Patents by Inventor Yaichirou Hori

Yaichirou Hori has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20060127645
    Abstract: A flat-cable-coating material includes a base film, and a heat-bonding layer(P+V) laminated to the base film and containing at least a filler(P) and a thermoplastic resin(V). The mass ratio (P)/(P+V) changes in a direction along the thickness of the heat-bonding layer in an inclined distribution curve preferably so as to decrease from the inner surface of the heat-bonding layer on the side of the base film toward the outer surface of the heat-bonding layer from 90% by mass and to 50% by mass. The filler(P) includes at least a hydrated metal compound(P1) and the mass ratio (P1/P) of the mass of the hydrated metal compound(P1) to the mass of the filler(P) changes in a direction along the thickness of the heat-bonding layer in a distribution curve so that the mass ratio (P1/P) decreases from the inner surface of the heat-bonding layer on the side of the base film toward the outer surface of the heat-bonding layer from 80% by mass to 0% by mass.
    Type: Application
    Filed: May 31, 2004
    Publication date: June 15, 2006
    Inventors: Hideki Imamura, Yaichirou Hori, Hiroshi Yamamoto