Abstract: Disclosed are an irradiation terminal based on a combination of rotating beam lines and an application thereof, the irradiation terminal comprises a combination of rotating beam lines, a rotating gantry, and an operation room. The combination of rotating beam lines includes a rotator beam line, a horizontal beam line, and an inclined beam line at a certain angle to the ground, and can achieve irradiation at different angles; the combination of rotating beam lines is arranged on the rotating gantry, and beam allocation for a plurality of operation rooms at different azimuth angles can be implemented through rotating a single combination of beam lines by 0-360 degrees by the rotating gantry; a plurality of rotating beam lines can be combined to achieve multi-angle beam irradiation in a single operation room.

Abstract: The present disclosure provides a wiring substrate and an electronic apparatus. The wiring substrate includes a substrate and a shielding signal line disposed on the substrate. The substrate includes a functional region; the functional region is provided with a plurality of pad groups; the plurality of pad groups are distributed in an array along a first direction and a second direction respectively, and the second direction intersects with the first direction. The shielding signal line includes a first portion surrounding all pad groups and second portions connected with the first portion, and the second portions are located between two adjacent pad groups along the second direction. The electronic apparatus includes the wiring substrate and an electronic element connected with the pad groups.

Abstract: A display substrate, a manufacturing method therefor and a display device are provided. The display substrate includes a substrate structure layer, the substrate structure layer includes a substrate material layer, a sacrificial layer and an optical film layer between the substrate material layer and the sacrificial layer which are stacked; a reflectivity of the optical film layer is greater than a transmittance of the optical film layer.

Abstract: A light emitting substrate is provided. The light emitting substrate includes a plurality of driver chip sets, a plurality of ground traces, and one or more connection lines. At least one driver chip set includes a plurality of driver chip subsets, at least one driver chip subset includes a plurality of driver chips that are cascaded, and driver chip subsets in a same driver chip set are cascaded. Driver chips in a same driver chip subset are electrically connected to a same ground trace, and different driver chip subsets are respectively connected to different ground traces. Ground traces respectively connected to the driver chip subsets in the same driver chip set are electrically connected by at least one connection line.

Abstract: An array substrate is provided. The array substrate is provided with an avoidance opening at an edging thereof, an orthographic projection of the avoidance opening on a first reference plane having a first edge. The array substrate includes a substrate and at least one positioning structure. The at least one positioning structure is provided on a side of the substrate. A positioning structure includes a main portion, the main portion being substantially parallel to the first edge. The first reference plane is a plane where a surface, away from the positioning structure, of the substrate is located.

Abstract: The present disclosure provides a drive base plate, a light-emitting base plate, a display device, and a manufacturing method for the drive base plate. The drive base plate includes: a substrate; and a first conductive layer and a first block layer disposed on the substrate, the first conductive layer includes multiple first conductive portions arranged at intervals, and each of the first conductive portions includes a first contact pad; the first block layer includes first hollowed-out regions, each of the first hollowed-out regions corresponds to a respective first contact pads, an orthographic projection of the first contact pad on the substrate is within the orthographic projection of the first hollowed-out region on the substrate, and the material of the first block layer includes an oxidation-resistant material.

Abstract: Provided is a wiring substrate. The wiring substrate includes: a base, including a functional region, a bonding region, and a connecting region; a first conductive layer, disposed on a side of the base and in the functional region and the connecting region; a first insulative layer, disposed on a side of the first conductive layer and in the functional region, the connecting region, and the bonding region, wherein a first via is defined in a portion of the first insulative layer and is configured to expose the first conductive layer; a second conductive layer, disposed on a side of the first insulative layer and in the connecting region and the bonding region, and electrically connected to the first conductive layer; and a second insulative layer, disposed on a side of the second conductive layer and in the connecting region and the functional region.

Abstract: The present disclosure provides a driving backplane, a light emitting substrate, a backlight module, and a display apparatus, which belongs to the field of display technology. The driving backplane includes a base substrate, a driving layer and an encapsulation layer sequentially laminated. The driving layer has a pad for binding an electronic element and a raised block corresponding to the pad, the pad is located on a side of the corresponding raised block away from the base substrate (BP), and an orthographic projection of the pad on the base substrate is located within an orthographic projection of the corresponding raised block on the corresponding base substrate. The encapsulation layer has a binding opening. The pad and the raised block are located in the binding opening.

Abstract: A light emitting substrate is provided. The light emitting substrate includes a plurality of driver chip sets, a plurality of ground traces, and one or more connection lines. At least one driver chip set includes a plurality of driver chip subsets, at least one driver chip subset includes a plurality of driver chips that are cascaded, and driver chip subsets in a same driver chip set are cascaded. Driver chips in a same driver chip subset are electrically connected to a same ground trace, and different driver chip subsets are respectively connected to different ground traces. Ground traces respectively connected to the driver chip subsets in the same driver chip set are electrically connected by at least one connection line.

Abstract: A light-emitting substrate includes a substrate, and a first conductive layer, a passivation layer and a first protective pattern that are disposed on the substrate sequentially. The first conductive layer includes a plurality of pad groups each including a plurality of pads. The passivation layer is provided with a plurality of openings therein, an opening is located on a side of a pad away from the substrate, and the opening and an edge of the pad have a distance therebetween. The passivation layer includes a first climbing portion covering a sidewall of a first edge of the pad and a second climbing portion covering a sidewall of a second edge of the pad. The first protective pattern covers the first climbing portion and extends to a side of the passivation layer away from the pad, and the first protective pattern and the opening have a distance therebetween.

