Patents by Inventor Yamahiro Isawa

Yamahiro Isawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electromagnetic wave shielding composition comprising epoxy resin and copper particles
    Patent number: 5066692
    Abstract: An electromagnetic wave shielding circuit and the production method thereof is described, wherein the circuit comprises a base board, an electric circuit formed on the base board, an electrically isolating coating coated over the electric circuit, a layer of coating having copper particles contained therein coated over the electrically isolating coating and hardened by heating, a copper plating layer attached to the surface of the copper particle containing coating for discharging out of the electric circuit an electromagnetic wave current which may be produced in the electric circuit, said copper particle containing coating having contained therein 100% by weight of copper particles and 12%-25% by weight of epoxy resin for a binder.
    Type: Grant
    Filed: June 21, 1990
    Date of Patent: November 19, 1991
    Assignee: Asahi Chemical Research Laboratory Co., Ltd.
    Inventors: Yamahiro Isawa, Isao Morooka, Yoichi Oba