Patents by Inventor Yan-Kun Su

Yan-Kun Su has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • LIGHT EMITTING DIODE PACKAGING STRUCTURE
    Publication number: 20100320490
    Abstract: A light emitting diode (LED) packaging structure includes a base, a transparent layer, and an LED chip. The transparent layer is provided between the LED chip and the base to increase a relative distance between the LED chip and the base. With an increased relative distance between the LED chip and the base and the light transmitting function of the transparent layer, the overall LED packaging structure can have enhanced light extraction efficiency. Further, the transparent layer provides good thermal conductivity and accordingly, forms no harm to the heat dissipation efficiency of the LED.
    Type: Application
    Filed: December 4, 2009
    Publication date: December 23, 2010
    Applicant: KUN SHAN UNIVERSITY
    Inventors: Chun-Liang Lin, Yan-Kun Su