Abstract: The present disclosure provides a semiconductor package structure having a semiconductor die having an active surface, a conductive bump on the active surface, configured to electrically couple the semiconductor die to an external circuit, the conductive bump having a bump height, a dielectric encapsulating the semiconductor die and the conductive bump, and a plurality of fillers in the dielectric, each of the fillers comprising a diameter, wherein a maximum diameter of the fillers is smaller than the bump height.

Abstract: The present disclosure provides a semiconductor package structure having a semiconductor die having an active surface, a conductive bump on the active surface, configured to electrically couple the semiconductor die to an external circuit, the conductive bump having a bump height, a dielectric encapsulating the semiconductor die and the conductive bump, and a plurality of fillers in the dielectric, each of the fillers comprising a diameter, wherein a maximum diameter of the fillers is smaller than the bump height.

Abstract: The present disclosure provides a semiconductor package structure having a semiconductor die having an active surface, a conductive bump on the active surface, configured to electrically couple the semiconductor die to an external circuit, the conductive bump having a bump height, a dielectric encapsulating the semiconductor die and the conductive bump, and a plurality of fillers in the dielectric, each of the fillers comprising a diameter, wherein a maximum diameter of the fillers is smaller than the bump height.

Abstract: A semiconductor package includes a filler composition, wherein the filler composition includes particles each including both carbon and silica, wherein the filler composition is substantially devoid of alumina or silicon carbide, and the filler composition has a weight ratio of carbon to silica of at least greater than 1.0.

Abstract: The present disclosure relates to a filler composition for a semiconductor package. The filler composition comprises carbon and silica.

Abstract: The present invention relates to a hydrophilic surface structure of the non-hydrophilic substrate and the manufacturing method for using the same. The hydrophilic substrate surface structure is fabricated by forming an amphiphilic polymer layer, a cross-linked stacking layer, and a hydrophilic layer in sequence on the surface of a non-hydrophilic substrate. For example, the hydrophobic surface of poly(dimethylsiloxane) (PDMS) can be made from hydrophobic to hydrophilic and the hydrophilicity can be retained for a long period of time and resist protein adsorption. The hydrophilic thin films give long term stability to the PDMS surface by resisting hydrophobicity recovery, which is the major problem with PDMS. The disclosed method can further be used in the immobilization of protein and other molecules. This method can also be used for modifying other substrates which suffer problems of surface instability.

Abstract: A method for die attaching is disclosed. At first, at least one die and a die-attach preform are separately provided. The die-attach preform is picked and placed upon a die carrier. Then, the die is picked and placed upon the die-attach preform. The die and the die carrier are heated and clipped, so that the die-attach preform can adhere the die and the die carrier at the same time.

Abstract: A packaging process including the following steps is provided. First, a first substrate and a second substrate are provided. The first substrate has first contacts, and the second substrate has second contacts. Next, the first substrate is placed on the second substrate, such that the first contacts are aligned with the second contacts. Then, the first substrate and the second substrate are submerged in a solution having BDMT. After that, the first substrate and the second substrate are removed from the solution, such that self-assembly mono-layers are formed between the first substrate and the second substrate, to electrically connect the first substrate and the second substrate. A package structure formed according to the above process is also provided.

Abstract: The present invention relates to a hydrophilic surface structure of the non-hydrophilic substrate and the manufacturing method for using the same. The hydrophilic substrate surface structure is fabricated by forming an amphiphilic polymer layer, a cross-linked stacking layer, and a hydrophilic layer in sequence on the surface of a non-hydrophilic substrate. For example, the hydrophobic surface of poly(dimethylsiloxane) (PDMS) can be made from hydrophobic to hydrophilic and the hydrophilicity can be retained for a long period of time and resist protein adsorption. The hydrophilic thin films give long term stability to the PDMS surface by resisting hydrophobicity recovery, which is the major problem with PDMS. The disclosed method can further be used in the immobilization of protein and other molecules. This method can also be used for modifying other substrates which suffer problems of surface instability.

Abstract: A method for die attaching is disclosed. At first, at least one die and a die-attach preform are separately provided. The die-attach preform is picked and placed upon a die carrier. Then, the die is picked and placed upon the die-attach preform. The die and the die carrier are heated and clipped, so that the die-attach preform can adhere the die and the die carrier at the same time.