Abstract: A method of producing a compacted article according to one embodiment may involve the steps of: Providing a copper/molybdenum disulfide composite powder including a substantially homogeneous dispersion of copper and molybdenum disulfide sub-particles that are fused together to form individual particles of the copper/molybdenum disulfide composite powder; and compressing the copper/molybdenum disulfide composite powder under sufficient pressure to cause the copper/molybdenum disulfide composite powder to behave as a nearly solid mass.

Abstract: A coated article system includes a substrate and a surface coating on the substrate. The surface coating is formed by depositing individual particles of a composite metal powder with sufficient energy to cause the composite metal powder to bond with the substrate and form the surface coating. The composite metal powder includes a substantially homogeneous dispersion of molybdenum and molybdenum disulfide sub-particles that are fused together to form the individual particles of the composite metal powder.

Abstract: A friction material composition may include an abrasive, a filler, a binder, and a spherical molybdenum disulfide powder. The spherical molybdenum disulfide powder is made up of molybdenum disulfide sub-particles that are agglomerated together to form individual, substantially spherically-shaped agglomerated particles of at least about 90% by weight molybdenum disulfide.

Abstract: Molybdenum disulfide powders include substantially spherically-shaped particles of molybdenum disulfide that are formed from agglomerations of generally flake-shaped sub-particles. The molybdenum disulfide powders are flowable and exhibit uniform densities. Methods for producing a molybdenum disulfide powder may include the steps of: Providing a supply of molybdenum disulfide precursor material; providing a supply of a liquid; providing a supply of a binder; combining the molybdenum disulfide precursor material with the liquid and the binder to form a slurry; feeding the slurry into a stream of hot gas; and recovering the molybdenum disulfide powder, the molybdenum disulfide powder including substantially spherically-shaped particles of molybdenum disulfide formed from agglomerations of generally flake-shaped sub-particles.

Abstract: A method for producing a metal article according to one embodiment may involve the steps of: Providing a composite metal powder including a substantially homogeneous dispersion of molybdenum and molybdenum disulfide sub-particles that are fused together to form individual particles of the composite metal powder; and compressing the molybdenum/molybdenum disulfide composite metal powder under sufficient pressure to cause the mixture to behave as a nearly solid mass.

Abstract: A friction material composition may include an abrasive, a filler, a binder, and a spherical molybdenum disulfide powder. The spherical molybdenum disulfide powder is made up of molybdenum disulfide sub-particles that are agglomerated together to form individual, substantially spherically-shaped agglomerated particles of at least about 90% by weight molybdenum disulfide.

Abstract: A method of producing a compacted article according to one embodiment may involve the steps of: Providing a copper/molybdenum disulfide composite powder including a substantially homogeneous dispersion of copper and molybdenum disulfide sub-particles that are fused together to form individual particles of the copper/molybdenum disulfide composite powder; and compressing the copper/molybdenum disulfide composite powder under sufficient pressure to cause the copper/molybdenum disulfide composite powder to behave as a nearly solid mass.

Abstract: Molybdenum disulfide powders include substantially spherically-shaped particles of molybdenum disulfide that are formed from agglomerations of generally flake-shaped sub-particles. The molybdenum disulfide powders are flowable and exhibit uniform densities. Methods for producing a molybdenum disulfide powder may include the steps of: Providing a supply of molybdenum disulfide precursor material; providing a supply of a liquid; providing a supply of a binder; combining the molybdenum disulfide precursor material with the liquid and the binder to form a slurry; feeding the slurry into a stream of hot gas; and recovering the molybdenum disulfide powder, the molybdenum disulfide powder including substantially spherically-shaped particles of molybdenum disulfide formed from agglomerations of generally flake-shaped sub-particles.

Abstract: Molybdenum disulfide powders include substantially spherically-shaped particles of molybdenum disulfide that are formed from agglomerations of generally flake-like sub-particles. The molybdenum disulfide powders are flowable and exhibit uniform densities. Methods for producing a molybdenum disulfide powder may include the steps of: Providing a supply of molybdenum disulfide precursor material; providing a supply of a liquid; providing a supply of a binder; combining the molybdenum disulfide precursor material with the liquid and the binder to form a slurry; feeding the slurry into a stream of hot gas; and recovering the molybdenum disulfide powder, the molybdenum disulfide powder including substantially spherically-shaped particles of molybdenum disulfide formed from agglomerations of generally flake-like sub-particles.

Abstract: A coated article system includes a substrate and a surface coating on the substrate. The surface coating is formed by depositing individual particles of a composite metal powder with sufficient energy to cause the composite metal powder to bond with the substrate and form the surface coating. The composite metal powder includes a substantially homogeneous dispersion of molybdenum and molybdenum disulfide sub-particles that are fused together to form the individual particles of the composite metal powder.

Abstract: Molybdenum disulfide powders include substantially spherically-shaped particles of molybdenum disulfide that are formed from agglomerations of generally flake-like sub-particles. The molybdenum disulfide powders are flowable and exhibit uniform densities. Methods for producing a molybdenum disulfide powder may include the steps of: Providing a supply of molybdenum disulfide precursor material; providing a supply of a liquid; providing a supply of a binder; combining the molybdenum disulfide precursor material with the liquid and the binder to form a slurry; feeding the slurry into a stream of hot gas; and recovering the molybdenum disulfide powder, the molybdenum disulfide powder including substantially spherically-shaped particles of molybdenum disulfide formed from agglomerations of generally flake-like sub-particles.

