Patents by Inventor Yalu Liu

Yalu Liu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electronic device
    Patent number: 11490185
    Abstract: An electronic device includes a chassis, a microphone hole penetrating an outer wall of the chassis, and a microphone module that faces the microphone hole. The microphone module has a microphone that obtains sound information outside the chassis through the microphone hole, a flexible substrate laminated on a back surface of the microphone, a metallic plate laminated on a back surface of the flexible substrate, and a sound hole opened in the back surface of the microphone and penetrating the flexible substrate and the metallic plate. The electronic device further includes a double-sided tape fastened to a first region, surrounding the sound hole, of a back surface of the metallic plate, and to an inner surface of the chassis, and that fixes the microphone module to the chassis, and a conductive member that electrically connects the second region of the metallic plate and the inner surface of the chassis.
    Type: Grant
    Filed: July 29, 2021
    Date of Patent: November 1, 2022
    Assignee: Lenovo (Singapore) Pte. Ltd.
    Inventors: Wenjin Niu, Jun Iwasaki, Toshikazu Horino, Toshinari Sumikawa, Shigehiro Horiuchi, Takehito Yamauchi, Yalu Liu, Keita Ishikawa
  • ELECTRONIC DEVICE
    Publication number: 20220174386
    Abstract: An electronic device includes a chassis, a microphone hole penetrating an outer wall of the chassis, and a microphone module that faces the microphone hole. The microphone module has a microphone that obtains sound information outside the chassis through the microphone hole, a flexible substrate laminated on a back surface of the microphone, a metallic plate laminated on a back surface of the flexible substrate, and a sound hole opened in the back surface of the microphone and penetrating the flexible substrate and the metallic plate. The electronic device further includes a double-sided tape fastened to a first region, surrounding the sound hole, of a back surface of the metallic plate, and to an inner surface of the chassis, and that fixes the microphone module to the chassis, and a conductive member that electrically connects the second region of the metallic plate and the inner surface of the chassis.
    Type: Application
    Filed: July 29, 2021
    Publication date: June 2, 2022
    Applicant: Lenovo (Singapore) Pte. Ltd.
    Inventors: Wenjin Niu, Jun Iwasaki, Toshikazu Horino, Toshinari Sumikawa, Shigehiro Horiuchi, Takehito Yamauchi, Yalu Liu, Keita Ishikawa