Abstract: A semiconductor device including a first wafer assembly having a first substrate and a first oxide layer over the first substrate. The semiconductor device further includes a second wafer assembly having a second substrate and a second oxide layer over the second substrate. The first oxide layer and the second oxide layer are bonded together by van der Waals bonds or covalent bonds. A method of bonding a first wafer assembly and a second wafer assembly including forming a first oxide layer over a first substrate. The method further includes forming a second oxide layer over a second wafer assembly. The method further includes forming van der Waals bonds or covalent bonds between the first oxide layer and the second oxide layer.

Abstract: A wafer including a substrate, a dielectric layer over the substrate, and a conductive layer over the dielectric layer is disclosed. The substrate has a main portion. A periphery of the dielectric layer and the periphery of the main portion of the substrate are separated by a first distance. A periphery of the conductive layer and the periphery of the main portion of the substrate are separated by a second distance. The second distance ranges from about a value that is 0.5% of a diameter of the substrate less than the first distance to about a value that is 0.5% of the diameter greater than the first distance.

Abstract: A semiconductor device including a first wafer assembly having a first substrate and a first oxide layer over the first substrate. The semiconductor device further includes a second wafer assembly having a second substrate and a second oxide layer over the second substrate. The first oxide layer and the second oxide layer are bonded together by van der Waals bonds or covalent bonds. A method of bonding a first wafer assembly and a second wafer assembly including forming a first oxide layer over a first substrate. The method further includes forming a second oxide layer over a second wafer assembly. The method further includes forming van der Waals bonds or covalent bonds between the first oxide layer and the second oxide layer.

Abstract: A wafer including a substrate, a dielectric layer over the substrate, and a conductive layer over the dielectric layer is disclosed. The substrate has a main portion. A periphery of the dielectric layer and the periphery of the main portion of the substrate are separated by a first distance. A periphery of the conductive layer and the periphery of the main portion of the substrate are separated by a second distance. The second distance ranges from about a value that is 0.5% of a diameter of the substrate less than the first distance to about a value that is 0.5% of the diameter greater than the first distance.

Abstract: The present invention is related to an UV LED curing apparatus, and more particularly, to an UV LED curing apparatus with improved housing and switch controller. The UV LED curing apparatus of the present invention is preferably provided for curing UV hardening gel applied onto the nails of multiple fingers or toes all at once and with automatic controls; the UV LED curing apparatus comprises a light reflective inner casing enclosing a curing chamber having a front opening, an outer casing detachably attached to the inner casing and an UV LED light source disposed on the inner casing and capable of providing an illumination covering a large space in the curing chamber.

Abstract: A computer system for integrating several car electronic devices is proposed. The computer system is installed in a housing, which is of the standard DIN size to be installed in a car dashboard. A computer host is disposed in the housing, and can run at least an operating system or at least a software program. At least an external electronic device is connected to the computer host through a plurality of connection ports disposed on the computer host. A control panel is disposed at the front end of the housing to control the computer host. A display for displaying text or picture information is also connected to the computer host. A touch panel adhering to the display is also provided. Data can be input through contacting the touch panel. The connection ports can connect all electronic devices in a car for integrating and controlling them.

Abstract: A computer system for integrating several car electronic devices is proposed. The computer system is installed in a housing, which is of the standard DIN size to be installed in a car dashboard. A computer host is disposed in the housing, and can run at least an operating system or at least a software program. At least an external electronic device is connected to the computer host through a plurality of connection ports disposed on the computer host. A control panel is disposed at the front end of the housing to control the computer host. A display for displaying text or picture information is also connected to the computer host. A touch panel adhering to the display is also provided. Data can be input through contacting the touch panel. The connection ports can connect all electronic devices in a car for integrating and controlling them.

Abstract: A computer system for integrating several car electronic devices is proposed. The computer system is installed in a housing, which is of the standard DIN size to be installed in a car dashboard. A computer host is disposed in the housing, and can run at least an operating system or at least a software program. At least an external electronic device is connected to the computer host through a plurality of connection ports disposed on the computer host. . A control panel is disposed at the front end of the housing to control the computer host. A display for displaying text or picture information is also connected to the computer host. A touch panel adhering to the display is also provided. Data can be input through contacting the touch panel. The connection ports can connect all electronic devices in a car for integrating and controlling them.

Abstract: A computer system for integrating several car electronic devices is proposed. The computer system is installed in a housing, which is of the standard DIN size to be installed in a car dashboard. A computer host is disposed in the housing, and can run at least an operating system or at least a software program. At least an external electronic device is connected to the computer host through a plurality of connection ports disposed on the computer host. A control panel is disposed at the front end of the housing to control the computer host. A display for displaying text or picture information is also connected to the computer host. A touch panel adhering to the display is also provided. Data can be input through contacting the touch panel. The connection ports can connect all electronic devices in a car for integrating and controlling them.