Abstract: Disclosed is a connector comprising a front retaining member with a pin receiving passageway, a plurality of conductive pins extending through the passageway, a rear retaining means with a plurality a pin receiving means and a printed wiring board with capacitors and central apertures and being interposed between the front and rear retaining members so as to receive the pins in said apertures.

Abstract: Disclosed is an insert for a modular jack assembly comprising an insulative member comprising a lower section having a base side and opposed front and rear sides and an upper section. The upper section has an upper side, a lower side and a terminal end interposed between said upper and said lower side. The upper section is superimposed over said lower section and extends from the lower side perpendicularly to said terminal ends. A first wire extends from adjacent the base side of the lower section longitudinally through the lower section and transversely through the upper section. It then extends perpenducularly adjacent the upper side of the upper section. A second wire extends from adjacent the base side of the lower section longitudinally through only part of the lower section and then angularly through the front side of the lower section. A third wire extends from adjacent the base side of the lower section longitudinally through the lower section and transversely across the upper section.

Abstract: Disclosed is an electrical socket for connecting a generally planar integrated circuit (IC) having a plurality of peripheral laterally extending contacts to a printed wiring board (PWB) comprising an insulative element interposed between the processing unit and the PWB and having means for retaining the IC; a plurality of latching means positioned in spaced peripheral relation adjacent the base element; a cover element superimposed over the base element and comprising an insulative housing being peripherally engageable by said latching means and a resilient control member positioned in concentric relation with said housing and having a plurality of legs each extending radially from said central section toward one of the latching means; and a plurality of contact means positioned in spaced peripheral relation adjacent the base element to abut the contacts on the processing unit and the PWB.

Abstract: Disclosed is a modular jack having a first plurality of wires which extend in a common vertical plane from the bottom wall of the housing across the opened end and to the top wall and then extend horizontally forward and then angularly downwardly and rearwardly back toward the rear opened end. A second plurality of wires extends first in a common vertical plane from the bottom wall across only a part of the rear opened end and then extends obliquely, horizontally and upwardly toward the front opened end. A method of use is also disclosed.

Abstract: An insert for a modular jack assembly insert comprising an insulative member having top and bottom walls; a front end and a rear recess; a first wire extending from adjacent the bottom wall of the insulative member across the rear recess to the top wall and then through the front end of the insulative member; and a second wire extending from adjacent the bottom wall of the insulative member across the rear recess in non-contacting, overlapping relation with the first wire.

Abstract: Disclosed is a connector comprising a front retaining member with a pin receiving passageway, a plurality of conductive pins extending through the passageway, a rear retaining means with a plurality a pin receiving means and a printed wiring board with capacitors and central apertures and being interposed between the front and rear retaining members so as to receive the pins in said apertures.

Abstract: Disclosed is a connector comprising a front retaining member with a pin receiving passageway, a plurality of conductive pins extending through the passageway, a rear retaining means with a plurality a pin receiving means and a printed wiring board with capacitors and central apertures and being interposed between the front and rear retaining members so as to receive the pins in said apertures.

Abstract: Disclosed is a modular jack having a first plurality of wires which extend in a common vertical plane from the bottom wall of the housing across the opened end and to the top wall and then extend horizontally forward and then angularly downwardly and rearwardly back toward the rear opened end. A second plurality of wires extends first in a common vertical plane from the bottom wall across only a part of the rear opened end and then extends obliquely, horizontally and upwardly toward the front opened end. A method of use is also disclosed.

Abstract: Disclosed is a connector comprising a front retaining member with a pin receiving passageway, a plurality of conductive pins extending through the passageway, a rear retaining means with a plurality a pin receiving means and a printed wiring board with capacitors and central apertures and being interposed between the front and rear retaining members so as to receive the pins in said apertures.

Abstract: Disclosed is a fiber optic backplane connector in which there are a plurality of axially spaced circuit board engaging spring on one side of the exterior housing. By means of this arrangement a single connector is engageable with a number of thicknesses of circuit board. Also disclosed are two resilient metal arms which extend from a metal plate on one side of the connector to engage the medial flange to enable the connector to be assembled without ultrasonic welding. A method for using this connector to connect fiber optic cables as well as to dissipate static electrical charges therein is also disclosed.

Abstract: An electrical connector includes a housing and a plurality of terminals secured within the housing for mounting a mating connector or an electronic module or the like having a plurality of electronic leads disposed thereon to a printed substrate. Each of the terminals has a connecting base portion that is mechanically connected to the printed substrate and a non-connecting base portion that is not mechanically connected to the printed substrate, but rather freely contacts the printed substrate. A first contact beam is cantilevered from the connecting base portion and has a distal end, while a second contact beam is similarly cantilevered from the non-connecting base portion and also has a distal end wherein a gap is formed between the distal ends of the contact beams. The leads of the mating connectors or the like are inserted into the gap for contacting engagement with the contact beams.

Abstract: Disclosed is a filtered modular jack assembly having an outer insulative housing with open front and end sides. A ferrite element with vertical conductive wires is positioned adjacent the rear end, and a elongated insulative insert is superimposed over the ferrite element. The insulative insert is fixed to the housing, and the conductive wire extend vertically from the ferrite element over the upper side of the insert to its terminal end and then bend downwardly and rearwardly to rest on the top surface of an interior medial wall in the housing. A method of assembling a jack with a noise filtering capability is also disclosed.

Abstract: An improved connector for an electronic module or the like includes a housing having a socket opening that is sized and configured to accept an electronic module, and a plurality of terminals mounted to the housing. Each of the terminals has a foot portion having a layer of non-solderable material coated on one side of the foot portion to prevent solder from adhering to that side. A capillary nest is formed by a channel surface on the underside of the foot portion when the terminal is mounted on a conductor pad such that solder flows through the capillary nest under the influence of capillary forces from the side of the terminal having a non-solderable coating thereon to the other side for forming a solder joint on that other side. A ring of non-solderable material is coated around a middle portion of the terminal to prevent solder from flowing to the electrical contact surfaces located above the ring.

Abstract: An improved connector for an electronic module of the type that has a number of leads positioned on an underside adjacent to at least one edge thereof includes a housing having a socket opening that is sized and configured to accept an electronic module, and a plurality of terminals mounted to the housing. Each of the terminals has a first leg portion that includes a cam surface that is constructed and arranged to be engaged by an edge of an electronic module during insertion to control insertion force and distance, and a second leg portion that is connected to the first leg portion and has a contact surface for contacting at least one lead on an underside of the electronic module. An elastomeric absorber is positioned between the second leg portion and the housing for biasing the second leg portion upwardly against the underside of the electronic module when the electronic module is fully inserted into said connector.

Abstract: An electronic assembly contains a semiconductor chip, a metal heat spreading layer, a dielectric layer and a metal heat sink wherein superior heat dissipation is present.

Abstract: A fuse is disclosed for protecting thick film devices. The fuse comprises two blocks of material mounted to the substrate that carries the thick film device. The blocks are mounted in close proximity to one another, in axial alignment, but in a spaced apart relationship. An electrically conductive fusible link (e.g. solder) straddles the two blocks so as to complete an electric circuit.

Abstract: A novel construction for a thick film resistor is disclosed. A substrate has a first face deposited with a layer of resistive material. Between the substrate and this first layer is located a strip of conductive material. The strip of material is oriented at approximately right angles to the current path through the first layer, midway along the current path. A second layer of resistive material is located on a second face, parallel to the first face, and the first and second layers are connected electrically in series such that the current path through the second layer is orthogonal to the current path through the first layer.