Patents by Inventor Yan-Bo An

Yan-Bo An has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240132420
    Abstract: The present disclosure provides a joint control method for nitrogen and phosphorus emissions in farmlands, comprising: reducing nitrogen and phosphorus input during crop sowing or planting by applying composite organic material and chemical fertilizer, wherein the composite organic material comprises: 200-250 parts of edible fungi residues, 300-350 parts of charcoal and 5-10 parts of rhamnolipid; constructing a nitrogen-phosphorus retention layer by utilizing composite microbial agent in combination with 150 parts of edible fungi residues and 20 parts of straw-based hydrogel; constructing a barrier layer by utilizing composite material, and controlling downward leaching of nitrogen and phosphorus that are not absorbed by crops, wherein the composite material of the barrier layer comprises: 25-35 parts of straw-based hydrogel, 20-30 parts of edible fungi residues, 35-55 parts of bentonite and 5-10 parts of corn flour.
    Type: Application
    Filed: March 9, 2023
    Publication date: April 25, 2024
    Applicant: Shandong Academy of Agricultural Sciences Institute of Agricultural Resources and Environment
    Inventors: Yan Li, Longyun Fu, Xiuchu Liu, Yongping Jing, Luji Bo, Ming Sun, Ziwen Zhong
  • Publication number: 20240071470
    Abstract: A memory device includes a first transistor, a second transistor and a third transistor. The first transistor is coupled to a first word line at a first node. The second transistor is coupled to a second word line different from the first word line at a second node. A control terminal of the first transistor is coupled to a control terminal of the second transistor. The third transistor is coupled between a ground and a third node which is coupled to each of the first node and the second node. In a layout view, each of the first transistor and the second transistor has a first length along a direction. The first transistor, the third transistor and second transistor are arranged in order along the direction. A method is also disclosed herein.
    Type: Application
    Filed: November 1, 2023
    Publication date: February 29, 2024
    Applicants: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., TSMC Nanjing Company Limited, TSMC China Company Limited
    Inventors: He-Zhou WAN, Xiu-Li YANG, Mu-Yang YE, Yan-Bo SONG
  • Patent number: 11862231
    Abstract: A memory device includes a first transistor, a second transistor and a third transistor. The first transistor is coupled to a first word line at a first node. The second transistor is coupled to a second word line different from the first word line at a second node. A control terminal of the first transistor is coupled to a control terminal of the second transistor. The third transistor is coupled between a ground and a third node which is coupled to each of the first node and the second node. In a layout view, each of the first transistor and the second transistor has a first length along a direction. The first transistor, the third transistor and second transistor are arranged in order along the direction. A method is also disclosed herein.
    Type: Grant
    Filed: October 26, 2022
    Date of Patent: January 2, 2024
    Assignees: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD, TSMC NANJING COMPANY LIMITED, TSMC CHINA COMPANY LIMITED
    Inventors: He-Zhou Wan, Xiu-Li Yang, Mu-Yang Ye, Yan-Bo Song
  • Publication number: 20230268145
    Abstract: The disclosure provides a key device including a casing, a soft material layer, a key, and an elastic support member. The casing has a first assembly hole. The soft material layer is disposed on the casing and has a second assembly hole. The key presses the soft material layer and is disposed on the casing. The key has a key body, and the key body passes through the second assembly hole and the first assembly hole correspondingly and is exposed to the outside of the casing. The elastic support member is assembled on the key and disposed on the casing, and the elastic support member has a sliding groove. The sliding groove corresponds to the key so that the key is slidably disposed in the sliding groove. The key device of the disclosure has slidable, waterproof, and dustproof functions.
    Type: Application
    Filed: February 14, 2023
    Publication date: August 24, 2023
    Applicants: Maintek Computer (Suzhou) Co., Ltd., PEGATRON CORPORATION
    Inventors: Jing-Bo Wang, Chun-Yen Huang, Yan-Bo An
  • Publication number: 20230268142
    Abstract: The disclosure provides a key device including a housing, a soft material layer, and a key component. The housing has at least one first assembly hole. The soft material layer is disposed on the housing and has at least one second assembly hole. The key component includes at least one key body and an elastic frame. The key body is exposed to the housing through the second assembly hole and the first assembly hole correspondingly. The elastic frame is connected with the key body and squeezes the soft material layer. The key device of the disclosure has waterproof and dustproof functions and may effectively reduce the cost.
