Patents by Inventor Yan Cheong CHAN

Yan Cheong CHAN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • SENSING ARRANGEMENT, SENSOR AND APPARATUS COMPRISING SAME, AND METHOD OF MANUFACTURE THEREOF
    Publication number: 20140069795
    Abstract: The present invention is concerned with a sensing arrangement. The arrangement comprises a plurality of layers laminated together. The layers include sequentially a first layer of electrode, a second layer for insulation, a third layer made principally of polydimethylsiloxane (PDMS) and a fourth layer of electrode. The third layer is provided with an array of micro-structures configured in the form of hemispheres, with convex surface of the hemispheric micro-structures oriented towards the insulation layer.
    Type: Application
    Filed: September 11, 2012
    Publication date: March 13, 2014
    Applicant: CITY UNIVERSITY OF HONG KONG
    Inventors: Hai Zhong ZHANG, Qing Yuan TANG, Yan Cheong CHAN
  • METHOD FOR ATTACHING INTEGRATED CIRCUIT COMPONENT TO A SUBSTRATE
    Publication number: 20080108181
    Abstract: An integrated circuit component is attached to a substrate by dispensing a controlled amount of photo-activatable anisotropic conductive adhesive (ACA) at a desired location on the substrate, exposing the dispensed ACA to an electromagnetic radiation source to initiate a chemical reaction in the ACA, aligning the component with the substrate such that a bond pad on the component faces the dispensed ACA, bonding the component to the substrate under a low pressure loading, and heating the bonded component and substrate.
    Type: Application
    Filed: November 6, 2006
    Publication date: May 8, 2008
    Applicant: CITY UNIVERSITY OF HONG KONG
    Inventors: Yan Cheong CHAN, Sai Choo TAN