area is exposed from the cladding element and is distant from the antenna element.Type: ApplicationFiled: August 27, 2021Publication date: March 2, 2023Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Jenchun CHEN, Ya-Wen LIAO
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Publication number: 20230037915Abstract: The present disclosure provides an electronic package. The electronic package includes an antenna structure having a first antenna and a second antenna at least partially covered by the first antenna. The electronic package also includes a directing element covering the antenna structure. The directing element has a first portion configured to direct a first electromagnetic wave having a first frequency to transmit via the first antenna and a second portion configured to direct a second electromagnetic wave having a second frequency different from the first frequency to transmit via the second antenna. A method of manufacturing an electronic package is also provided.Type: ApplicationFiled: August 6, 2021Publication date: February 9, 2023Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Jenchun CHEN, Ya-Wen LIAO
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Patent number: 11515645Abstract: The present disclosure provides an antenna module including a substrate, a first antenna disposed on the substrate and a second antenna disposed on the substrate and spaced apart from the first antenna. The first antenna is configured to have a first operating frequency and the second antenna is configured to have a second operating frequency different from the first operating frequency. The antenna module further includes an element configured to focus an electromagnetic wave transmitted or received by the first antenna and the second antenna. A semiconductor device package is also disclosed.Type: GrantFiled: April 7, 2021Date of Patent: November 29, 2022Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.Inventors: Jenchun Chen, Ya-Wen Liao
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Publication number: 20220328960Abstract: The present disclosure provides an antenna module including a substrate, a first antenna disposed on the substrate and a second antenna disposed on the substrate and spaced apart from the first antenna. The first antenna is configured to have a first operating frequency and the second antenna is configured to have a second operating frequency different from the first operating frequency. The antenna module further includes an element configured to focus an electromagnetic wave transmitted or received by the first antenna and the second antenna. A semiconductor device package is also disclosed.Type: ApplicationFiled: April 7, 2021Publication date: October 13, 2022Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Jenchun CHEN, Ya-Wen LIAO