    Type: Application
    Filed: February 16, 2023
    Publication date: August 24, 2023
    Applicants: Maintek Computer (Suzhou) Co., Ltd., PEGATRON CORPORATION
    Inventors: Jing-Bo Wang, Chun-Yen Huang, Yan-Bo An
  • Patent number: 11621525
    Abstract: A terminal assembly and an electrical connector, the terminal assembly comprises a plurality of ground terminals, a plurality of signal terminals, and an insulating body. Each ground terminal comprises a ground terminal body, a ground pin, and a plurality of ground assembling pins. The plurality of signal and ground terminals are alternately arranged and disposed at intervals along a first direction. At least one signal terminal is disposed between two adjacent ground terminals. Each signal terminal comprises a signal terminal body, a signal pin, and a signal assembling pin. The insulating body is disposed on the plurality of ground terminal bodies and the plurality of signal terminal bodies. A plurality of first distances exist between the plurality of ground pins and the plurality of signal pins. A plurality of second and third distances exist between the plurality of ground assembling pins and the plurality of signal assembling pins.
    Type: Grant
    Filed: June 25, 2021
    Date of Patent: April 4, 2023
    Assignee: DONGGUAN LUXSHARE TECHNOLOGIES CO., LTD
    Inventor: Yan-Bo Lin
  • Publication number: 20230049698
    Abstract: A memory device includes a first transistor, a second transistor and a third transistor. The first transistor is coupled to a first word line at a first node. The second transistor is coupled to a second word line different from the first word line at a second node. A control terminal of the first transistor is coupled to a control terminal of the second transistor. The third transistor is coupled between a ground and a third node which is coupled to each of the first node and the second node. In a layout view, each of the first transistor and the second transistor has a first length along a direction. The first transistor, the third transistor and second transistor are arranged in order along the direction. A method is also disclosed herein.
    Type: Application
    Filed: October 26, 2022
    Publication date: February 16, 2023
    Applicants: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., TSMC Nanjing Company Limited, TSMC China Company Limited
    Inventors: He-Zhou WAN, Xiu-Li YANG, Mu-Yang YE, Yan-Bo SONG
  • Patent number: 11545788
    Abstract: A terminal assembly and an electrical connector, the terminal assembly comprises a plurality of ground terminals, a plurality of signal terminals, and an insulating body. Each ground terminal comprises a ground terminal body, a ground pin, and a plurality of ground assembling pins. The plurality of signal terminals and the plurality of ground terminals are alternately arranged and disposed at intervals along a first direction. At least one signal terminal is disposed between two adjacent ground terminals. Each signal terminal comprises a signal terminal body, a signal pin, and a signal assembling pin. The insulating body is disposed on the plurality of ground terminal bodies and the plurality of signal terminal bodies. A plurality of first distances exist between the plurality of ground pins and the plurality of signal pins. A plurality of second distances exist between the plurality of ground assembling pins and the plurality of signal assembling pins.
    Type: Grant
    Filed: July 15, 2021
    Date of Patent: January 3, 2023
    Assignee: DONGGUAN LUXSHARE TECHNOLOGIES CO., LTD
    Inventor: Yan-Bo Lin
  • Patent number: 11514974
    Abstract: A memory device includes a word line driver. The word line driver is coupled through word lines to an array of bit cells. The word line driver includes a first driving circuit, a second driving circuit and a modulating circuit. The first driving circuit and the second driving circuit are configured to select a word line. The modulating circuit is coupled through the selected word line to the first driving circuit and the second driving circuit, and is configured to modulate at least one signal transmitted through the selected word line. The first driving circuit and the second driving circuit are further configured to charge the selected word line to generate a first voltage signal and a second voltage signal at two positions of the selected word line. The first voltage signal is substantially the same as the second voltage signal. A method is also disclosed herein.
    Type: Grant
    Filed: March 22, 2021
    Date of Patent: November 29, 2022
    Assignees: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., TSMC NANJING COMPANY LIMITED, TSMC CHINA COMPANY LIMITED
    Inventors: He-Zhou Wan, Xiu-Li Yang, Mu-Yang Ye, Yan-Bo Song
  • Publication number: 20220367484
    Abstract: A memory device includes a first memory array, a first isolation cell abutting a first side of the first memory array, a first edge cell array abutting a second side, opposite to the first side, of the first memory array, a second memory array arranged at a first side, opposite to the first memory array, of the first isolation cell, a second edge cell array, and multiple first word lines passing through the first edge cell array, the first memory array and being terminated at the first isolation cell. A first width of the first isolation cell is different from a second width of the first edge cell array. The second memory array is sandwiched between the second edge cell array and the first isolation cell.
