Patents by Inventor Yan L. Feng

Yan L. Feng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Oxazolidone ring containing vinyl ester resin and products therefrom
    Patent number: 9045584
    Abstract: A process comprising contacting a) an epoxy resin; b) an adduct comprising at least one oxazolidone ring prepared from a multifunctional epoxy resin and an isocyanate compound; and c) an unsaturated acid to form a vinyl ester, is disclosed.
    Type: Grant
    Filed: July 30, 2012
    Date of Patent: June 2, 2015
    Assignee: Dow Global Technologies LLC
    Inventors: Joseph Gan, Patrick P. Yan, Yan L. Feng, Wayne Y. Zhang
  • OXAZOLIDONE RING CONTAINING VINYL ESTER RESIN AND PRODUCTS THEREFROM
    Publication number: 20140155558
    Abstract: A process comprising contacting a) an epoxy resin; b) an adduct comprising at least one oxazolidone ring prepared from a multifunctional epoxy resin and an isocyanate compound; and c) an unsaturated acid to form a vinyl ester, is disclosed.
    Type: Application
    Filed: August 1, 2011
    Publication date: June 5, 2014
    Applicant: DOW GLOBAL TECHNOLOGIES LLC
    Inventors: Joseph Gan, Patrick P. Yan, Yan L. Feng, Wayne Y. Zhang
  • OXAZOLIDONE RING CONTAINING VINYL ESTER RESIN AND PRODUCTS THEREFROM
    Publication number: 20140135457
    Abstract: A process comprising contacting a) an epoxy resin; b) an adduct comprising at least one oxazolidone ring prepared from a multifunctional epoxy resin and an isocyanate compound; and c) an unsaturated acid to form a vinyl ester, is disclosed.
    Type: Application
    Filed: July 30, 2012
    Publication date: May 15, 2014
    Applicant: Dow Global Techonologies LLC
    Inventors: Joseph Gan, Patrick P. Yan, Yan L. Feng, Wayne Y. Zhang
  • ADDUCTS AS TOUGHENERS IN THERMOSETTABLE EPOXY SYSTEMS
    Publication number: 20140121299
    Abstract: A liquid adduct consisting essentially of a reaction product of (a) an aliphatic epoxy resin, and (b) an isocyanate compound, wherein the viscosity of the adduct comprises less than about 60 Pa-s at about 25° C. is disclosed. The adduct can be used in an epoxy resin composition.
    Type: Application
    Filed: July 4, 2011
    Publication date: May 1, 2014
    Applicant: DOW GLOBAL TECHNOLOGIES LLC
    Inventors: Yan L. Feng, Joseph Gan, Wayne Y. Zhang, Patrick P. Yan