Patents by Inventor Yan Cing Lin

Yan Cing Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Apparatus and system for detecting wafer damage
    Patent number: 10325796
    Abstract: An apparatus includes a holder configured to carry one or more semiconductor wafers, an arm coupled with the holder, and a detector coupled with either the holder or the arm. The detector is configured to measure a change in weight of the one or more semiconductor wafers. The detector includes a strain gauge weight sensor, a piezoelectric sensor, or any other suitable sensor. The change in weight of the one or more semiconductor wafers is used to determine any possible presence of a broken or missing wafer.
    Type: Grant
    Filed: October 30, 2017
    Date of Patent: June 18, 2019
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Yi-Feng Chen, Yan Cing Lin, Chui-Ya Peng
  • APPARATUS AND SYSTEM FOR DETECTING WAFER DAMAGE
    Publication number: 20190131157
    Abstract: An apparatus includes a holder configured to carry one or more semiconductor wafers, an arm coupled with the holder, and a detector coupled with either the holder or the arm. The detector is configured to measure a change in weight of the one or more semiconductor wafers. The detector includes a strain gauge weight sensor, a piezoelectric sensor, or any other suitable sensor. The change in weight of the one or more semiconductor wafers is used to determine any possible presence of a broken or missing wafer.
    Type: Application
    Filed: October 30, 2017
    Publication date: May 2, 2019
    Inventors: Yen-Fong Chen, Yan Cing Lin, Chui-Ya Peng