Patents by Inventor Ya-Hui Wu

Ya-Hui Wu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20260113934
    Abstract: A semiconductor device includes a substrate including an active area and a well region, a bitcell including a first gate structure and a second gate structure extending in a first direction across the active area and spaced apart in a second direction; a first conductive structure at a first side of the first gate structure; a second conductive structure between a second side of the first gate structure and a first side of the second gate structure; and a third conductive structure at a second side of the second gate structure; a fourth conductive structure vertically overlapping the well region; a first conductor connected to the first conductive structure and the third conductive structure; a second conductor connected to the fourth conductive structure; and a third conductor connected to the first and second gate structures. The second and fourth conductive structures are electrically connected to the well region.
    Type: Application
    Filed: October 22, 2024
    Publication date: April 23, 2026
    Inventors: Ya-Hui WU, Ling-Fang HSU, Tzu-Yu CHEN, Che-Wei CHANG, Chia-En HUANG, Ting-Wei CHIANG
  • Publication number: 20250351365
    Abstract: A memory device includes a first memory array including: a plurality of memory strings spaced from each other along a first lateral direction and a second lateral direction, each of the plurality of memory strings including a plurality of memory cells arranged along a vertical direction; and a plurality of first conductive structures extending along the vertical direction; wherein each of the plurality of first conductive structures includes a first portion and a second portion; wherein the first portion extends across the plurality of memory cells of a corresponding pair of the plurality of memory strings along the vertical direction, and the second portion is disposed over the first portion along the vertical direction; and wherein the second portion extends farther than the first portion along at least one of the first or second lateral direction.
    Type: Application
    Filed: July 15, 2025
    Publication date: November 13, 2025
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chia-En Huang, Meng-Han Lin, Ya-Hui Wu
  • Patent number: 12426270
    Abstract: A memory device includes a first memory array including: a plurality of memory strings spaced from each other along a first lateral direction and a second lateral direction, each of the plurality of memory strings including a plurality of memory cells arranged along a vertical direction; and a plurality of first conductive structures extending along the vertical direction; wherein each of the plurality of first conductive structures includes a first portion and a second portion; wherein the first portion extends across the plurality of memory cells of a corresponding pair of the plurality of memory strings along the vertical direction, and the second portion is disposed over the first portion along the vertical direction; and wherein the second portion extends farther than the first portion along at least one of the first or second lateral direction.
    Type: Grant
    Filed: July 31, 2023
    Date of Patent: September 23, 2025
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chia-En Huang, Meng-Han Lin, Ya-Hui Wu
  • Publication number: 20230422512
    Abstract: A memory device includes a first memory array including: a plurality of memory strings spaced from each other along a first lateral direction and a second lateral direction, each of the plurality of memory strings including a plurality of memory cells arranged along a vertical direction; and a plurality of first conductive structures extending along the vertical direction; wherein each of the plurality of first conductive structures includes a first portion and a second portion; wherein the first portion extends across the plurality of memory cells of a corresponding pair of the plurality of memory strings along the vertical direction, and the second portion is disposed over the first portion along the vertical direction; and wherein the second portion extends farther than the first portion along at least one of the first or second lateral direction.
    Type: Application
    Filed: July 31, 2023
    Publication date: December 28, 2023
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chia-En Huang, Meng-Han Lin, Ya-Hui Wu
  • Patent number: 11758733
    Abstract: In some aspects of the present disclosure, a memory device includes a first memory array including: a plurality of memory strings spaced from each other along a first lateral direction and a second lateral direction, each of the plurality of memory strings including a plurality of memory cells arranged along a vertical direction; and a plurality of first conductive structures extending along the vertical direction; wherein each of the plurality of first conductive structures includes a first portion and a second portion; wherein the first portion extends across the plurality of memory cells of a corresponding pair of the plurality of memory strings along the vertical direction, and the second portion is disposed over the first portion along the vertical direction; and wherein the second portion extends farther than the first portion along at least one of the first or second lateral direction.
