Patents by Inventor Yafei Zhu

Yafei Zhu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8268927
    Abstract: A water redispersible polymer powder is produced by drying an aqueous mixture of a high Tg carboxylated styrene butadiene polymer and a low Tg carboxylated styrene butadiene polymer, where the ratio of the mean or average particle size of the high Tg polymer to the particle size of the low Tg polymer is from 1:1 to 5:1, preferably from 1:1 to 3:1, and the amount of the high Tg polymer is from 20 wt. % to 35 wt. %, preferably from 25 wt. % to 30 wt. %, based upon the total weight of the high Tg polymer and the low Tg polymer. Cement compositions such as mortars, which contain the redispersible polymer powder exhibit unexpectedly superior high bond strength and high impact resistance.
    Type: Grant
    Filed: June 23, 2011
    Date of Patent: September 18, 2012
    Assignee: Dow Global Technologies LLC
    Inventors: Robert Baumann, Juergen Dombrowski, Hartmut Kuehn, Etienne Lazarus, Gerold A Lohmuller, Margarita Perello, Yafei Zhu
  • Publication number: 20120029119
    Abstract: A water redispersible polymer powder is produced by drying an aqueous mixture of a high Tg carboxylated styrene butadiene polymer and a low Tg carboxylated styrene butadiene polymer, where the ratio of the mean or average particle size of the high Tg polymer to the particle size of the low Tg polymer is from 1:1 to 5:1, preferably from 1:1 to 3:1, and the amount of the high Tg polymer is from 20 wt. % to 35 wt. %, preferably from 25 wt. % to 30 wt. %, based upon the total weight of the high Tg polymer and the low Tg polymer. Cement compositions such as mortars, which contain the redispersible polymer powder exhibit unexpectedly superior high bond strength and high impact resistance.
    Type: Application
    Filed: June 23, 2011
    Publication date: February 2, 2012
    Applicant: DOW GLOBAL TECHNOLOGIES LLC
    Inventors: Juergen DOMBROWSKI, Hartmut KUEHN, Margarita PERELLO, Gerold A. LOHMULLER, Etienne LAZARUS, Robert BAUMANN, Yafei ZHU