Abstract: An array substrate (100) and a display device. The array substrate (100) includes a bonding area (102). The array substrate (100) includes a substrate (10), a first conductive layer (20) on the substrate (10), a first insulating layer (30) on one side of the first conductive layer (20) away from the substrate (10), and a second conductive layer (40) on one side of the first insulating layer (30) away from the substrate (10). The bonding area (102) is provided with bonding pins (201), and the bonding pin (201) includes a first conductive portion (21) and a second conductive portion (41) located on the side of the first conductive portion (21) away from the substrate (10), the first conductive portion (21) is located in the first conductive layer (20), the second conductive portion (41) is located in the second conductive layer (40), and the first conductive portion (21) is in direct contact with the second conductive portion (41).

Abstract: Devices, systems and methods for imaging cortical and trabecular bone are described. An example method for imaging cortical and trabecular bone is provided to include applying one or more adiabatic inversion recoveiy pulses to a cortical and trabecular bone, wherein the one or more adiabatic inversion recoveiy pulses are provided with multiple spokes in a three dimensional adiabatic ultrashort TE cones sequence (3D UTE-Cones sequence) that has a TR/TI combination, TR and TI corresponding to repetition time and inversion time, respectively; and performing data acquisition, by using the multiple spokes, on a target signal obtained after the applying of the one or more adiabatic inversion recoveiy pulses.

Abstract: The present disclosure provides a touch substrate, a method for manufacturing the touch substrate and a touch display device. The touch substrate includes a base substrate, a plurality of driving electrodes and a plurality of sensing electrodes arranged at different layers on the base substrate, and a black matrix arranged at a peripheral region of the touch substrate. Orthogonal projections of the driving electrodes onto the base substrate overlap orthogonal projections of the sensing electrodes onto the base substrate at a plurality of first overlapping regions and a plurality of second overlapping regions, an orthogonal projection of the black matrix onto the base substrate overlaps each first overlapping region and does not overlap each second overlapping region, and an effective area of the first overlapping region is smaller than an effective area of the second overlapping region.

Abstract: The present disclosure provides a touch substrate, a method for manufacturing the touch substrate and a touch display device. The touch substrate includes a base substrate, a plurality of driving electrodes and a plurality of sensing electrodes arranged at different layers on the base substrate, and a black matrix arranged at a peripheral region of the touch substrate. Orthogonal projections of the driving electrodes onto the base substrate overlap orthogonal projections of the sensing electrodes onto the base substrate at a plurality of first overlapping regions and a plurality of second overlapping regions, an orthogonal projection of the black matrix onto the base substrate overlaps each first overlapping region and does not overlap each second overlapping region, and an effective area of the first overlapping region is smaller than an effective area of the second overlapping region.

Abstract: Disclosed are methods and systems for ultrashort echo time magnetization transfer (UTE-MT) imaging and signal modeling to quantify the different proton groups, including free water, bound water and macromolecule protons in short T2 tissues such as the menisci, ligaments, tendons and cortical bone. UTE-MT images with a series of MT frequency offsets and MT power are subject to MT modeling to evaluate T1s, T2s, fractions and exchange rates of bound water, free water and macromolecule protons.

Abstract: Disclosed are systems and methods for accurately measuring T1 in magnetic resonance imaging (MRI) for short T2 tissues by an integrative three-dimensional Ultrashort Echo Time Actual Flip Angle Imaging Variable TR (3D UTE-AFI-VTR) technique. Also, disclosed are systems and methods for accurately measuring T1 for T2 tissues by an integrative three-dimensional Ultrashort Echo Time Actual Flip Angle Imaging Variable Flip Angle (3D UTE-AFI-VFA) technique. The disclosed methods and systems can be implemented to allow accurate T1 mapping for T2 tissues, including menisci, ligaments, tendons, myelin in gray and white matter, cortical bone, and soft tissue in whole joints.

Abstract: Disclosed are methods and systems for ultrashort echo time magnetization transfer (UTE-MT) imaging and signal modeling to quantify the different proton groups, including free water, bound water and macromolecule protons in short T2 tissues such as the menisci, ligaments, tendons and cortical bone. UTE-MT images with a series of MT frequency offsets and MT power are subject to MT modeling to evaluate T1s, T2s, fractions and exchange rates of bound water, free water and macromolecule protons.

Abstract: Disclosed are systems and methods for accurately measuring T1 in magnetic resonance imaging (MRI) for short T2 tissues by an integrative three-dimensional Ultrashort Echo Time Actual Flip Angle Imaging Variable TR (3D UTE-AFI-VTR) technique. Also, disclosed are systems and methods for accurately measuring T1 for T2 tissues by an integrative three-dimensional Ultrashort Echo Time Actual Flip Angle Imaging Variable Flip Angle (3D UTE-AFI-VFA) technique. The disclosed methods and systems can be implemented to allow accurate T1 mapping for T2 tissues, including menisci, ligaments, tendons, myelin in gray and white matter, cortical bone, and soft tissue in whole joints.