Patents by Inventor Yaguang YAO

Yaguang YAO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • High-strength dual-scale structure titanium alloy, preparation method therefor, and application thereof
    Patent number: 11072841
    Abstract: A high-strength dual-scale structure titanium alloy, a preparation method therefor, and an application thereof, belonging to the technical field of alloy processing. The composition system of the titanium alloy is Ti—Nb—Cu—Co—Al, the atomic percentage of the various elements being 58˜70% Ti, 9˜16% Nb, 4˜9% Cu, 4˜9% Co, and 2˜8% Al. The microstructure comprises a dual-scale coexistence of micro-crystal isometric bcc ?-Ti and ultra-fine crystal isometric bcc ?-Ti, and a dual-scale coexistence of micro-crystal strip fcc CoTi2 and ultra-fine crystal isometric fcc CoTi2, or an ultra-fine crystal strip fcc CoTi2 twin crystal is distributed along a boundary of a dual-scale substrate, the dual-scale substrate being a nano needle-shaped martensite a? phase dispersed within micro-crystal bcc ?-Ti. The mechanical properties of the titanium alloy are significantly improved, and the titanium alloy may be used in fields such as aerospace and aviation, weaponry and sports equipment.
    Type: Grant
    Filed: December 20, 2016
    Date of Patent: July 27, 2021
    Assignee: SOUTH CHINA UNIVERSITY OF TECHNOLOGY
    Inventors: Chao Yang, Yaguang Yao, Shengguan Qu, Xiaoqiang Li, Weiwen Zhang, Yuanyuan Li
  • Alloy material with high strength and toughness and its fabrication method of semi-solid sintering
    Patent number: 10344356
    Abstract: The present invention belongs to the technical field of the preparation of alloy materials, and discloses a high strength and toughness alloy material, a method for preparing the alloy material by semi-solid sintering, and application thereof.
    Type: Grant
    Filed: December 29, 2015
    Date of Patent: July 9, 2019
    Assignee: SOUTH CHINA UNIVERSITY OF TECHNOLOGY
    Inventors: Chao Yang, Yaguang Yao, Limei Kang, Lehua Liu, Shengguan Qu, Weiping Chen, Yuanyuan Li
  • HIGH-STRENGTH DUAL-SCALE STRUCTURE TITANIUM ALLOY, PREPARATION METHOD THEREFOR, AND APPLICATION THEREOF
    Publication number: 20180298469
    Abstract: A high-strength dual-scale structure titanium alloy, a preparation method therefor, and an application thereof, belonging to the technical field of alloy processing. The composition system of the titanium alloy is Ti—Nb—Cu—Co—Al, the atomic percentage of the various elements being 58˜70% Ti, 9˜16% Nb, 4˜9% Cu, 4˜9% Co, and 2˜8% Al. The microstructure comprises a dual-scale coexistence of micro-crystal isometric bcc ?-Ti and ultra-fine crystal isometric bcc ?-Ti, and a dual-scale coexistence of micro-crystal strip fcc CoTi2 and ultra-fine crystal isometric fcc CoTi2, or an ultra-fine crystal strip fcc CoTi2 twin crystal is distributed along a boundary of a dual-scale substrate, the dual-scale substrate being a nano needle-shaped martensite ?? phase dispersed within micro-crystal bcc ?-Ti. The mechanical properties of the titanium alloy are significantly improved, and the titanium alloy may be used in fields such as aerospace and aviation, weaponry and sports equipment.
    Type: Application
    Filed: December 20, 2016
    Publication date: October 18, 2018
    Applicant: South China University of Technology
    Inventors: Chao YANG, Yaguang YAO, Shengguan QU, Xiaoqiang LI, Weiwen ZHANG, Yuanyuan LI
  • NOVEL ALLOY MATERIAL WITH HIGH STRENGTH AND TOUGHNESS AND ITS FABRICATION METHOD OF SEMI-SOLID SINTERING
    Publication number: 20170137917
    Abstract: The present invention belongs to the technical field of the preparation of alloy materials, and discloses a high strength and toughness alloy material, a method for preparing the alloy material by semi-solid sintering, and application thereof.
    Type: Application
    Filed: December 29, 2015
    Publication date: May 18, 2017
    Applicant: SOUTH CHINA UNIVERSITY OF TECHNOLOGY
    Inventors: Chao YANG, Yaguang YAO, Limei KANG, Lehua LIU, Shengguan QU, Weiping CHEN, Yuanyuan LI