Patents by Inventor Yan-Cen Liou

Yan-Cen Liou has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Chip-to-chip signal transmission system and signal reception circuit
    Patent number: 10422831
    Abstract: The present invention provides a chip-to-chip signal transmission system. Signal transmission is performed between a transmitter of a first chip and a receiver of a second chip through a transmission-metal-pad and a reception-metal-pad. When receiving a driving-testing signal, the transmitter transmits a transmission-testing-coupling signal through the transmission-metal-pad according to the driving-testing signal. A receiving-testing circuit on the first chip receives the transmission-testing-coupling signal through the transmission-testing-metal-pad, and outputs a transmission-testing signal according to the transmission-testing-coupling signal. When receiving the driving-testing signal, a driving-testing circuit on the second chip transmits a receiving-testing-coupling signal through a reception-testing-metal-pad according to the driving-testing signal.
    Type: Grant
    Filed: March 7, 2017
    Date of Patent: September 24, 2019
    Assignee: I-SHOU UNIVERSITY
    Inventors: Yu-Jung Huang, Yan-Cen Liou
  • CHIP-TO-CHIP SIGNAL TRANSMISSION SYSTEM AND SIGNAL RECEPTION CIRCUIT
    Publication number: 20180198538
    Abstract: The present invention provides a chip-to-chip signal transmission system. Signal transmission is performed between a transmitter of a first chip and a receiver of a second chip through a transmission-metal-pad and a reception-metal-pad. When receiving a driving-testing signal, the transmitter transmits a transmission-testing-coupling signal through the transmission-metal-pad according to the driving-testing signal. A receiving-testing circuit on the first chip receives the transmission-testing-coupling signal through the transmission-testing-metal-pad, and outputs a transmission-testing signal according to the transmission-testing-coupling signal. When receiving the driving-testing signal, a driving-testing circuit on the second chip transmits a receiving-testing-coupling signal through a reception-testing-metal-pad according to the driving-testing signal.
    Type: Application
    Filed: March 7, 2017
    Publication date: July 12, 2018
    Applicant: I-SHOU UNIVERSITY
    Inventors: Yu-Jung Huang, Yan-Cen Liou