Patents by Inventor Yayun Liu
Yayun Liu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240134925Abstract: An information handling system may include at least one processor; and an information handling resource, wherein the information handling resource has hardware definition information associated therewith, and wherein the hardware definition information is not stored in a physical storage resource of the information handling resource; wherein the information handling system is configured to: determine a storage location of a database including the hardware definition information of the information handling resource; and retrieve the hardware definition information from the database.Type: ApplicationFiled: October 18, 2022Publication date: April 25, 2024Applicant: Dell Products L.P.Inventors: Yayun LIU, Wade Andrew BUTCHER, Deepaganesh PAULRAJ
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Patent number: 11768985Abstract: Methods, apparatus, and processor-readable storage media for an automated platform design tool are provided herein. An example method includes extracting information from a first file corresponding to a first computing design, the information including an identifier of at least one network, components associated with the identifier, and connections for each of the components; comparing the first computing design to a second computing design, wherein the comparing comprises: detecting that a second schematic file corresponding to the second computing design comprises the identifier, and determining, for at least one given component, whether the second schematic file includes a matching component based on the set of connections for the at least one given component; determining differences between the first computing design and the second computing design based on the results of the comparing; and initiating at least one automated action based at least in part on the one or more differences.Type: GrantFiled: April 21, 2022Date of Patent: September 26, 2023Assignee: Dell Products L.P.Inventors: Isaac Qin Wang, Yayun Liu
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Patent number: 11258372Abstract: The present invention disclosed a bridge rectifier comprising a first switching circuit, a second switching circuit, a third switching circuit, a fourth switching circuit, a first driving circuit, a second driving circuit, a third driving circuit, and a fourth driving circuit. The first driving circuit is electrically connected to the first switching circuit, the second driving circuit is electrically connected to the second switching circuit, the third driving circuit is electrically connected to the third switching circuit, the fourth driving circuit is electrically connected to the fourth switching circuit. In the disclosure, the bridge rectifier should be implemented by the combination of switch circuits with driving circuits. Such that the power dissipation of bridge rectifier could be significantly reduced to improve the function of the overall circuit due to the low impedance of the switching circuit in a closed state.Type: GrantFiled: May 7, 2020Date of Patent: February 22, 2022Assignees: Umberg Zipser LLP, LITE-ON Technology CorporationInventors: Chao Peng, Yan Li, YaYun Liu, XiaoQiang Li
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Publication number: 20210036630Abstract: The present invention disclosed a bridge rectifier comprising a first switching circuit, a second switching circuit, a third switching circuit, a fourth switching circuit, a first driving circuit, a second driving circuit, a third driving circuit, and a fourth driving circuit. The first driving circuit is electrically connected to the first switching circuit, the second driving circuit is electrically connected to the second switching circuit, the third driving circuit is electrically connected to the third switching circuit, the fourth driving circuit is electrically connected to the fourth switching circuit. In the disclosure, the bridge rectifier should be implemented by the combination of switch circuits with driving circuits. Such that the power dissipation of bridge rectifier could be significantly reduced to improve the function of the overall circuit due to the low impedance of the switching circuit in a closed state.Type: ApplicationFiled: May 7, 2020Publication date: February 4, 2021Applicants: Lite-On Electronics (Guangzhou) Limited, LITE-ON Technology CorporationInventors: Chao PENG, Yan LI, YaYun LIU, XiaoQiang LI
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Patent number: 10392543Abstract: Disclosed is a highly fluorinated silicone resin and a method for making the same. The silicone resin includes M, T, optionally D and optionally Q type monomers and is crosslinkable. The resin has a fluorine content of at least 55 weight percent and a very low refractive index of less than 1.4. The resin is formed in a one step process and requires use of very specific solvents. Preferably the resin includes a first T type monomer having a fluoroalkane group to provide the fluorine to the resin. Preferably the resin includes a second T type monomer having a (meth)acryloyl function to enable cross-linking. The resin forms an effective liquid optically clear adhesive. The resin can be further combined with highly fluorinated (meth)acrylate monomers or perfluoro polyethers to provide even lower refractive indexes and improved adhesive properties.Type: GrantFiled: November 2, 2018Date of Patent: August 27, 2019Assignee: Henkel IP & Holding GmbHInventors: Bahram Issari, Wenhua Zhang, John G. Woods, Shengqian Kong, Yayun Liu, Jiangbo Ouyang, Li Kang
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Publication number: 20190169478Abstract: Dual-cure compositions for use in high temperature adhesive applications, and particularly for temporarily adhesively attaching one substrate to another substrate, are provided. These dual-cure adhesives are silicone-based compositions that can be B-staged by exposure UV radiation to provide initial green strength, followed by a C-stage cure to give adhesives that can survive high temperature processes above 200° C., especially above 300° C., yet easy to debond afterwards to allow separation of the top and bottom substrates.Type: ApplicationFiled: June 5, 2018Publication date: June 6, 2019Inventors: Shengqian KONG, Yayun LIU, Wenhua ZHANG, Stephen HYNES, John G. WOODS, Jiangbo OUYANG, Chunyu SUN, Bahram ISSARI