    Type: Grant
    Filed: April 30, 2021
    Date of Patent: September 12, 2023
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chia-En Huang, Meng-Han Lin, Ya-Hui Wu
  • Publication number: 20220352207
    Abstract: In some aspects of the present disclosure, a memory device includes a first memory array including: a plurality of memory strings spaced from each other along a first lateral direction and a second lateral direction, each of the plurality of memory strings including a plurality of memory cells arranged along a vertical direction; and a plurality of first conductive structures extending along the vertical direction; wherein each of the plurality of first conductive structures includes a first portion and a second portion; wherein the first portion extends across the plurality of memory cells of a corresponding pair of the plurality of memory strings along the vertical direction, and the second portion is disposed over the first portion along the vertical direction; and wherein the second portion extends farther than the first portion along at least one of the first or second lateral direction.
    Type: Application
    Filed: April 30, 2021
    Publication date: November 3, 2022
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chia-En Huang, Meng-Han Lin, Ya-Hui Wu
  • Patent number: 9512086
    Abstract: The present invention provides a compound of Formula (I) and a salt thereof, wherein, m is an integer of 2 to 7, and R is independently at least one selected from the group consisting of hydrogen and C1-C20 alkyl. The compound promotes apoptosis in cancer cell and inhibits its growth. The present invention also provides a pharmaceutical composition which comprises the compound of Formula (I), a salt thereof and a pharmaceutically acceptable carrier. The present invention further provides a method for production of the pharmaceutical composition used for treating cancer.
    Type: Grant
    Filed: January 14, 2015
    Date of Patent: December 6, 2016
    Assignee: National Chiao Tung University
    Inventors: Jui-I Chao, Su-Pei Wang, Chinpiao Chen, Kai-Hao Yin, Jinn-Moon Yang, Ya-Hui Wu
  • Publication number: 20160068495
    Abstract: The present invention provides a compound of Formula (I) and a salt thereof, wherein, m is an integer of 2 to 7, and R is independently at least one selected from the group consisting of hydrogen and C1-C20 alkyl. The compound promotes apoptosis in cancer cell and inhibits its growth. The present invention also provides a pharmaceutical composition which comprises the compound of Formula (I), a salt thereof and a pharmaceutically acceptable carrier. The present invention further provides a method for production of the pharmaceutical composition used for treating cancer.
    Type: Application
    Filed: January 14, 2015
    Publication date: March 10, 2016
    Applicant: NATIONAL CHIAO TUNG UNIVERSITY
    Inventors: Jui-I Chao, Su-Pei Wang, Chinpiao Chen, Kai-Hao Yin, Jinn-Moon Yang, Ya-Hui Wu
  • Patent number: 7154750
    Abstract: The present invention is a printed circuit board having cooling means incorporated therein, which is coordinated with a fan. The fan comprises a frame, a stator, a rotator and a circuit board. The circuit board comprises at least one electronic component, a control IC and a heat discharge region. The heat discharge region comprises two heat dissipation areas with a plurality of holes; and the control IC is at a position corresponding to the heat discharge region. Accordingly, the circuit board can be ventilated and its heat-transfer structure can be destroyed to further obtain a better heat discharge so that the work efficiency of the control IC can be improved.
    Type: Grant
    Filed: August 6, 2004
    Date of Patent: December 26, 2006
    Assignee: Datech Technology Co., Ltd.
    Inventors: Nien-Lun Li, Fu-Yin Wang, Ya-Hui Wu, Jian-Xuan Lee
  • Publication number: 20060028796
    Abstract: The present invention is a printed circuit board having cooling means incorporated therein, which is coordinated with a fan. The fan comprises a frame, a stator, a rotator and a circuit board. The circuit board comprises at least one electronic component, a control IC and a heat discharge region. The heat discharge region comprises two heat dissipation areas with a plurality of holes; and the control IC is at a position corresponding to the heat discharge region. Accordingly, the circuit board can be ventilated and its heat-transfer structure can be destroyed to further obtain a better heat discharge so that the work efficiency of the control IC can be improved.
    Type: Application
    Filed: August 6, 2004
    Publication date: February 9, 2006
    Inventors: Nien-Lun Li, Fu-Yin Wang, Ya-Hui Wu, Jian-Xuan Lee