Abstract: A backplane includes: a substrate including a circuit structure layer and a second reflective layer, a first reflective layer disposed on a bearing surface of the substrate, a plurality of light-emitting diode chips, and a plurality of optical structures. The first reflective layer includes a plurality of through holes spaced apart. A light-emitting diode chip in the plurality of light-emitting diode chips is located in a through hole. The plurality of light-emitting diode chips are electrically connected to the circuit structure layer. The circuit structure layer is configured to drive the plurality of light-emitting diode chips to emit light. An optical structure in the plurality of optical structures covers the light-emitting diode chip, a light incident surface of the optical structure is in contact with a light exit surface of the light-emitting diode chip, and a light exit surface of the optical structure is a curved surface.

Abstract: Provided are a thermal barrier coating and a preparation method thereof, which belong to the field of coating technology.

Abstract: A metal mesh includes: first metal lines (11) and second metal lines (12) extending in crossed directions. The first metal lines (11) are arranged side by side in a first direction and extend in a second direction; the second metal lines (12) are arranged side by side in the first direction and extend in a third direction. Each first metal line (11) includes first sub-line segments sequentially connected together in the second direction, and each second metal line (12) includes second sub-line segments sequentially connected together in the third direction. Each first sub-line segment has a midpoint superposing with a midpoint of one of the second sub-line segments, the first and second sub-line segments having superposed midpoints form a crossed structure (10), and define two opposite first angles (?1) and two opposite second angles (?2). Each first angle (?1) is not greater than each second angle (?1).

Abstract: An antenna structure includes a substrate, a ground layer, a radiation patch, a first feed structure, and a second feed structure. The radiation patch, the first feed structure, and the second feed structure are located on a first surface of the substrate, and the ground layer is located on a second surface of the substrate. The first surface and the second surface are two surfaces of the substrate facing away from each other. The radiation patch has a slotted structure. In a first direction, the first feed structure and the second feed structure are symmetrically located on both sides of the radiation patch.

Abstract: A backplane includes: a substrate including a circuit structure layer, a first reflective layer disposed on a bearing surface of the substrate, a plurality of light-emitting diode chips, and a plurality of optical structures. The first reflective layer includes a plurality of through holes spaced apart. A light-emitting diode chip in the plurality of light-emitting diode chips is located in one of the plurality of through holes. The plurality of light-emitting diode chips are electrically connected to the circuit structure layer. The circuit structure layer is configured to drive the plurality of light-emitting diode chips to emit light. An optical structure in the plurality of optical structures covers the light-emitting diode chip, a light incident surface of the optical structure is in contact with a light exit surface of the light-emitting diode chip, and a light exit surface of the optical structure is a curved surface.

Abstract: Provided are stable formulations of anti-CD73 antibodies, which include 5-50 mM histidine, 2%-20% (w/v) trehalose, and 0.015%-0.05% (w/v) polysorbate 80 (PS80), at pH 5.6-6.4. Also provided are lyophilized compositions that can be obtained by drying the aqueous formulations and methods for treating diseases.