Patents by Inventor Yamato Samitsu

Yamato Samitsu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Polishing apparatus and method with constant polishing pressure
    Patent number: 6652354
    Abstract: In an apparatus for polishing a substrate, including a polishing platen for mounting the substrate thereon, a polishing head, a polishing pad adhered to a bottom face of the polishing head, and a rocking section for rocking. I.e., moving the polishing head in the horizontal direction with respect to the polishing platen, a control circuit controls a load of the polishing pad applied to the substrate in accordance with a contact area of the polishing pad to the substrate.
    Type: Grant
    Filed: May 9, 2001
    Date of Patent: November 25, 2003
    Assignees: NEC Corporation, Nikon Corporation
    Inventors: Yoshihiro Hayashi, Takahiro Onodera, Yamato Samitsu, Kiyoshi Tanaka, Naoki Sasaki
  • Polishing apparatus and method with constant polishing pressure
    Publication number: 20020037680
    Abstract: In an apparatus for polishing a substrate, including a polishing platen for mounting the substrate thereon, a polishing head, a polishing pad adhered to a bottom face of the polishing head, and a rocking section for rocking. I.e., moving the polishing head in the horizontal direction with respect to the polishing platen, a control circuit controls a load of the polishing pad applied to the substrate in accordance with a contact area of the polishing pad to the substrate.
    Type: Application
    Filed: May 9, 2001
    Publication date: March 28, 2002
    Applicant: NEC Corporation
    Inventors: Yoshihiro Hayashi, Takahiro Onodera, Yamato Samitsu, Kiyoshi Tanaka, Naoki Sasaki
  • Polishing apparatus and method with constant polishing pressure
    Patent number: 6270392
    Abstract: In an apparatus for polishing a substrate, including a polishing platen for mounting the substrate thereon, a polishing head, a polishing pad adhered to a bottom face of the polishing head, and a rocking section for rocking. I.e., moving the polishing head in the horizontal direction with respect to the polishing platen, a control circuit controls a load of the polishing pad applied to the substrate in accordance with a contact area of the polishing pad to the substrate.
    Type: Grant
    Filed: June 18, 1999
    Date of Patent: August 7, 2001
    Assignees: NEC Corporation, Niken Corporation
    Inventors: Yoshihiro Hayashi, Takahiro Onodera, Yamato Samitsu, Kiyoshi Tanaka, Naoki Sasaki
  • Flattening method and apparatus for semiconductor device
    Patent number: 5877088
    Abstract: When the surface of a semiconductor device having at least two different films formed on a substrate is flattened by chemical mechanical polishing, the abrasion resistance upon polishing is detected by strain gauges provided close to the surface of the semiconductor device to be polished. In addition, the end of the polishing process is determined on the basis of the amount of change of the detected signals produced from the strain gauges.
    Type: Grant
    Filed: November 8, 1996
    Date of Patent: March 2, 1999
    Assignee: Nippon Steel Corporation
    Inventors: Yamato Samitsu, Hirohiko Izumi