Patents by Inventor Yadhu Vamshi S. Vancha

Yadhu Vamshi S. Vancha has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10553257
    Abstract: A highly distributed current reference for a solid-state memory comprises a centrally located current digital-to-analog converter (IDAC) and a plurality of remotely located tile current references. The IDAC comprises a first active device that generates a reference current, and a device that forms a first source degeneration resistance for the first active device. The IDAC outputs a voltage signal that represents a magnitude of the reference current. A remotely located tile current reference comprises a second active device and a device that forms a second source degeneration resistance for the second active device. The source degeneration resistances and capacitance coupled to the voltage signal output from the IDAC compensate for current, temperature, supply and process variations.
    Type: Grant
    Filed: June 6, 2018
    Date of Patent: February 4, 2020
    Assignee: Intel Corporation
    Inventors: Matthew G. Dayley, Yadhu Vamshi S. Vancha
  • Publication number: 20180350409
    Abstract: A highly distributed current reference for a solid-state memory comprises a centrally located current digital-to-analog converter (IDAC) and a plurality of remotely located tile current references. The IDAC comprises a first active device that generates a reference current, and a device that forms a first source degeneration resistance for the first active device. The IDAC outputs a voltage signal that represents a magnitude of the reference current. A remotely located tile current reference comprises a second active device and a device that forms a second source degeneration resistance for the second active device. The source degeneration resistances and capacitance coupled to the voltage signal output from the IDAC compensate for current, temperature, supply and process variations.
    Type: Application
    Filed: June 6, 2018
    Publication date: December 6, 2018
    Applicant: Intel Corporation
    Inventors: Matthew G. DAYLEY, Yadhu Vamshi S. VANCHA
  • Patent number: 9997207
    Abstract: A highly distributed current reference for a solid-state memory comprises a centrally located current digital-to-analog converter (IDAC) and a plurality of remotely located tile current references. The IDAC comprises a first active device that generates a reference current, and a device that forms a first source degeneration resistance for the first active device. The IDAC outputs a voltage signal that represents a magnitude of the reference current. A remotely located tile current reference comprises a second active device and a device that forms a second source degeneration resistance for the second active device. The source degeneration resistances and capacitance coupled to the voltage signal output from the IDAC compensate for current, temperature, supply and process variations.
    Type: Grant
    Filed: January 25, 2016
    Date of Patent: June 12, 2018
    Assignee: Intel Corporation
    Inventors: Matthew G. Dayley, Yadhu Vamshi S. Vancha
  • Publication number: 20160254035
    Abstract: A highly distributed current reference for a solid-state memory comprises a centrally located current digital-to-analog converter (IDAC) and a plurality of remotely located tile current references. The IDAC comprises a first active device that generates a reference current, and a device that forms a first source degeneration resistance for the first active device. The IDAC outputs a voltage signal that represents a magnitude of the reference current. A remotely located tile current reference comprises a second active device and a device that forms a second source degeneration resistance for the second active device. The source degeneration resistances and capacitance coupled to the voltage signal output from the IDAC compensate for current, temperature, supply and process variations.
    Type: Application
    Filed: January 25, 2016
    Publication date: September 1, 2016
    Applicant: Intel Corporatiom
    Inventors: Matthew G. Dayley, Yadhu Vamshi S. Vancha
  • Patent number: 9280168
    Abstract: A highly distributed current reference for a solid-state memory comprises a centrally located current digital-to-analog converter (IDAC) and a plurality of remotely located tile current references. The IDAC comprises a first active device that generates a reference current, and a device that forms a first source degeneration resistance for the first active device. The IDAC outputs a voltage signal that represents a magnitude of the reference current. A remotely located tile current reference comprises a second active device and a device that forms a second source degeneration resistance for the second active device. The source degeneration resistances and capacitance coupled to the voltage signal output from the IDAC compensate for current, temperature, supply and process variations.
    Type: Grant
    Filed: March 29, 2013
    Date of Patent: March 8, 2016
    Assignee: Intel Corporation
    Inventors: Matthew G. Dayley, Yadhu Vamshi S. Vancha
  • Publication number: 20140293714
    Abstract: A highly distributed current reference for a solid-state memory comprises a centrally located current digital-to-analog converter (IDAC) and a plurality of remotely located tile current references. The IDAC comprises a first active device that generates a reference current, and a device that forms a first source degeneration resistance for the first active device. The IDAC outputs a voltage signal that represents a magnitude of the reference current. A remotely located tile current reference comprises a second active device and a device that forms a second source degeneration resistance for the second active device. The source degeneration resistances and capacitance coupled to the voltage signal output from the IDAC compensate for current, temperature, supply and process variations.
    Type: Application
    Filed: March 29, 2013
    Publication date: October 2, 2014
    Inventors: Matthew G. Dayley, Yadhu Vamshi S. Vancha