Abstract: A method of manufacturing an integrated circuit (IC) chip is provided. The method includes the following steps. First, a substrate is provided. The substrate is divided into an internal region and an external region by a die seal ring region. A plurality of circuit units is then formed in the internal region on the substrate. Thereafter, a dielectric layer is formed over the substrate, interconnects are formed in the dielectric layer within the internal region, and a plurality of bonding pad structures is formed in the dielectric layer within the external region. Finally, a cutting process is performed along a plurality of scribed lines on the substrate to form a plurality of chips. The bonding pad structures are exposed at the sides of each chip.

Abstract: A semiconductor image sensor and a method for fabricating the same are described. The semiconductor image sensor includes a substrate having at least a photoactive region therein and an IR cutting layer over the photoactive region.