Patents by Inventor Yan-Chiuan Liou

Yan-Chiuan Liou has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230411231
    Abstract: A fan-out type packaging structure includes a strain adjustment layer, a plurality of chips, an encapsulation layer, a redistribution layer, and a plurality of solder balls. The strain adjustment layer is made of a polymer material and has at least 95% laser absorbance. The plurality of chips are partially embedded in the strain adjustment layer and are spaced apart from each other. The encapsulation layer surrounds the chips and is connected to the strain adjustment layer. The redistribution layer covers the encapsulation layer and the chips. The plurality of solder balls are disposed on the redistribution layer and are spaced apart from each other.
    Type: Application
    Filed: June 12, 2023
    Publication date: December 21, 2023
    Inventors: Chih-Lung YU, Pin-Sheng WANG, Yan-Chiuan LIOU, Yu-Chuan LIU, Yu-Chi LIN, Teng-Kuei CHEN
  • Patent number: 11795352
    Abstract: The present disclosure relates to a (meth)acrylate adhesive composition comprising a (meth)acrylated polymer, a crosslinking agent and a silane copolymer, wherein the silane copolymer comprises 70 to 95 weight parts of an acrylate monomer containing C1-C4 alkyl group and 5 to 30 weight parts of a silane represented by the following formula (I): X—R1—SiR23-a(OR3)a??(I) wherein the weight-average molecular weight of the silane copolymer is ranging from 40,000 to 150,000. The silane copolymer can enhance the initial adhesion strength, rework ability and weather resistance of the (meth)acrylate adhesive composition. Furthermore, the (meth)acrylate adhesive composition can be used in the flexible optical film with a good bending restoring property and adhesion.
    Type: Grant
    Filed: October 22, 2020
    Date of Patent: October 24, 2023
    Assignee: BenQ Materials Corporation
    Inventors: Wen-Chun Chen, Yan-Chiuan Liou, Pao-Hsun Wu, Yi-Ting Tseng, Chung-Han Lee
  • Publication number: 20210348040
    Abstract: The present disclosure relates to a (meth)acrylate adhesive composition comprising a (meth)acrylated polymer, a crosslinking agent and a silane copolymer, wherein the silane copolymer comprises 70 to 95 weight parts of an acrylate monomer containing C1-C4 alkyl group and 5 to 30 weight parts of a silane represented by the following formula (I): X—R1—SiR23-a(OR3)a??(I) wherein the weight-average molecular weight of the silane copolymer is ranging from 40,000 to 150,000. The silane copolymer can enhance the initial adhesion strength, rework ability and weather resistance of the (meth)acrylate adhesive composition. Furthermore, the (meth)acrylate adhesive composition can be used in the flexible optical film with a good bending restoring property and adhesion.
    Type: Application
    Filed: October 22, 2020
    Publication date: November 11, 2021
    Inventors: Wen-Chun Chen, Yan-Chiuan Liou, Pao-Hsun Wu, Yi-Ting Tseng, Chung-Han Lee