Abstract: A method for producing a metal article according to one embodiment may involve the steps of: Providing a composite metal powder including a substantially homogeneous dispersion of molybdenum and molybdenum disulfide sub-particles that are fused together to form individual particles of the composite metal powder; and compressing the molybdenum/molybdenum disulfide composite metal powder under sufficient pressure to cause the mixture to behave as a nearly solid mass.

Abstract: A coated article system includes a substrate and a surface coating on the substrate. The surface coating is formed by depositing individual particles of a composite metal powder with sufficient energy to cause the composite metal powder to bond with the substrate and form the surface coating. The composite metal powder includes a substantially homogeneous dispersion of molybdenum and molybdenum disulfide sub-particles that are fused together to form the individual particles of the composite metal powder.

Abstract: A method for producing a metal article according to one embodiment may involve the steps of: Providing a composite metal powder including a substantially homogeneous dispersion of molybdenum and molybdenum disulfide sub-particles that are fused together to form individual particles of the composite metal powder; and compressing the molybdenum/molybdenum disulfide composite metal powder under sufficient pressure to cause the mixture to behave as a nearly solid mass.

Abstract: A method is provided for planarizing/polishing and subsequently in situ cleaning a surface of a work piece such as a semiconductor wafer. The method includes the steps of planarizing/polishing the surface of a work piece by subjecting a work piece surface to a chemical mechanical planarization/polishing (CMP) process on a chemical mechanical planarization/polishing platen such that the planarization/polishing process leaves the surface of the work piece hydrophobic. The planarization/polishing process is followed by a chemical mechanical cleaning (CMC) process in which the planarized/polished surface of the work piece is subjected to the cleaning process on the same chemical mechanical planarization/polishing platen such that the cleaning process leaves the surface of the work piece hydrophilic.

Abstract: A method is provided for planarizing/polishing and subsequently in situ cleaning a surface of a work piece such as a semiconductor wafer. The method includes the steps of planarizing/polishing the surface of a work piece by subjecting a work piece surface to a chemical mechanical planarization/polishing (CMP) process on a chemical mechanical planarization/polishing platen such that the planarization/polishing process leaves the surface of the work piece hydrophobic. The planarization/polishing process is followed by a chemical mechanical cleaning (CMC) process in which the planarized/polished surface of the work piece is subjected to the cleaning process on the same chemical mechanical planarization/polishing platen such that the cleaning process leaves the surface of the work piece hydrophilic.

Abstract: The invention relates generally to a system and method for improved cleaning of workpieces and workpiece cleaning tools. More specifically, the invention provides systems and methods for cleaning workpieces and sponges by manipulating the surface charge of one or more sponges by exposing them to various cleaning fluids. In one embodiment, sponges such as PVA sponges, having either positive, negative or neutral charges, are used to clean surfaces of workpieces such as semiconductor wafers. While cleaning a workpiece, a sponge may be exposed to a workpiece cleaning fluid, which may or may not alter the surface charge of the sponge. After cleaning the workpiece, the sponge may be exposed to a sponge cleaning fluid, which may or may not alter the surface charge of the sponge.

Abstract: A multiple wafer cleaning apparatus comprising a first module (12), having a first spaced-apart brush assembly having an inner brush (21a) and an outer brush (22a), each brush having a brush pad (102) and a platen (103), and a second module (14) having a second spaced-apart brush assembly (22) having an inner brush (22a) and an outer brush (22b), each brush having a brush pad (102) and a platen (103), each pair of spaced-apart, opposing, vertically disposed brushes (21) and (22) for scrubbing vertically disposed semiconductor wafers (25), in tanks (28). The two modularized sets of motorized, rotating, opposed, pancake shaped brushes (12) and (14), grip the freely rotating wafers (25) causing the wafers (25) to rotate in the same direction as the brushes.

Abstract: The invention relates generally to a system and method for improved cleaning of workpieces and workpiece cleaning tools. More specifically, the invention provides systems and methods for cleaning workpieces and sponges by manipulating the surface charge of one or more sponges by exposing them to various cleaning fluids. In one embodiment, sponges such as PVA sponges, having either positive, negative or neutral charges, are used to clean surfaces of workpieces such as semiconductor wafers. While cleaning a workpiece, a sponge may be exposed to a workpiece cleaning fluid, which may or may not alter the surface charge of the sponge. After cleaning the workpiece, the sponge may be exposed to a sponge cleaning fluid, which may or may not alter the surface charge of the sponge.

Abstract: A method and apparatus for cleaning a wafer in a dual brush cleaning system is disclosed. Two brushes, preferably made of PVA and wetted by cleaning fluids, are positioned opposite one another and spaced apart enough to allow a portion of a wafer to be inserted between their working surfaces and make frictional engagement with them. The top brush is rotated at a first speed and the bottom brush is rotated at a second faster speed sufficient for the freely rotating wafer to rotate at the same speed and in the same direction as the top brush. The bottom brush may have raised areas on its surface to assist in efficiently gripping and rotating the wafer. A common rotation speed and direction causes a uniform relative velocity between the top brush and the wafer that results in an improved cleaning operation.