Patents by Inventor Yaling WEI

Yaling WEI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • SEMICONDUCTOR DEVICE AND FORMATION METHOD THEREOF
    Publication number: 20260248018
    Abstract: A method of forming a semiconductor device comprises the following steps. A metal pad material is formed over an interconnect structure over a substrate. The metal pad material is patterned into a plurality of metal pads. Upper portions of the plurality of metal pads are trimmed. After the trimming, each of the plurality of metal pads has a stepped sidewall structure comprising a lower sidewall and an upper sidewall set back from the lower sidewall. A first passivation layer is formed over the plurality of metal pads.
    Type: Application
    Filed: March 6, 2025
    Publication date: August 20, 2026
    Applicants: TSMC NANJING COMPANY LIMITED, TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Yaling WEI, I-Chih CHEN