Patents by Inventor Yak Long Samuel Lim

Yak Long Samuel Lim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Substrate Arrangement and a Method of Manufacturing a Substrate Arrangement
    Publication number: 20120126419
    Abstract: According to one embodiment of the present invention, a substrate arrangement is provided. The substrate arrangement includes a first substrate; a second substrate positioned above the first substrate, the second substrate comprising a first through hole; a third substrate positioned above the second substrate, the third substrate comprising a second through hole; a first electrically conductive interconnect pillar positioned on the first substrate and extending from the first substrate through the first through hole to electrically contact the third substrate; and a second electrically conductive interconnect pillar positioned on the second substrate and extending from the second substrate through the second through hole. A method of manufacturing a substrate arrangement is also provided.
    Type: Application
    Filed: July 24, 2008
    Publication date: May 24, 2012
    Inventors: Vaidyanathan Kripesh, Navas Khan Orattikalandar, Srinivasa Rao Vempati, Yak Long Samuel Lim, Yee Mong Khoo, Chee Houe Khong, Xiao Wu Zhang, Tai Chong Chai, Hon-Shing John Lau
  • DIE PACKAGE AND A METHOD FOR MANUFACTURING THE DIE PACKAGE
    Publication number: 20110316117
    Abstract: A die package and a method for manufacturing the die package are provided.
    Type: Application
    Filed: August 12, 2008
    Publication date: December 29, 2011
    Inventors: Vaidyanathan Kripesh, Navas Khan Oratti Kalandar, Srinivasa Rao Vempati, Aditya Kumar, Soon Wee Ho, Yak Long Samuel Lim, Gaurav Sharma, Wen Sheng Vincent Lee