    Type: Application
    Filed: July 29, 2022
    Publication date: November 17, 2022
    Applicants: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., TSMC CHINA COMPANY LIMITED
    Inventors: Xiu-Li YANG, He-Zhou WAN, Yan-Bo SONG
  • Patent number: 11462551
    Abstract: A memory device includes a first isolation cell, a first memory array of a first memory segment, a second memory array of a second memory segment, a first decoder cell of the first memory segment and a second decoder cell of the second memory segment. The first isolation cell extends in a first direction. The first memory array of the first memory segment abuts a first boundary of the first isolation cell in a second direction different from the first direction. The second memory array of the second memory segment abuts a second boundary, opposite to the first boundary, of the first isolation cell in the second direction. The first decoder cell of the first memory segment and the second decoder cell of the second memory segment are arranged on opposite sides of the first isolation cell.
    Type: Grant
    Filed: April 8, 2021
    Date of Patent: October 4, 2022
    Assignees: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., TSMC CHINA COMPANY LIMITED
    Inventors: Xiu-Li Yang, He-Zhou Wan, Yan-Bo Song
  • Publication number: 20220254404
    Abstract: A memory device includes a word line driver. The word line driver is coupled through word lines to an array of bit cells. The word line driver includes a first driving circuit, a second driving circuit and a modulating circuit. The first driving circuit and the second driving circuit are configured to select a word line. The modulating circuit is coupled through the selected word line to the first driving circuit and the second driving circuit, and is configured to modulate at least one signal transmitted through the selected word line. The first driving circuit and the second driving circuit are further configured to charge the selected word line to generate a first voltage signal and a second voltage signal at two positions of the selected word line. The first voltage signal is substantially the same as the second voltage signal. A method is also disclosed herein.
    Type: Application
    Filed: March 22, 2021
    Publication date: August 11, 2022
    Applicants: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., TSMC Nanjing Company Limited, TSMC China Company Limited
    Inventors: He-Zhou WAN, Xiu-Li YANG, Mu-Yang YE, Yan-Bo SONG
  • Publication number: 20220189971
    Abstract: A memory device includes a first isolation cell, a first memory array of a first memory segment, a second memory array of a second memory segment, a first decoder cell of the first memory segment and a second decoder cell of the second memory segment. The first isolation cell extends in a first direction. The first memory array of the first memory segment abuts a first boundary of the first isolation cell in a second direction different from the first direction. The second memory array of the second memory segment abuts a second boundary, opposite to the first boundary, of the first isolation cell in the second direction. The first decoder cell of the first memory segment and the second decoder cell of the second memory segment are arranged on opposite sides of the first isolation cell.
    Type: Application
    Filed: April 8, 2021
    Publication date: June 16, 2022
    Applicants: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., TSMC CHINA COMPANY LIMITED
    Inventors: Xiu-Li YANG, He-Zhou WAN, Yan-Bo SONG
  • Publication number: 20220029359
    Abstract: A terminal assembly and an electrical connector, the terminal assembly comprises a plurality of ground terminals, a plurality of signal terminals, and an insulating body. Each ground terminal comprises a ground terminal body, a ground pin, and a plurality of ground assembling pins. The plurality of signal terminals and the plurality of ground terminals are alternately arranged and disposed at intervals along a first direction. At least one signal terminal is disposed between two adjacent ground terminals. Each signal terminal comprises a signal terminal body, a signal pin, and a signal assembling pin. The insulating body is disposed on the plurality of ground terminal bodies and the plurality of signal terminal bodies. A plurality of first distances exist between the plurality of ground pins and the plurality of signal pins. A plurality of second distances exist between the plurality of ground assembling pins and the plurality of signal assembling pins.
    Type: Application
    Filed: July 15, 2021
    Publication date: January 27, 2022
    Applicant: Dongguan Luxshare Technologies Co., Ltd
    Inventor: Yan-Bo LIN
  • Publication number: 20220029358
    Abstract: A terminal assembly and an electrical connector, the terminal assembly comprises a plurality of ground terminals, a plurality of signal terminals, and an insulating body. Each ground terminal comprises a ground terminal body, a ground pin, and a plurality of ground assembling pins. The plurality of signal and ground terminals are alternately arranged and disposed at intervals along a first direction. At least one signal terminal is disposed between two adjacent ground terminals. Each signal terminal comprises a signal terminal body, a signal pin, and a signal assembling pin. The insulating body is disposed on the plurality of ground terminal bodies and the plurality of signal terminal bodies. A plurality of first distances exist between the plurality of ground pins and the plurality of signal pins. A plurality of second and third distances exist between the plurality of ground assembling pins and the plurality of signal assembling pins.
