Patents by Inventor Ya-Wen LIAO

Ya-Wen LIAO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240170829
    Abstract: The present disclosure provides an electronic package. The electronic package includes an antenna structure having a first antenna and a second antenna at least partially covered by the first antenna. The electronic package also includes a directing element covering the antenna structure. The directing element has a first portion configured to direct a first electromagnetic wave having a first frequency to transmit via the first antenna and a second portion configured to direct a second electromagnetic wave having a second frequency different from the first frequency to transmit via the second antenna. A method of manufacturing an electronic package is also provided.
    Type: Application
    Filed: January 30, 2024
    Publication date: May 23, 2024
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Jenchun CHEN, Ya-Wen LIAO
  • Publication number: 20240120640
    Abstract: An electronic device and a method for manufacturing the same are provided. The electronic device includes a carrier, an antenna element and a cladding element. The carrier defines a first area and a second area adjacent to the first area. The antenna element is in the first area. The cladding element covers the antenna element and is configured for enhancing antenna gain of the antenna element. The second area is exposed from the cladding element and is distant from the antenna element.
    Type: Application
    Filed: December 18, 2023
    Publication date: April 11, 2024
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Jenchun CHEN, Ya-Wen LIAO
  • Patent number: 11888210
    Abstract: The present disclosure provides an electronic package. The electronic package includes an antenna structure having a first antenna and a second antenna at least partially covered by the first antenna. The electronic package also includes a directing element covering the antenna structure. The directing element has a first portion configured to direct a first electromagnetic wave having a first frequency to transmit via the first antenna and a second portion configured to direct a second electromagnetic wave having a second frequency different from the first frequency to transmit via the second antenna. A method of manufacturing an electronic package is also provided.
    Type: Grant
    Filed: August 6, 2021
    Date of Patent: January 30, 2024
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Jenchun Chen, Ya-Wen Liao
  • Patent number: 11862855
    Abstract: The present disclosure provides an antenna module including a substrate, a first antenna disposed on the substrate and a second antenna disposed on the substrate and spaced apart from the first antenna. The first antenna is configured to have a first operating frequency and the second antenna is configured to have a second operating frequency different from the first operating frequency. The antenna module further includes an element configured to focus an electromagnetic wave transmitted or received by the first antenna and the second antenna. A semiconductor device package is also disclosed.
    Type: Grant
    Filed: November 29, 2022
    Date of Patent: January 2, 2024
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Jenchun Chen, Ya-Wen Liao
  • Patent number: 11848480
    Abstract: An electronic device and a method for manufacturing the same are provided. The electronic device includes a carrier, an antenna element and a cladding element. The carrier defines a first area and a second area adjacent to the first area. The antenna element is in the first area. The cladding element covers the antenna element and is configured for enhancing antenna gain of the antenna element. The second area is exposed from the cladding element and is distant from the antenna element.
    Type: Grant
    Filed: August 27, 2021
    Date of Patent: December 19, 2023
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Jenchun Chen, Ya-Wen Liao
  • Publication number: 20230086019
    Abstract: The present disclosure provides an antenna module including a substrate, a first antenna disposed on the substrate and a second antenna disposed on the substrate and spaced apart from the first antenna. The first antenna is configured to have a first operating frequency and the second antenna is configured to have a second operating frequency different from the first operating frequency. The antenna module further includes an element configured to focus an electromagnetic wave transmitted or received by the first antenna and the second antenna. A semiconductor device package is also disclosed.
    Type: Application
    Filed: November 29, 2022
    Publication date: March 23, 2023
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Jenchun CHEN, Ya-Wen LIAO
  • Publication number: 20230060538
    Abstract: An electronic device and a method for manufacturing the same are provided. The electronic device includes a carrier, an antenna element and a cladding element. The carrier defines a first area and a second area adjacent to the first area. The antenna element is in the first area. The cladding element covers the antenna element and is configured for enhancing antenna gain of the antenna element. The second area is exposed from the cladding element and is distant from the antenna element.
    Type: Application
    Filed: August 27, 2021
    Publication date: March 2, 2023
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Jenchun CHEN, Ya-Wen LIAO
  • Publication number: 20230037915
    Abstract: The present disclosure provides an electronic package. The electronic package includes an antenna structure having a first antenna and a second antenna at least partially covered by the first antenna. The electronic package also includes a directing element covering the antenna structure. The directing element has a first portion configured to direct a first electromagnetic wave having a first frequency to transmit via the first antenna and a second portion configured to direct a second electromagnetic wave having a second frequency different from the first frequency to transmit via the second antenna. A method of manufacturing an electronic package is also provided.
    Type: Application
    Filed: August 6, 2021
    Publication date: February 9, 2023
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Jenchun CHEN, Ya-Wen LIAO
  • Patent number: 11515645
    Abstract: The present disclosure provides an antenna module including a substrate, a first antenna disposed on the substrate and a second antenna disposed on the substrate and spaced apart from the first antenna. The first antenna is configured to have a first operating frequency and the second antenna is configured to have a second operating frequency different from the first operating frequency. The antenna module further includes an element configured to focus an electromagnetic wave transmitted or received by the first antenna and the second antenna. A semiconductor device package is also disclosed.
    Type: Grant
    Filed: April 7, 2021
    Date of Patent: November 29, 2022
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Jenchun Chen, Ya-Wen Liao
  • Publication number: 20220328960
    Abstract: The present disclosure provides an antenna module including a substrate, a first antenna disposed on the substrate and a second antenna disposed on the substrate and spaced apart from the first antenna. The first antenna is configured to have a first operating frequency and the second antenna is configured to have a second operating frequency different from the first operating frequency. The antenna module further includes an element configured to focus an electromagnetic wave transmitted or received by the first antenna and the second antenna. A semiconductor device package is also disclosed.
    Type: Application
    Filed: April 7, 2021
    Publication date: October 13, 2022
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Jenchun CHEN, Ya-Wen LIAO