Patents by Inventor Yalu Liu
Yalu Liu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20230309249Abstract: An electronic apparatus has a first chassis member, a second chassis member adjacent to the first chassis member, and a hinge device that relatively rotatably connects the first chassis member and the second chassis member between a 0-degree posture and a 180-degree posture The adjacent end portion of the first chassis member is provided with a stopper projection that comes into contact with the adjacent end portion of the second chassis member in the 180-degree posture. The stopper projection is provided near a center of a thickness W of the first chassis member in the adjacent end portion the first chassis member.Type: ApplicationFiled: January 27, 2023Publication date: September 28, 2023Applicant: LENOVO (SINGAPORE) PTE. LTD.Inventors: Hiroaki Kinoshita, Yalu Liu, Daisuke Takahashi, Tetsuya Sano
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Publication number: 20230305602Abstract: The electronic apparatus includes a first chassis equipped with a first electronic component, a second chassis equipped with a second electronic component, a hinge device that relatively rotatably connects the first chassis and the second chassis, and a flexible board provided over the first chassis and the second chassis and connecting the first electronic component and the second electronic component. The flexible board has a first folded portion and a second folded portion that are disposed in order and curved in opposite directions to each other in the first chassis.Type: ApplicationFiled: February 27, 2023Publication date: September 28, 2023Applicant: Lenovo (Singapore) Pte. Ltd.Inventors: Tabito Miyamoto, Yalu Liu, Hiroaki Kinoshita, Takayuki Morino
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Publication number: 20230288960Abstract: An electronic apparatus includes: a first chassis which has a first frame member; a second chassis which has a second frame member which is adjacent to the first frame member and is adjacent to the first chassis; a display which is supported to the first chassis and the second chassis; and a hinge device which so connects the first chassis and the second chassis as to be rotationally movable relative to each other between a first posture that the first chassis and the second chassis are so folded as to mutually overlap in a surface normal direction and a second posture that the first chassis and the second chassis are mutually arrayed in a direction which is vertical to the surface normal direction.Type: ApplicationFiled: February 16, 2023Publication date: September 14, 2023Applicant: Lenovo (Singapore) Pte. Ltd.Inventors: Takayuki Morino, Daisuke Takahashi, Takehito Yamauchi, Yalu Liu
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Publication number: 20230287929Abstract: An electronic apparatus includes: a first chassis; a second chassis which is adjacent to the first chassis; a hinge device which so connects the first chassis and the second chassis as to be rotationally movable relative to each other between a first posture that the first chassis and the second chassis are so folded as to mutually overlap in a surface normal direction and a second posture that the first chassis and the second chassis are mutually arrayed in a direction which is vertical to the surface normal direction; and a display which is so installed as to range from the first chassis to the second chassis and has a folding region which is folded in accordance with relative rotational movement of the first chassis and the second chassis.Type: ApplicationFiled: February 17, 2023Publication date: September 14, 2023Applicant: Lenovo (Singapore) Pte. Ltd.Inventors: Takayuki Morino, Yalu Liu, Tabito Miyamoto
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Patent number: 11490185Abstract: An electronic device includes a chassis, a microphone hole penetrating an outer wall of the chassis, and a microphone module that faces the microphone hole. The microphone module has a microphone that obtains sound information outside the chassis through the microphone hole, a flexible substrate laminated on a back surface of the microphone, a metallic plate laminated on a back surface of the flexible substrate, and a sound hole opened in the back surface of the microphone and penetrating the flexible substrate and the metallic plate. The electronic device further includes a double-sided tape fastened to a first region, surrounding the sound hole, of a back surface of the metallic plate, and to an inner surface of the chassis, and that fixes the microphone module to the chassis, and a conductive member that electrically connects the second region of the metallic plate and the inner surface of the chassis.Type: GrantFiled: July 29, 2021Date of Patent: November 1, 2022Assignee: Lenovo (Singapore) Pte. Ltd.Inventors: Wenjin Niu, Jun Iwasaki, Toshikazu Horino, Toshinari Sumikawa, Shigehiro Horiuchi, Takehito Yamauchi, Yalu Liu, Keita Ishikawa
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Publication number: 20220174386Abstract: An electronic device includes a chassis, a microphone hole penetrating an outer wall of the chassis, and a microphone module that faces the microphone hole. The microphone module has a microphone that obtains sound information outside the chassis through the microphone hole, a flexible substrate laminated on a back surface of the microphone, a metallic plate laminated on a back surface of the flexible substrate, and a sound hole opened in the back surface of the microphone and penetrating the flexible substrate and the metallic plate. The electronic device further includes a double-sided tape fastened to a first region, surrounding the sound hole, of a back surface of the metallic plate, and to an inner surface of the chassis, and that fixes the microphone module to the chassis, and a conductive member that electrically connects the second region of the metallic plate and the inner surface of the chassis.Type: ApplicationFiled: July 29, 2021Publication date: June 2, 2022Applicant: Lenovo (Singapore) Pte. Ltd.Inventors: Wenjin Niu, Jun Iwasaki, Toshikazu Horino, Toshinari Sumikawa, Shigehiro Horiuchi, Takehito Yamauchi, Yalu Liu, Keita Ishikawa