Patents by Inventor Yan-Hui JIAN

Yan-Hui JIAN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11772858
    Abstract: An airtight device includes a container and an airtight cover on the container, and the airtight cover includes a fixing bracket, a door, and a pressuring handle. The fixing bracket has a through hole and a guiding slot, and the through hole communicates with internal space of the container. The guiding slot has adjacent first and second top surfaces, and the second top surface is higher than the first top surface. The door selectively covers the through hole. The pressuring handle pivoted on the door has a first section, a second section, and a rotating axis between the first and second sections, and the first section rotates relative to the second section. The second section receives a force to drive the first section to move from below the second top surface to below the first top surface such that the rotating axis pressures the door.
    Type: Grant
    Filed: April 1, 2022
    Date of Patent: October 3, 2023
    Assignee: DELTA ELECTRONICS, INC.
    Inventors: Chia-Hsing Chen, Chiu-Chin Chang, Yan-Hui Jian, Chih-Jui Chen, Chen-Hsiu Lee, Hsuan-Ting Liu, Chin-Lung Liu, Kuan-Lung Wu, Li-Hsiu Chen, Wen-Yin Tsai
  • Publication number: 20230040488
    Abstract: An airtight device includes a container and an airtight cover on the container, and the airtight cover includes a fixing bracket, a door, and a pressuring handle. The fixing bracket has a through hole and a guiding slot, and the through hole communicates with internal space of the container. The guiding slot has adjacent first and second top surfaces, and the second top surface is higher than the first top surface. The door selectively covers the through hole. The pressuring handle pivoted on the door has a first section, a second section, and a rotating axis between the first and second sections, and the first section rotates relative to the second section. The second section receives a force to drive the first section to move from below the second top surface to below the first top surface such that the rotating axis pressures the door.
    Type: Application
    Filed: April 1, 2022
    Publication date: February 9, 2023
    Inventors: Chia-Hsing CHEN, Chiu-Chin CHANG, Yan-Hui JIAN, Chih-Jui CHEN, Chen-Hsiu LEE, Hsuan-Ting LIU, Chin-Lung LIU, Kuan-Lung WU, Li-Hsiu CHEN, Wen-Yin TSAI
  • Publication number: 20230027917
    Abstract: An immersion cooling system includes a cooling tank, a housing and a valve. The coolant tank is configured to accommodate a liquid coolant and an electronic device immersed in the liquid coolant. The housing covers a side of the cooling tank and thereby forms an enclosure. The valve has two ports, one of which communicates with the enclosure and the other communicates with a part of the cooling tank above the liquid coolant. The valve is configured to open in response to a gas pressure inside the cooling tank exceeding an upper limit.
    Type: Application
    Filed: May 30, 2022
    Publication date: January 26, 2023
    Inventors: Wei-Chih LIN, Ren-Chun CHANG, Yan-Hui JIAN, Chia-Hsing CHEN, Li-Hsiu CHEN, Wen-Yin TSAI
  • Publication number: 20230026658
    Abstract: An immersion cooling system includes a tank, a first condenser, an enclosure, a second condenser and a connecting pipe. The tank has a first space. The first space is configured to accommodate a cooling liquid for at least one electronic equipment to immerse therein. The first condenser is disposed inside the tank. The enclosure is disposed outside the tank. The enclosure forms a second space together with the tank. The second condenser is disposed in the second space. The connecting pipe includes a first end and a second end opposite to the first end. The first end is connected with the second condenser. The second end is communicated with the first space.
    Type: Application
    Filed: May 17, 2022
    Publication date: January 26, 2023
    Inventors: Chia-Yi LIN, Wei-Chih LIN, Ren-Chun CHANG, Yan-Hui JIAN, Hsuan-Ting LIU, Li-Hsiu CHEN, Wen-Yin TSAI
  • Publication number: 20230023554
    Abstract: An immersion cooling system includes a tank, an isolation plate and a condenser. The tank includes a base plate and a sidewall connected with the base plate. The sidewall defines with the base plate a space configured to accommodate a cooling liquid. The isolation plate connects with the sidewall or the base plate and divides the space into a first subsidiary space and a second subsidiary space. The first subsidiary space is configured to accommodate electronic equipment which is immersed in the cooling liquid. The isolation plate and the base plate are separated from each other. The sidewall surrounds the condenser. A vertical projection of the condenser towards the base plate at least partially overlaps with the second subsidiary space. The electronic equipment evaporates a portion of the cooling liquid to form a vapor. The condenser is configured to condense the vapor into a liquid form.
    Type: Application
    Filed: May 5, 2022
    Publication date: January 26, 2023
    Inventors: Yan-Hui JIAN, Chiu-Chin CHANG, Wei-Chih LIN, Ren-Chun CHANG, Chih-Hung TSAI, Li-Hsiu CHEN, Wen-Yin TSAI
  • Publication number: 20230022650
    Abstract: An immersion cooling system includes a cooling tank and a filtration system. The cooling tank is configured to accommodate a liquid coolant and an electronic device immersed in the liquid coolant. The filtration system includes a pipeline, a pump, a filter and a cooling device. The pipeline is in fluid communication with the cooling tank. The pump is disposed in the pipeline and is configured to drive the liquid coolant to flow through the pipeline. The filter is disposed in the pipeline and is configured to filter the liquid coolant. The cooling device is connected to the pipeline and is configured to cool the liquid coolant. The pipeline has an inlet connected to the cooling tank. The cooling device is located between the pump and the inlet of the pipeline.
    Type: Application
    Filed: June 5, 2022
    Publication date: January 26, 2023
    Inventors: Wei-Chih LIN, Ren-Chun CHANG, Yan-Hui JIAN, Wen-Yin TSAI, Li-Hsiu CHEN