Abstract: An application packaging device and method are provided. The method includes: an installation package of an application is unzipped; each piece of channel information is respectively extracted from multiple pieces of acquired channel information; and packaging is performed according to each piece of extracted channel information and the unzipped installation package respectively to generate multiple installation packages respectively corresponding to each piece of channel information. The present invention solves the problem that the process of multi-channel packaging of the installation package of the application is tedious, increases the efficiency of the multi-channel packaging, and improves the user experience.

Abstract: In an approach to fabricating a silicon on insulator wafer, one or more semiconductor device elements are implanted and one or more shallow trench isolations are formed on a top surface of a first semiconductor wafer. A first dielectric material layer is deposited over the top surface of the first semiconductor wafer, filling the shallow trench isolations. A dielectric material layer on a bottom surface of a second semiconductor wafer is bonded to a dielectric material layer on the top of the first semiconductor wafer and one or more semiconductor devices are formed on a top surface of the second semiconductor wafer. Then, one or more through silicon vias are created connecting the one or more semiconductor devices on the top surface of the second semiconductor wafer and the one or more semiconductor device elements on the top surface of the first semiconductor wafer.

Abstract: A combined housing for a power tool has an inner housing body and an outer layer body attached to the outside of the inner housing body. The combined housing has at least one vibration-suppressing area. The vibration-suppressing area is provided with a plurality of vibration-suppressing structure units and each vibration-suppressing structure unit has a unit channel formed by the inner housing body and a unit groove formed by the outer layer body and arranged on one end of the unit channel. The unit groove and the unit channel of each vibration-suppressing structure unit form a vibration-suppressing cavit, and the outer layer body serves as the outside of the outer housing.

Abstract: A method for repairing defective memory cells includes receiving an access command having an access address and an access operation. The access address includes a row address and a column address. The method further includes determining whether the row address and the column address are the same as a pre-recorded row address and column address of a defective memory cell. If the row and column addresses of the access address are the same as the respective row and column addresses of the defective memory cell, the method includes replacing the defective memory cell with a redundant memory cell, and executing the access operation using the redundant memory cell.

Abstract: A broadband through printed circuit board (PCB) for millimeter wave application and methods of manufacture are disclosed. The structure includes a multiple layered body and an opening in the multiple layered body. The structure further includes at least one signal via extending through the opening. The structure further includes ground vias extending through the opening and on opposing sides of the at least one signal via. The structure further includes a ground plate above and below the opening and electrically connected to the ground vias at respective ends. The structure further includes a microstrip signal via above and below the opening and electrically connected to the at least one signal via.

Abstract: Aspects of the invention provide for a Marchand balun structure and a related design method. In one embodiment, a marchand balun structure includes: a first trace for an unbalanced port on a first metal layer, the first trace comprising: an unbalanced line including a first width for a first half and a second width for a second half, wherein the second width can be different from the first width; a pair of traces for balanced ports on a second metal layer, the pair of traces comprising: a pair of balanced lines; and a ground plane on a third metal layer, the ground plane comprising: a pair of openings directly under the pair of traces for balanced ports, wherein a center of the unbalanced line of the first trace is offset from a center of the pair of balanced lines of the pair of traces.

Abstract: A method for repairing defective memory cells includes receiving an access command having an access address and an access operation. The access address includes a row address and a column address. The method further includes determining whether the row address and the column address are the same as a pre-recorded row address and column address of a defective memory cell. If the row and column addresses of the access address are the same as the respective row and column addresses of the defective memory cell, the method includes replacing the defective memory cell with a redundant memory cell, and executing the access operation using the redundant memory cell.

Abstract: Aspects of the invention provide for a Marchand balun structure and a related design method. In one embodiment, a marchand balun structure includes: a first trace for an unbalanced port on a first metal layer, the first trace comprising: an unbalanced line including a first width for a first half and a second width for a second half, wherein the second width can be different from the first width; a pair of traces for balanced ports on a second metal layer, the pair of traces comprising: a pair of balanced lines; and a ground plane on a third metal layer, the ground plane comprising: a pair of openings directly under the pair of traces for balanced ports, wherein a center of the unbalanced line of the first trace is offset from a center of the pair of balanced lines of the pair of traces.

Abstract: The present invention provides users with cloud-based high throughput computing system for integrative analyses of next generation sequencing genomic data, such that human cancer biomarkers and drug targets can be accurately and quickly identified. Advantageously, the present invention harness a comprehensive systematic analysis pipelines for all types of next generation sequencing genomic data, advanced genomic variants calling algorithms and modeling, variant data correlation and integration, and identification of cancer specific biomarkers and therapeutic targets. Thus, the present invention will aid users so that less of their time and efforts are required in order to obtain precisely the desired information for which they are analyzing.

Abstract: The present invention provides users with access to Internet-accessible databases via one portal of entry, such that queries need not be repeated multiple times in order to obtain needed information. Advantageously, the present invention will harness a systematic dynamic query profiler, document scoring, and display of retrieved documents via a knowledge-based system that facilitates user editing. Thus, the present invention will aid users so that less of their time and effort are required in order to obtain precisely the desired information for which they are searching.