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Patent number: 10280349Abstract: The present invention relates to one-component UV and thermal curable temporary adhesives for use in high temperature applications, and particularly to adhesives for the temporary attachment of one substrate to another substrate, the adhesives comprising (i) the partial hydrosilylation reaction product of the reaction between the vinyl groups on 1,3,5,7-tetravinyl-1,3,5,7-tetramethylcyclotetrasiloxane and the terminal Si—H hydrogens on a silane or siloxane having terminal Si—H hydrogens, and (ii) a photo and/or thermal radical cure initiator. Also encompassed are assemblies including such an adhesive and methods of using the adhesives.Type: GrantFiled: December 7, 2016Date of Patent: May 7, 2019Assignees: Henkel AG & Co. KGaA, Henkel IP & Holding GmbHInventors: Stephen Hynes, Chunyu Sun, Jiangbo Ouyang, John Gregory Woods, Bahram Issari, Shengqian Kong, Yayun Liu, Wenhua Zhang
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Publication number: 20190071593Abstract: Disclosed is a highly fluorinated silicone resin and a method for making the same. The silicone resin includes M, T, optionally D and optionally Q type monomers and is crosslinkable. The resin has a fluorine content of at least 55 weight percent and a very low refractive index of less than 1.4. The resin is formed in a one step process and requires use of very specific solvents. Preferably the resin includes a first T type monomer having a fluoroalkane group to provide the fluorine to the resin. Preferably the resin includes a second T type monomer having a (meth)acryloyl function to enable cross-linking. The resin forms an effective liquid optically clear adhesive. The resin can be further combined with highly fluorinated (meth)acrylate monomers or perfluoro polyethers to provide even lower refractive indexes and improved adhesive properties.Type: ApplicationFiled: November 2, 2018Publication date: March 7, 2019Inventors: Bahram Issari, Wenhua Zhang, John G. Woods, Shengqian Kong, Yayun Liu, Jiangbo Ouyang, Li Kang
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Publication number: 20170081574Abstract: The present invention relates to one-component UV and thermal curable temporary adhesives for use in high temperature applications, and particularly to adhesives for the temporary attachment of one substrate to another substrate, the adhesives comprising (i) the partial hydrosilylation reaction product of the reaction between the vinyl groups on 1,3,5,7-tetravinyl-1,3,5,7-tetramethylcyclotetrasiloxane and the terminal Si—H hydrogens on a silane or siloxane having terminal Si—H hydrogens, and (ii) a photo and/or thermal radical cure initiator. Also encompassed are assemblies including such an adhesive and methods of using the adhesives.Type: ApplicationFiled: December 7, 2016Publication date: March 23, 2017Inventors: Stephen Hynes, Chunyu Sun, Jiangbo Ouyang, John Gregory Woods, Bahram lssari, Shengqian Kong, Yayun Liu, Wenhua Zhang
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Patent number: 8921464Abstract: The invention provides hot melt adhesives that comprise a templating agent, a polymer and a wax. It has been discovered that hot melt adhesives with an effective amount of templating agent have improved heat resistance than adhesives. The adhesives find particular use as case, carton, and tray forming, and as sealing adhesives, including heat sealing applications, for example in the packaging of cereals, cracker and beer products.Type: GrantFiled: March 5, 2013Date of Patent: December 30, 2014Assignee: Henkel US IP LLCInventors: Yayun Liu, Charles W. Paul, Allison Xiao, Andrea Eodice
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Patent number: 8426986Abstract: A curable composition, suitable for underfill encapsulant, has two distinct phase domains after cure, a continuous phase and a discontinuous phase, in which one phase has a modulus value of 2 GPa or greater, and the second phase has a modulus value at least 1 Gpa less than the first phase, characterized in that the phases are generated in situ as the composition cures.Type: GrantFiled: May 13, 2011Date of Patent: April 23, 2013Assignee: Henkel CorporationInventors: Allison Yue Xiao, Yayun Liu
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Publication number: 20110210454Abstract: A curable composition, suitable for underfill encapsulant, has two distinct phase domains after cure, a continuous phase and a discontinuous phase, in which one phase has a modulus value of 2 GPa or greater, and the second phase has a modulus value at least 1 Gpa less than the first phase, characterized in that the phases are generated in situ as the composition cures.Type: ApplicationFiled: May 13, 2011Publication date: September 1, 2011Inventors: Allison Yue Xiao, Yayun Liu
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Patent number: 7070822Abstract: The present invention is directed toward a free flowing powdered blend of a polysaccharide and a crystalline polyol for use as an edible adhesive for particulate materials such as seasonings and flavorings. The powdered adhesive blend can easily be mixed with seasonings or flavorings and will melt during a heating process to a sticky viscose liquid capable of adhering seasoning particles to the food substrate. The blends of the present invention have the benefits of being easy to prepare, use and store as they will stay a free flowing powder under most ambient conditions.Type: GrantFiled: December 20, 2002Date of Patent: July 4, 2006Assignee: National Starch and Chemical Investment Holding CorporationInventors: Yong-Cheng Shi, Yayun Liu, Robert L. Billmers, Russell Stoop, David Huang
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Publication number: 20050048168Abstract: Use of starch(es) and starch derivatives in frozen desserts for improved meltdown and shape retention, including reduced expansion and contraction of the frozen dessert when transported at high altitudes, e.g., over mountain ranges. These improved characteristics are retained in the frozen dessert even after multiple heat shock cycling. The starch(es) and starch derivatives inhibit ice crystal formation in frozen after heat shock cycling.Type: ApplicationFiled: August 26, 2004Publication date: March 3, 2005Inventors: Susanne Koxholt, Judith Whaley, Yayun Liu
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Publication number: 20020197373Abstract: This invention relates to a process for preparing cereal grain having increased dietary fiber and/or resistant starch content and the process tolerant grain prepared thereby. Further, this invention provides high amylose grain with unusually high dietary fiber and resistant starch content. In particular, this invention involves the preparation of the improved grain by a combination of moisture and temperature conditions and further to use of the grain in the preparation of products containing starch.Type: ApplicationFiled: March 26, 2001Publication date: December 26, 2002Inventors: Yong-Cheng Shi, Yayun Liu