    Type: Application
    Filed: June 25, 2021
    Publication date: January 27, 2022
    Applicant: Dongguan Luxshare Technologies Co., Ltd
    Inventor: Yan-Bo LIN
  • Patent number: 10784630
    Abstract: A female connector and a transmission wafer are provided. The female connector includes a housing and a plurality of transmission wafers inserted into the housing. Each of the transmission wafers includes an insulating frame, a plurality of grounding terminals fixed to the insulating frame, and a first shielding member and a second shielding member respectively disposed on two opposite sides of the insulating frame. In each of the transmission wafers, the second shielding member is disposed on a front end portion of the insulating frame, and the first and second shielding members are electrically connected to the grounding terminals so as to be electrically connected to each other through the grounding terminals. The second shielding member of one of any two adjacent transmission wafers is abutted against and electrically connected to the first shielding member of the other one of the any two adjacent transmission wafers.
    Type: Grant
    Filed: September 12, 2019
    Date of Patent: September 22, 2020
    Assignee: TOPCONN ELECTRONIC (KUNSHAN) CO., LTD.
    Inventors: Chih-Wei Chen, Chung-Nan Pao, Yueh-Lin Yang, Yu-Hsiung Lin, Kai Wu, Yan-Bo Lin
  • Publication number: 20200287332
    Abstract: A female connector and a transmission wafer are provided. The female connector includes a housing and a plurality of transmission wafers inserted into the housing. Each of the transmission wafers includes an insulating frame, a plurality of grounding terminals fixed to the insulating frame, and a first shielding member and a second shielding member respectively disposed on two opposite sides of the insulating frame. In each of the transmission wafers, the second shielding member is disposed on a front end portion of the insulating frame, and the first and second shielding members are electrically connected to the grounding terminals so as to be electrically connected to each other through the grounding terminals. The second shielding member of one of any two adjacent transmission wafers is abutted against and electrically connected to the first shielding member of the other one of the any two adjacent transmission wafers.
    Type: Application
    Filed: September 12, 2019
    Publication date: September 10, 2020
    Inventors: CHIH-WEI CHEN, CHUNG-NAN PAO, YUEH-LIN YANG, YU-HSIUNG LIN, KAI WU, YAN-BO LIN
  • Patent number: 10535376
    Abstract: The present disclosure provides a hard disk assembly device for assembling a hard disk into a case. Two opposite sides of the hard disk respectively have at least one first positioning portion and at least one second positioning portion. The hard disk assembly device includes a flexible fixing frame and a fixing bracket. One side of the flexible fixing frame includes at least one third positioning portion and at least one first guiding portion, and the other side of the flexible fixing frame includes at least one fourth positioning portion, a draw tape, and two fastening portions. The two fastening portions are respectively correspondingly connected with two ends of the draw tape. The hard disk is fixed in the flexible fixing frame. The flexible fixing frame is fixed to the fixing bracket.
    Type: Grant
    Filed: May 21, 2019
    Date of Patent: January 14, 2020
    Assignees: Maintek Computer (Suzhou) Co., Ltd., Pegatron Corporation
    Inventors: Hui Bian, Yan-Bo An, Jing-Bo Wang, Chia-Cheng Tang, Xue-Bing Cheng
  • Publication number: 20200013433
    Abstract: The present disclosure provides a hard disk assembly device for assembling a hard disk into a case. Two opposite sides of the hard disk respectively have at least one first positioning portion and at least one second positioning portion. The hard disk assembly device includes a flexible fixing frame and a fixing bracket. One side of the flexible fixing frame includes at least one third positioning portion and at least one first guiding portion, and the other side of the flexible fixing frame includes at least one fourth positioning portion, a draw tape, and two fastening portions. The two fastening portions are respectively correspondingly connected with two ends of the draw tape. The hard disk is fixed in the flexible fixing frame. The flexible fixing frame is fixed to the fixing bracket.
    Type: Application
    Filed: May 21, 2019
    Publication date: January 9, 2020
    Applicants: Maintek Computer (Suzhou) Co., Ltd., PEGATRON CORPORATION
    Inventors: HUI BIAN, Yan-Bo An, Jing-Bo Wang, Chia-Cheng Tang, Xue-Bing Cheng
  • Patent number: 10520236
    Abstract: Stand-alone ice making appliances and methods of controlling stand-alone ice making appliances are provided. An appliance includes a container defining a first storage volume for receipt of ice, a water tank defining a second storage volume for receipt of water, and a pump in fluid communication with the second storage volume. The appliance further includes an ice maker which is in fluid communication with the pump for receiving water from the pump. The appliance further includes an off-time detector configured to provide a signal indicative of whether the ice maker has been unpowered for a time period sufficient to begin ice production without overheating.
    Type: Grant
    Filed: August 28, 2017
    Date of Patent: December 31, 2019
    Assignee: Haier US Appliance Solutions, Inc.
    Inventors: Ronald Scott Tarr, Yan Bo